Schottky Barrier Rectifier Powermite 1 Package Featuring MICROCHIP UPS5817E3TR7 for Power Supplies
Product Overview
The UPS5817e3 is a Schottky Barrier Rectifier assembled in a Powermite 1 package. This package offers a low profile, efficient heat path with an integral locking bottom metal tab, and low thermal resistance. It is suitable for use in switching and regulating power supplies, as well as charge pump circuits. The full metallic bottom eliminates solder flux entrapment, and the locking tab provides an efficient heat path from the die to the mounting plane for external heat sinking.
Product Attributes
- Brand: Microsemi
- Package: Powermite 1 (DO-216AA)
- Certifications: RoHS compliant (Electrode finish: Matte Sn plating)
- Material: Epoxy case (meets UL94V-0)
- Origin: Macau SAR (Commercial Offshore de Macau Limitada)
Technical Specifications
| Parameter | Value | Unit | Conditions |
| Peak Repetitive Reverse Voltage (VRRM) | 20 | V | |
| Working Peak Reverse Voltage (VRWM) | 20 | V | |
| DC Blocking Voltage (VR) | 20 | V | |
| RMS Reverse Voltage (VR(RMS)) | 14 | V | |
| Average Rectified Forward Output Current (IO) | 1.0 | A | TC = 135C |
| Peak Repetitive Forward Current (IFRM) | 2.0 | A | 100kHz square wave, TC = 135C |
| Non Repetitive Peak Forward Surge Current (IFSM) | 50 | A | 8.3ms single half sine wave |
| Voltage Rate of Change (dV/dt) | 10000 | V/s | at max VR |
| Storage Temperature (TSTG) | -55 to +150 | C | |
| Junction Temperature (TJ) | -55 to +150 | C | |
| Junction to Case (Bottom) Thermal Resistance (RJC) | 15 | C/W | |
| Junction to Ambient Thermal Resistance (RJA) | 240 | C/W | Mounted on FR-4 PC board using 1oz copper with recommended minimum footprint |
| Maximum Forward Voltage (VF) | 0.45 | V | TJ = 25C, IF = 1.0 A |
| Maximum Instantaneous Reverse Current (IR) | 1.0 | mA | TJ = 25C, VR = 20V |
| Junction Capacitance (CT) | 105 | pF | VR = 5V, f = 1MHz |
2411272108_MICROCHIP-UPS5817E3-TR7_C3757270.pdf
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