Printed circuit board diode ChipNobo ES2D with low reverse leakage and high surge current capabilities
Key Attributes
Model Number:
ES2D
Product Custom Attributes
Reverse Leakage Current (Ir):
5uA
Non-Repetitive Peak Forward Surge Current:
50A
Reverse Recovery Time (trr):
35ns
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - DC Reverse (Vr) (Max):
200V
Voltage - Forward(Vf@If):
1V@2A
Current - Rectified:
2A
Mfr. Part #:
ES2D
Package:
SMA
Product Description
Product Overview
The ES2D is a diode designed for printed circuit board applications, offering a glass-passivated junction chip for low reverse leakage and high forward surge current capability. It is ideal for residential and commercial equipment, featuring a molded plastic body with solder-plated terminals. This diode is suitable for high-temperature soldering and meets Underwriters Laboratory Flammability Classification 94V-0.
Product Attributes
- Brand: ChipNobo
- Package: DO-214AC/SMA
- Material: Molded plastic body, Solder plated terminals
- Flammability Classification: Underwriters Laboratory 94V-0
Technical Specifications
| Parameter | Symbol | Unit | Value | Notes |
|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | V | 55 to +150 | Single phase half-wave 60Hz, resistive or inductive load |
| Maximum RMS voltage | VRMS | V | 50.0 | |
| Maximum DC blocking voltage | VDC | V | 200 | |
| Maximum average forward rectified current at TL=100 C | I(AV) | A | 2.0 | For capacitive load current derate by 20%. |
| Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load | IFSM | A | 50.0 | |
| Maximum instantaneous forward voltage at 2.0A | VF | V | 1.0 | |
| Maximum DC reverse current at rated DC blocking voltage | IR | A | 5.0 | TA =25 C |
| Maximum DC reverse current at rated DC blocking voltage | IR | A | 0.0023 | TA=125 C |
| Typical junction capacitance | CJ | pF | 80.0 | Measured at 1MHz and applied reverse voltage of 4.0V D.C. (Note 2) |
| Typical thermal resistance | RqJA | C/W | 200 | |
| Operating junction and storage temperature range | TJ,TSTG | C | -55.0 to +150.0 | |
| Maximum reverse recovery time | Trr | ns | 35 | Reverse recovery time test condition: IF=0.5A, IR=1.0A, Irr=0.25A (Note 1) |
| Weight | ounce, grams | 0.07 | ||
| Soldering Temperature Guarantee | C/seconds | 250/10 | at terminals |
Dimensions
Dimensions in inches and (millimeters)
| Dimension | Inches | Millimeters |
|---|---|---|
| A | 0.177 - 0.208 | 4.50 - 5.30 |
| B | 0.067 - 0.094 | 1.70 - 2.40 |
| C | 0.051 - 0.060 | 1.30 - 1.52 |
| D | 0.153 - 0.188 | 3.90 - 4.80 |
| E | 0.030 MAX. | 0.76 MAX. |
| F | 0.006 - 0.012 | 0.152 - 0.305 |
| G | 0.098 - 0.110 | 2.50 - 2.80 |
| H | 0.078 MAX. | 2.00 MAX. |
Related Resources
For additional information, please visit our website http://www.chipnobo.com, or consult your nearest Chipnobo sales office for further assistance.
2507091655_ChipNobo-ES2D_C42459014.pdf
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