surface mount Schottky diode FUXINSEMI MBRS240LT3G-FS designed for optimized board space applications
Key Attributes
Model Number:
MBRS240LT3G-FS
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
50A
Voltage - DC Reverse (Vr) (Max):
40V
Operating Junction Temperature Range:
-55℃~+125℃
Voltage - Forward(Vf@If):
430mV@2.0A
Current - Rectified:
2A
Mfr. Part #:
MBRS240LT3G-FS
Package:
SMB(DO-214AA)
Product Description
Product Overview
The MBRS240LT3G-FS is a low profile, surface mount Schottky barrier rectifier designed for applications requiring optimized board space and high efficiency. Featuring batch process design for excellent power dissipation, it offers low power loss, high current capability, and a low forward voltage drop. This rectifier is ideal for high-speed switching applications and is protected by a guardring for overvoltage protection. It meets RoHS requirements and is halogen-free.
Product Attributes
- Brand: Fuxin (implied by www.fuxinsemi.com)
- Certifications: RoHS compliant, Halogen-free
- Material: Epoxy UL94-V0 rated flame retardant
- Case: Molded plastic, DO-214AA / SMB
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Indicated by cathode band
- Mounting Position: Any
Technical Specifications
| Parameter | Symbol | MBRS240LT3G-FS | Units | Notes |
|---|---|---|---|---|
| Maximum Ratings (AT TA=25C unless otherwise noted) | ||||
| Maximum repetitive peak reverse voltage | VRRM | 40 | Volts | |
| Maximum RMS voltage | VRMS | 28 | Volts | |
| Maximum continuous reverse voltage | VR | 40 | Volts | |
| Maximum average forward rectified current | IO | 2.0 | A | |
| Non-repetitive peak forward surge current | IFSM | 50 | A | 8.3ms single half sine-wave |
| Typical diode junction capacitance | CJ | 160 | pF | 1 |
| Operating junction temperature range | TJ | -55 to +125 | C | |
| Storage temperature range | TSTG | -65 to +150 | C | |
| Electrical Characteristics (AT TA=25C unless otherwise noted) | ||||
| Maximum instantaneous forward voltage at IF=2.0A | VF | 0.43 | Volts | |
| Maximum reverse leakage current | IR | 1.0 | mA | TJ=25C at rated VR |
| 50 | mA | TJ=100C | ||
| Thermal Characteristics | ||||
| Typical thermal resistance junction to ambient | RJA | 78 | C / W | 2 |
| Typical thermal resistance junction to case | RJC | 18 | C / W | 2 |
| Notes | ||||
| 1: Measured at 1 MHz and applied reverse voltage of 4.0 VDC | ||||
| 2: Mounted on FR-4 PCB copper, minimum recommended pad layout | ||||
Dimensions (SMB/DO-214AA):
- Body: 0.183(4.65) x 0.160(4.05) inches (mm)
- Height: 0.086(2.20) x 0.071(1.80) inches (mm)
- Lead Width: 0.060(1.52) x 0.030(0.76) inches (mm)
- Overall Length: 0.219(5.56) x 0.202(5.14) inches (mm)
- Lead Length: 0.012(0.305) x 0.006(0.152) inches (mm)
- Pad Width: 0.008(0.203)MAX. inches (mm)
- Pad Length: 0.096(2.45) x 0.081(2.05) inches (mm)
Marking:
- Type Number: MBRS240LT3G-FS
- Marking Code: 2BL4
Soldering Conditions:
Reflow soldering:
- Preheat - Temperature Min(Tsmin): 150C
- Preheat - Temperature Max(Tsmax): 200C
- Preheat - Time(tSmin to tSmax): 60~120 sec
- Ramp-up Rate (<3C/sec)
- Time maintained above: Temperature(TL): 217C
- Time maintained above: Time(tL): 60~260 sec
- Peak Temperature(TP): 255C (+0/-5C)
- Time within 5C of actual Peak Temperature(tP): 10~30 sec
- Ramp-down Rate (<6C/sec)
- Time 25C to Peak Temperature (<6 minutes)
Storage Environment: Temperature=5~40C, Humidity=55%25%
2512291555_FUXINSEMI-MBRS240LT3G-FS_C22438932.pdf
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