Surface Mount Rectifier FUXINSEMI S1MD3 JEDEC SOD323 Package Low Leakage Current High Surge Current
Product Overview
The S1AD3 thru S1MD3 series are 1.0A surface mount general-purpose rectifiers designed for a voltage range of 50V to 1000V. These rectifiers feature a JEDEC SOD-323 molded plastic body with solder-plated terminals, suitable for automated placement due to their built-in strain relief. They offer low reverse leakage, high forward surge current capability, and are ideal for surface-mounted applications. The glass-passivated chip junction ensures reliability, and they are capable of high-temperature soldering.
Product Attributes
- Brand: Fuxin (implied by www.fuxinsemi.com)
- Case: JEDEC SOD-323 molded plastic body
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Mounting Position: Any
- Flammability Classification: Underwriters Laboratory 94V-0
- Chip Junction: Glass passivated
Technical Specifications
| Model | VRRM (V) | VRMS (V) | VDC (V) | I(AV) @ TL=110C (A) | IFSM @ 8.3ms (A) | VF @ 1.0A (V) | IR @ Rated VDC (A) | CJ @ 4V, 1MHz (pF) | RJA (C/W) | TJ, TSTG (C) |
|---|---|---|---|---|---|---|---|---|---|---|
| S1AD3 | 50 | 35 | 50 | 1.0 | 15.0 | 1.1 | 5.0 (TA=25C) / 50.0 (TA=100C) | 5.0 | 55.0 | -55 to +150 |
| S1BD3 | 100 | 70 | 100 | 1.0 | 15.0 | 1.1 | 5.0 (TA=25C) / 50.0 (TA=100C) | 5.0 | 55.0 | -55 to +150 |
| S1DD3 | 200 | 140 | 200 | 1.0 | 15.0 | 1.1 | 5.0 (TA=25C) / 50.0 (TA=100C) | 5.0 | 55.0 | -55 to +150 |
| S1GD3 | 400 | 280 | 400 | 1.0 | 15.0 | 1.1 | 5.0 (TA=25C) / 50.0 (TA=100C) | 5.0 | 55.0 | -55 to +150 |
| S1JD3 | 600 | 420 | 600 | 1.0 | 15.0 | 1.1 | 5.0 (TA=25C) / 50.0 (TA=100C) | 5.0 | 55.0 | -55 to +150 |
| S1KD3 | 800 | 560 | 800 | 1.0 | 15.0 | 1.1 | 5.0 (TA=25C) / 50.0 (TA=100C) | 5.0 | 55.0 | -55 to +150 |
| S1MD3 | 1000 | 700 | 1000 | 1.0 | 15.0 | 1.1 | 5.0 (TA=25C) / 50.0 (TA=100C) | 5.0 | 55.0 | -55 to +150 |
| Dimensions (inches/mm) | Value |
|---|---|
| Length (0.071-0.063 / 1.80-1.40) | (1.80-1.40) |
| Width (0.047-0.016 / 1.20-0.40) | (1.20-0.40) |
| Height (0.039-0.031 / 1.00-0.80) | (1.00-0.80) |
| Terminal Projection (0.010-0.008 / 0.25-0.20) | (0.25-0.20) |
| Base Width (0.108-0.096 / 2.75-2.45) | (2.75-2.45) |
| Lead Thickness (0.003-0.008 / 0.08-0.20) | (0.08-0.20) |
| Marking Code | Type Number |
|---|---|
| 1A | S1AD3 |
| 2A | S1BD3 |
| 3A | S1DD3 |
| 4A | S1GD3 |
| 5A | S1JD3 |
| 6A | S1KD3 |
| 7A | S1MD3 |
| Packaging | Reel Size | Component Spacing (m/m) | Reel Diameter (m/m) | Carton Size (m/m) | Pieces per Reel | Pieces per Carton |
|---|---|---|---|---|---|---|
| SOD-323 | 7" | 4.0 | 178 | 382*262*387 | 3,000 | 30,000 |
| Soldering Condition | Parameter | Value |
|---|---|---|
| Reflow soldering | Preheat Tsmin | 150C |
| Preheat Tsmax | 200C | |
| Preheat time (tS) | 60~120sec | |
| Time maintained above TL (TL=217C) (tL) | 60~260sec | |
| Peak Temperature (TP) | 255C (max) | |
| Time within 5C of actual peak temperature (tP) | 10~30sec | |
| General | Ramp-up Rate (Tsmax to TP) | <3C/sec |
| Ramp-down Rate | <6C/sec |
2504101957_FUXINSEMI-S1MD3_C908223.pdf
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