Lead Free Zener Diode CBI BZT52B22 with Plastic Encapsulate SOD123 and 350mW Power Dissipation Rating

Key Attributes
Model Number: BZT52B22
Product Custom Attributes
Impedance(Zzt):
55Ω
Zener Voltage(Range):
21.56V~22.44V
Pd - Power Dissipation:
350mW
Zener Voltage(Nom):
22V
Impedance(Zzk):
250Ω
Mfr. Part #:
BZT52B22
Package:
SOD-123
Product Description

Product Overview

This Zener Diode series features a planar die construction and 350mW power dissipation on a ceramic PCB, making it suitable for general-purpose, medium current applications. Ideally suited for automated assembly processes, these diodes are available in lead-free versions. They are designed for reliable performance in various electronic circuits.

Product Attributes

  • Brand: Heyuan China Base Electronics Technology Co., Ltd.
  • Construction: Planar Die
  • Packaging: Plastic Encapsulate Diodes (SOD-123)
  • Availability: Lead Free Version

Technical Specifications

Type Number Type Code Zener Voltage Range (Note 2) Nom(V) Zener Voltage Range (Note 2) Min(V) Zener Voltage Range (Note 2) Max(V) IZT @ IZT (mA) ZZT @ IZT () ZZK @ IZK () IR @ VR (A) Typical Temperature Coefficent @IZTC (mV/C) Forward Voltage (Note 2) @ IF = 10mA (V) Power Dissipation (Note 1) (mW)
BZT52B2V4 2WX 2.4 2.35 2.45 5 100 600 1.0 -3.5 0.9 350
BZT52B2V7 2W1 2.7 2.65 2.75 5 100 600 1.0 -3.5 0.9 350
BZT52B3V0 2W2 3.0 2.94 3.06 5 95 600 1.0 -3.5 0.9 350
BZT52B3V3 2W3 3.3 3.23 3.37 5 95 600 1.0 -3.5 0.9 350
BZT52B3V6 2W4 3.6 3.53 3.67 5 90 600 1.0 -3.5 0.9 350
BZT52B3V9 2W5 3.9 3.82 3.98 5 90 600 1.0 -3.5 0.9 350
BZT52B4V3 2W6 4.3 4.21 4.39 5 90 600 1.0 -3.5 0.9 350
BZT52B4V7 2W7 4.7 4.61 4.79 5 80 500 2.0 -3.5 0.9 350
BZT52B5V1 2W8 5.1 5.00 5.20 5 60 480 2.0 -2.7 0.9 350
BZT52B5V6 2W9 5.6 5.49 5.71 5 40 400 1.0 -2.0 0.9 350
BZT52B6V2 2WA 6.2 6.08 6.32 5 10 150 3.0 0.4 0.9 350
BZT52B6V8 2WB 6.8 6.66 6.94 5 15 80 2.0 1.2 0.9 350
BZT52B7V5 2WC 7.5 7.35 7.65 5 15 80 1.0 2.5 0.9 350
BZT52B8V2 2WD 8.2 8.04 8.36 5 15 80 0.7 3.2 0.9 350
BZT52B9V1 2WE 9.1 8.92 9.28 5 15 100 0.5 3.8 0.9 350
BZT52B10 2WF 10 9.80 10.20 5 20 150 0.2 4.5 0.9 350
BZT52B11 2WG 11 10.78 11.22 5 20 150 0.1 5.4 0.9 350
BZT52B12 2WH 12 11.76 12.24 5 25 150 0.1 6.0 0.9 350
BZT52B13 2WI 13 12.74 13.26 5 30 1170 0.1 7.0 0.9 350
BZT52B15 2WJ 15 14.70 15.30 5 30 200 0.1 9.2 0.9 350
BZT52B16 2WK 16 15.68 16.32 5 40 200 0.1 10.4 0.9 350
BZT52B18 2WL 18 17.64 18.36 5 45 225 0.1 12.4 0.9 350
BZT52B20 2WM 20 19.60 20.40 5 55 225 0.1 14.4 0.9 350
BZT52B22 2WN 22 21.56 22.44 5 55 250 0.1 16.4 0.9 350
BZT52B24 2WO 24 23.52 24.48 5 70 250 0.1 18.4 0.9 350
BZT52B27 2WP 27 26.46 27.54 2 80 300 0.5 21.4 0.9 350
BZT52B30 2WQ 30 29.40 30.60 2 80 300 0.5 24.4 0.9 350
BZT52B33 2WR 33 32.34 33.66 2 80 325 0.5 27.4 0.9 350
BZT52B36 2WS 36 35.28 36.72 2 90 350 0.5 30.4 0.9 350
BZT52B39 2WT 39 38.22 39.78 2 130 350 0.5 33.4 0.9 350
BZT52B43 2WU 43 41.16 42.84 2 130 350 0.5 36.4 0.9 350

Package Outline (SOD-123)

Symbol Dimension in Millimeters (Min) Dimension in Millimeters (Max)
A 0.95 1.15
A1 0.01 0.100
B 1.55 1.65
bp 0.50 0.70
C 0.09 0.150
E 2.60 2.70
HE 3.45 3.85
Lp 0.20 0.45
0 5

Maximum Ratings (Ta=25C unless otherwise specified)

Characteristic Symbol Value Unit
Forward Voltage (Note 2) @ IF = 10mA VF 0.9 V
Power Dissipation (Note 1) Pd 350 mW
Thermal Resistance from Junction to Ambient RJA 357 /W
Junction Temperature Tj 150
Storage Temperature Range Tstg -55 ~ +150

Notes:

  1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm.
  2. Short duration test pulse used to minimize self-heating effect.
  3. f = 1kHz.

2410121341_CBI-BZT52B22_C21714230.pdf

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