Thermal profile guidelines and soldering conditions for FUXINSEMI MURS120B electronic components
Key Attributes
Model Number:
MURS120B
Product Custom Attributes
Reverse Leakage Current (Ir):
5uA
Reverse Recovery Time (trr):
25ns
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - DC Reverse (Vr) (Max):
200V
Voltage - Forward(Vf@If):
875mV@1A
Current - Rectified:
1A
Mfr. Part #:
MURS120B
Package:
SMB(DO-214AA)
Product Description
Product Overview
This document outlines the soldering conditions and thermal profiles for surface-mount devices from Fuxin Semiconductor (Ver2.1). It details recommended parameters for reflow soldering and storage environments to ensure optimal performance and reliability. The information is critical for manufacturers and engineers involved in the assembly of electronic components.
Product Attributes
- Brand: Fuxin Semiconductor
- Version: Ver2.1
- Website: www.fuxinsemi.com
Technical Specifications
| Soldering Condition | Parameter | Value | |
|---|---|---|---|
| Storage environment | Temperature | Min | 5 °C |
| Temperature | Max | 40 °C | |
| Humidity | 55% ± 25% | ||
| Reflow soldering (Suggested thermal profiles) | Average ramp-up rate (Tsmin to Tsmax) | <3 °C/sec | |
| Preheat Temperature | Min (Tsmin) | 150 °C | |
| Preheat Temperature | Max (Tsmax) | 200 °C | |
| Preheat Time | (tsmin to tsmax) | 60~120 sec | |
| Ramp-up Rate (Tsmax to TL) | <3 °C/sec | ||
| Time maintained above | Temperature (TL) | 217 °C | |
| Time maintained above | Time (tL) | 60~260 sec | |
| Peak Temperature (TP) | Peak Temperature | 255 °C | |
| Time within 5 °C of actual Peak Temperature (tP) | 10~30 sec | ||
| Ramp-down Rate | <6 °C/sec | ||
| Time (25 °C to Peak Temperature) | <6 minutes | ||
2508261745_FUXINSEMI-MURS120B_C20420583.pdf
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