General Purpose Surface Mount Silicon Rectifier BLUE ROCKET S2MW with Glass Passivated Chip Junction
Product Overview
The S2AW~S2MW series are surface mount general-purpose silicon rectifiers designed for a wide range of applications. These rectifiers feature a glass-passivated chip junction and are available with reverse voltages from 50V to 1000V and a forward current of 2.0A. They come in a thin SOD-123FL package, are lead-free and comply with EU RoHS 2011/65/EU directives, and are halogen-free products. Suitable for general-purpose applications requiring surface mounting.
Product Attributes
- Certifications: EU RoHS 2011/65/EU compliant
- Material: Glass Passivated Chip Junction
- Environmental: Halogen free product
- Mounting Type: Surface mounted applications
Technical Specifications
| Parameter | Symbol | S2AW | S2BW | S2DW | S2GW | S2JW | S2KW | S2MW | Unit |
|---|---|---|---|---|---|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage | VRRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| Maximum RMS voltage | VRMS | 35 | 70 | 140 | 280 | 420 | 560 | 700 | V |
| Maximum DC Blocking Voltage | VDC | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| Maximum Average Forward Rectified Current at Ta= 65 | IFAV | 2.0 | A | ||||||
| Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) | IFSM | 50 | A | ||||||
| Typical Junction Capacitance at VR=4V, f=1MHz | Cj | 30 | pF | ||||||
| Typical Thermal Resistance 1) | RJA | 90 | /W | ||||||
| Operating and Storage Temperature Range | Tj,Tstg | -55~+150 | |||||||
| Maximum Forward Voltage (IF=2.0A) | VF | 1.1 | V | ||||||
| Maximum DC Reverse Current at Maximum DC Blocking Voltage (Ta=25) | IR | 5.0 | A | ||||||
| Maximum DC Reverse Current at Maximum DC Blocking Voltage (Ta=125) | IR | 50 | A | ||||||
Note: 1) P.C.B. mounted with 0.2 X 0.2" (5 X 5 mm) copper pad areas.
Marking Instructions:
- Product Type Code: 2A1
- Lot No. Code: **** (The 1st * means: YM Code, The last 3 * means: little Lot No Code)
Temperature Profile for IR Reflow Soldering (Pb-Free):
- Preheating: 25~150, Time: 60~90sec.
- Peak Temp.: 2455, Duration: 50.5sec.
- Cooling Speed: 2~10/sec.
Resistance to Soldering Heat Test Conditions:
- Temp.: 2605, Time: 101 sec.
Packaging SPEC:
| Package Type | Dimension | Units/Reel | Reels/Inner Box | Units/Inner Box | Inner Boxes/Outer Box | Units/Outer Box |
|---|---|---|---|---|---|---|
| SOD-123FL | 711 | 3000 | 8 | 24000 | 5 | 120000 |
Inner Box Dimensions: 185X180X105 mm
Outer Box Dimensions: 390X385X205 mm
2410121231_BLUE-ROCKET-S2MW_C2900725.pdf
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