Plastic Encapsulated Zener Diode CBI BZT52C2V4S with 200mW Power Dissipation and Ceramic PCB Mounting

Key Attributes
Model Number: BZT52C2V4S
Product Custom Attributes
Impedance(Zzt):
100Ω
Diode Configuration:
Independent
Zener Voltage(Range):
2.2V~2.6V
Pd - Power Dissipation:
200mW
Zener Voltage(Nom):
2.4V
Impedance(Zzk):
600Ω
Mfr. Part #:
BZT52C2V4S
Package:
SOD-323
Product Description

Product Overview

The BZT52C2V4S-BZT52C39S series are plastic-encapsulated Zener diodes designed for general-purpose, medium-current applications. Featuring a planar die construction and 200mW power dissipation on a ceramic PCB, these diodes are ideally suited for automated assembly processes. They are available in a lead-free version.

Product Attributes

  • Package Type: SOD-323
  • Construction: Planar die
  • Power Dissipation: 200mW on ceramic PCB
  • Availability: Lead-free version

Technical Specifications

Model Marking Nominal Zener Voltage (V) Min Zener Voltage (V) Max Zener Voltage (V) Test Current (mA) Max Zener Impedance () @ IZT Max Reverse Current (A) @ VR Forward Voltage (V) @ IF=10mA Power Dissipation (mW) Thermal Resistance (/W) RJA Junction Temperature () Tj Storage Temperature Range () Tstg
BZT52C2V4S WX 2.4 2.20 2.60 5 100 1.0 0.9 200 625 150 -55~+150
BZT52C2V7S W1 2.7 2.5 2.9 5 100 1.0 0.9 200 625 150 -55~+150
BZT52C3V0S W2 3.0 2.8 3.2 5 95 1.0 0.9 200 625 150 -55~+150
BZT52C3V3S W3 3.3 3.1 3.5 5 95 1.0 0.9 200 625 150 -55~+150
BZT52C3V6S W4 3.6 3.4 3.8 5 90 1.0 0.9 200 625 150 -55~+150
BZT52C3V9S W5 3.9 3.7 4.1 5 90 1.0 0.9 200 625 150 -55~+150
BZT52C4V3S W6 4.3 4.0 4.6 5 90 1.0 0.9 200 625 150 -55~+150
BZT52C4V7S W7 4.7 4.4 5.0 5 80 2.0 0.9 200 625 150 -55~+150
BZT52C5V1S W8 5.1 4.8 5.4 5 60 2.0 0.9 200 625 150 -55~+150
BZT52C5V6S W9 5.6 5.2 6.0 5 40 2.0 0.9 200 625 150 -55~+150
BZT52C6V2S WA 6.2 5.8 6.6 5 10 3.0 0.9 200 625 150 -55~+150
BZT52C6V8S WB 6.8 6.4 7.2 5 15 4.0 0.9 200 625 150 -55~+150
BZT52C7V5S WC 7.5 7.0 7.9 5 15 5.0 0.9 200 625 150 -55~+150
BZT52C8V2S WD 8.2 7.7 8.7 5 15 5.0 0.9 200 625 150 -55~+150
BZT52C9V1S WE 9.1 8.5 9.6 5 15 6.0 0.9 200 625 150 -55~+150
BZT52C10S WF 10 9.4 10.6 5 20 7.0 0.9 200 625 150 -55~+150
BZT52C11S WG 11 10.4 11.6 5 20 8.0 0.9 200 625 150 -55~+150
BZT52C12S WH 12 11.4 12.7 5 25 8.0 0.9 200 625 150 -55~+150
BZT52C13S WI 13 12.4 14.1 5 30 8.0 0.9 200 625 150 -55~+150
BZT52C15S WJ 15 13.8 15.6 5 30 10.5 0.9 200 625 150 -55~+150
BZT52C16S WK 16 15.3 17.1 5 40 11.2 0.9 200 625 150 -55~+150
BZT52C18S WL 18 16.8 19.1 5 45 12.6 0.9 200 625 150 -55~+150
BZT52C20S WM 20 18.8 21.2 5 55 14.0 0.9 200 625 150 -55~+150
BZT52C22S WN 22 20.8 23.3 5 55 15.4 0.9 200 625 150 -55~+150
BZT52C24S WO 24 22.8 25.6 5 70 16.8 0.9 200 625 150 -55~+150
BZT52C27S WP 27 25.1 28.9 2 80 18.9 0.9 200 625 150 -55~+150
BZT52C30S WQ 30 28.0 32.0 2 80 21.0 0.9 200 625 150 -55~+150
BZT52C33S WR 33 31.0 35.0 2 80 23.1 0.9 200 625 150 -55~+150
BZT52C36S WS 36 34.0 38.0 2 90 25.2 0.9 200 625 150 -55~+150
BZT52C39S WT 39 37.0 41.0 2 130 27.3 0.9 200 625 150 -55~+150

Notes:
1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm.
2. Short duration test pulse used to minimize self-heating effect.
3. f = 1kHz.


2410121326_CBI-BZT52C2V4S_C2886309.pdf

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