Surface Mount Rectifier FUXINSEMI S1MD3 JEDEC SOD323 Package Low Leakage Current High Surge Current

Key Attributes
Model Number: S1MD3
Product Custom Attributes
Reverse Leakage Current (Ir):
5uA@1kV
Diode Configuration:
Independent
Voltage - DC Reverse (Vr) (Max):
1kV
Voltage - Forward(Vf@If):
1.1V@1A
Current - Rectified:
1A
Mfr. Part #:
S1MD3
Package:
SOD-323
Product Description

Product Overview

The S1AD3 thru S1MD3 series are 1.0A surface mount general-purpose rectifiers designed for a voltage range of 50V to 1000V. These rectifiers feature a JEDEC SOD-323 molded plastic body with solder-plated terminals, suitable for automated placement due to their built-in strain relief. They offer low reverse leakage, high forward surge current capability, and are ideal for surface-mounted applications. The glass-passivated chip junction ensures reliability, and they are capable of high-temperature soldering.

Product Attributes

  • Brand: Fuxin (implied by www.fuxinsemi.com)
  • Case: JEDEC SOD-323 molded plastic body
  • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
  • Polarity: Color band denotes cathode end
  • Mounting Position: Any
  • Flammability Classification: Underwriters Laboratory 94V-0
  • Chip Junction: Glass passivated

Technical Specifications

Model VRRM (V) VRMS (V) VDC (V) I(AV) @ TL=110C (A) IFSM @ 8.3ms (A) VF @ 1.0A (V) IR @ Rated VDC (A) CJ @ 4V, 1MHz (pF) RJA (C/W) TJ, TSTG (C)
S1AD3 50 35 50 1.0 15.0 1.1 5.0 (TA=25C) / 50.0 (TA=100C) 5.0 55.0 -55 to +150
S1BD3 100 70 100 1.0 15.0 1.1 5.0 (TA=25C) / 50.0 (TA=100C) 5.0 55.0 -55 to +150
S1DD3 200 140 200 1.0 15.0 1.1 5.0 (TA=25C) / 50.0 (TA=100C) 5.0 55.0 -55 to +150
S1GD3 400 280 400 1.0 15.0 1.1 5.0 (TA=25C) / 50.0 (TA=100C) 5.0 55.0 -55 to +150
S1JD3 600 420 600 1.0 15.0 1.1 5.0 (TA=25C) / 50.0 (TA=100C) 5.0 55.0 -55 to +150
S1KD3 800 560 800 1.0 15.0 1.1 5.0 (TA=25C) / 50.0 (TA=100C) 5.0 55.0 -55 to +150
S1MD3 1000 700 1000 1.0 15.0 1.1 5.0 (TA=25C) / 50.0 (TA=100C) 5.0 55.0 -55 to +150
Dimensions (inches/mm) Value
Length (0.071-0.063 / 1.80-1.40) (1.80-1.40)
Width (0.047-0.016 / 1.20-0.40) (1.20-0.40)
Height (0.039-0.031 / 1.00-0.80) (1.00-0.80)
Terminal Projection (0.010-0.008 / 0.25-0.20) (0.25-0.20)
Base Width (0.108-0.096 / 2.75-2.45) (2.75-2.45)
Lead Thickness (0.003-0.008 / 0.08-0.20) (0.08-0.20)
Marking Code Type Number
1A S1AD3
2A S1BD3
3A S1DD3
4A S1GD3
5A S1JD3
6A S1KD3
7A S1MD3
Packaging Reel Size Component Spacing (m/m) Reel Diameter (m/m) Carton Size (m/m) Pieces per Reel Pieces per Carton
SOD-323 7" 4.0 178 382*262*387 3,000 30,000
Soldering Condition Parameter Value
Reflow soldering Preheat Tsmin 150C
Preheat Tsmax 200C
Preheat time (tS) 60~120sec
Time maintained above TL (TL=217C) (tL) 60~260sec
Peak Temperature (TP) 255C (max)
Time within 5C of actual peak temperature (tP) 10~30sec
General Ramp-up Rate (Tsmax to TP) <3C/sec
Ramp-down Rate <6C/sec

2504101957_FUXINSEMI-S1MD3_C908223.pdf

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