Compact molded plastic diode MSKSEMI DB104S with high temperature tolerance and 1 amp forward current
Product Overview
The MSKSEMI DB101S-DB107S series are ideal for printed circuit board applications, offering reliable, low-cost construction using a molded plastic technique. These diodes are designed for high-temperature soldering (260C/10 seconds at 5 lbs. tension), feature a small size for simple installation, and possess high surge current capability.
Product Attributes
- Brand: MSKSEMI
- Construction: Molded plastic
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Mounting Position: Any
- Weight: 0.02 ounce, 0.4 grams
Technical Specifications
| Parameter | SYMBOLS | DB101S | DB102S | DB103S | DB104S | DB105S | DB106S | DB107S | UNITS |
| Maximum repetitive peak reverse voltage | RRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| Maximum RMS voltage | VRMS | 35 | 70 | 140 | 280 | 420 | 560 | 700 | V |
| Maximum DC blocking voltage | VDC | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| Maximum average forward rectified current at TC=40C | IF(AV) | 1.0 | A | ||||||
| Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) | IFSM | 50 | A | ||||||
| Maximum instantaneous forward voltage drop per leg at 1A | VF | 1.1 | V | ||||||
| Maximum DC reverse current at rated DC blocking voltage TA=25C | IR | 10 | A | ||||||
| Maximum DC reverse current at rated DC blocking voltage TA=100C | IR | 500 | A | ||||||
| Operating temperature range | TJ | -55 to +150 | C | ||||||
| Storage temperature range | TSTG | -55 to +150 | C | ||||||
2209161700_MSKSEMI-DB104S_C5174635.pdf
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