Surface mount Schottky rectifier FUXINSEMI SS510B with JEDEC DO-214AC package and solder plated terminals
Product Overview
The SS52B THRU SS520B A series are surface mount Schottky barrier rectifiers designed for applications requiring high forward surge current capability and high efficiency. These rectifiers feature a metal silicon junction with majority carrier conduction, resulting in low power loss. Built-in strain relief makes them ideal for automated placement. They are suitable for various surface-mounted applications and are compliant with RoHS 2.0. The JEDEC DO-214AC molded plastic body with solder plated terminals ensures reliability for high temperature soldering.
Product Attributes
- Package Type: JEDEC DO-214AC (SMB)
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Mounting Position: Any
- Flammability Classification: Underwriters Laboratory 94V-0
- Compliance: RoHS 2.0
- Conduction: Majority carrier conduction
- Soldering Capability: High temperature soldering guaranteed: 260 C/10 seconds at terminals
- Features: Built-in strain relief, ideal for automated placement, high forward surge current capability
Technical Specifications
| Symbol | Description | SS52B | SS53B | SS54B | SS55B | SS56B | SS58B | SS510B | SS515B | SS520B | Units |
|---|---|---|---|---|---|---|---|---|---|---|---|
| VRRM | Maximum repetitive peak reverse voltage | 20 | 30 | 40 | 50 | 60 | 80 | 100 | 150 | 200 | V |
| VRMS | Maximum RMS voltage | 14 | 21 | 28 | 35 | 42 | 56 | 70 | 105 | 140 | V |
| VDC | Maximum DC blocking voltage | 20 | 30 | 40 | 50 | 60 | 80 | 100 | 150 | 200 | V |
| I(AV) | Maximum average forward rectified current at TL (see fig.1) | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | 5.0 | A |
| IFSM | Peak forward surge current 8.3ms single half sine-wave | 150.0 | 150.0 | 150.0 | 150.0 | 150.0 | 150.0 | 150.0 | 150.0 | 150.0 | A |
| VF | Maximum instantaneous forward voltage at 5.0A | 0.55 | 0.55 | 0.55 | 0.70 | 0.70 | 0.85 | 0.85 | 0.95 | 0.95 | V |
| IR | Maximum DC reverse current TA=25C at rated DC blocking voltage | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | mA |
| IR | Maximum DC reverse current TA=100C at rated DC blocking voltage | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | 2.0 | mA |
| CJ | Typical junction capacitance (NOTE 1) | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | pF |
| RJA | Typical thermal resistance (NOTE 2) | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | C/W |
| TJ, TSTG | Operating junction temperature range / Storage temperature range | -55 to +150 | C | ||||||||
Dimensions
Package: SMB (DO-214AA)
| Dimension | Inches | (mm) |
|---|---|---|
| A | 0.183 - 0.160 | (4.65 - 4.05) |
| B | 0.155 - 0.130 | (3.94 - 3.30) |
| C | 0.078 (2.00) | (2.00) |
| D | 0.060 - 0.030 | (1.52 - 0.76) |
| E | 0.219 - 0.202 | (5.56 - 5.14) |
| F | 0.012 (0.305) max. | (0.305) |
| G | 0.008 (0.203) max. | (0.203) |
| H | 0.096 - 0.081 | (2.45 - 2.05) |
# Marking Codes
| Type Number | Marking Code |
|---|---|
| SS52B | SS52 |
| SS53B | SS53 |
| SS54B | SS54 |
| SS55B | SS55 |
| SS56B | SS56 |
| SS58B | SS58 |
| SS510B | SS510 |
| SS515B | SS515 |
| SS520B | SS520 |
Soldering Conditions
Reflow Soldering Profile:
- Average ramp-up rate (TL to TP): <3 C/sec
- Preheat: Temperature (Tsmin) 150C - (Tsmax) 200C, Time (ts) 60-120sec
- Ramp-up rate (Tsmax to TP): <3 C/sec
- Time maintained above: Temperature (TL) 217C, Time (tL) 60-260sec
- Peak Temperature (TP): 255C +0/-5C
- Time within 5C of actual Peak Temperature (tP): 10-30sec
- Ramp-down Rate: <6 C/sec
- Time 25C to Peak Temperature: <6 minutes
Storage Environment: Temperature = 5~40C, Humidity = 55%25%
2010151635_FUXINSEMI-SS510B_C842795.pdf
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