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quality General Purpose Zener Diode CBI BZT52B15 with Planar Die and 350mW Power Dissipation on Ceramic PCB factory
quality General Purpose Zener Diode CBI BZT52B15 with Planar Die and 350mW Power Dissipation on Ceramic PCB factory

General Purpose Zener Diode CBI BZT52B15 with Planar Die and 350mW Power Dissipation on Ceramic PCB

Key Attributes
Model Number: BZT52B15
Product Custom Attributes
Impedance(Zzt):
30Ω
Zener Voltage(Range):
14.7V~15.3V
Pd - Power Dissipation:
350mW
Zener Voltage(Nom):
15V
Impedance(Zzk):
200Ω
Mfr. Part #:
BZT52B15
Package:
SOD-123
Product Description

Product Overview

This series of Zener diodes features a planar die construction and a power dissipation of 350mW on a ceramic PCB. They are designed for general-purpose, medium current applications and are ideally suited for automated assembly processes. Lead-free versions are available.

Product Attributes

  • Construction: Planar Die
  • Power Dissipation: 350mW on Ceramic PCB
  • Application: General Purpose, Medium Current
  • Assembly Suitability: Ideally Suited for Automated Assembly Processes
  • Availability: Lead Free Version Available
  • Brand/Origin: Heyuan China Base Electronics Technology Co., Ltd.

Technical Specifications

Maximum Ratings (Ta=25C unless otherwise specified) Symbol Value Unit
Forward Voltage @ IF = 10mA (Note 2) VF 0.9 V
Power Dissipation (Note 1) Pd 350 mW
Thermal Resistance from Junction to Ambient RJA 357 C/W
Junction Temperature Tj 150 C
Storage Temperature Range Tstg -55 ~ +150 C
Type Number Type Code Zener Voltage Range (Note 2) IZT
(mA)		 ZZT@IZT
()		 IZK
(mA)		 IR
(A) @ VR		 Typical Temperature Coefficent
(mV/C) @ IZTC		 Nom(V) Min(V) Max(V) Min Max
BZT52B2V4 2WX 2.4 5 100 600 1.0 50 1.0 -3.5 0 5
BZT52B2V7 2W1 2.7 5 100 600 1.0 20 1.0 -3.5 0 5
BZT52B3V0 2W2 3.0 5 95 600 1.0 10 1.0 -3.5 0 5
BZT52B3V3 2W3 3.3 5 95 600 1.0 5 1.0 -3.5 0 5
BZT52B3V6 2W4 3.6 5 90 600 1.0 5 1.0 -3.5 0 5
BZT52B3V9 2W5 3.9 5 90 600 1.0 3 1.0 -3.5 0 5
BZT52B4V3 2W6 4.3 5 90 600 1.0 3 1.0 -3.5 0 5
BZT52B4V7 2W7 4.7 5 80 500 1.0 3 2.0 -3.5 0.2 5
BZT52B5V1 2W8 5.1 5 60 480 1.0 2 2.0 -2.7 1.2 5
BZT52B5V6 2W9 5.6 5 40 400 1.0 1 2.0 -2.0 2.5 5
BZT52B6V2 2WA 6.2 5 10 150 1.0 3 4.0 0.4 3.7 5
BZT52B6V8 2WB 6.8 5 15 80 1.0 2 4.0 1.2 4.5 5
BZT52B7V5 2WC 7.5 5 15 80 1.0 1 5.0 2.5 5.3 5
BZT52B8V2 2WD 8.2 5 15 80 1.0 0.7 5.0 3.2 6.2 5
BZT52B9V1 2WE 9.1 5 15 100 1.0 0.5 6.0 3.8 7.0 5
BZT52B10 2WF 10 5 20 150 1.0 0.2 7.0 4.5 8.0 5
BZT52B11 2WG 11 5 20 150 1.0 0.1 8.0 5.4 9.0 5
BZT52B12 2WH 12 5 25 150 1.0 0.1 8.0 6.0 10.0 5
BZT52B13 2WI 13 5 30 170 1.0 0.1 8.0 7.0 11.0 5
BZT52B15 2WJ 15 5 30 200 1.0 0.1 10.5 9.2 13.0 5
BZT52B16 2WK 16 5 40 200 1.0 0.1 11.2 10.4 14.0 5
BZT52B18 2WL 18 5 45 225 1.0 0.1 12.6 12.4 16.0 5
BZT52B20 2WM 20 5 55 225 1.0 0.1 14.0 14.4 18.0 5
BZT52B22 2WN 22 5 55 250 1.0 0.1 15.4 16.4 20.0 5
BZT52B24 2WO 24 5 70 250 1.0 0.1 16.8 18.4 22.0 5
BZT52B27 2WP 27 2 80 300 0.5 0.1 18.9 21.4 25.3 2
BZT52B30 2WQ 30 2 80 300 0.5 0.1 21.0 24.4 29.4 2
BZT52B33 2WR 33 2 80 325 0.5 0.1 23.1 27.4 33.4 2
BZT52B36 2WS 36 2 90 350 0.5 0.1 25.2 30.4 37.4 2
BZT52B39 2WT 39 2 130 350 0.5 0.1 27.3 33.4 41.2 2
BZT52B43 2WU 43 2 130 350 0.5 0.1 29.4 36.4 45.2 2
PACKAGE OUTLINE
Symbol Dimension in Millimeters Min Max
A 0.95 1.15
A1 0.01 0.100
B 1.55 1.65
bp 0.50 0.70
C 0.09 0.150
E 2.60 2.70
HE 3.45 3.85
Lp 0.20 0.45
0 5

Notes:

  • 1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm.
  • 2. Short duration test pulse used to minimize self-heating effect.
  • 3. f = 1kHz.

2410121341_CBI-BZT52B15_C21714226.pdf

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