High forward surge current chip rectifier ChipNobo US1M-E3/61T-CN suitable for printed circuit boards
Product Overview
This product is a glass passivated junction chip rectifier designed for printed circuit boards. It features low reverse leakage, high forward surge current capability, and high temperature soldering. The plastic package carries an Underwriters Laboratory Flammability Classification 94V-0. It is ideal for printed circuit board applications and designed for use with residential and commercial equipment.
Product Attributes
- Brand: ChipNobo
- Package Type: DO-214AC/SMA
- Flammability Classification: Underwriters Laboratory 94V-0
- Material: Molded plastic body, Solder plated terminals
- Certifications: Solderable per MIL-STD-750, Method 2026
Technical Specifications
| Symbol | Unit | Description | Value |
|---|---|---|---|
| VRRM | V | Maximum repetitive peak reverse voltage | 55 to +150 |
| VRMS | V | Maximum RMS voltage | 100 |
| VDC | V | Maximum DC blocking voltage | 100 |
| I(AV) | A | Maximum average forward rectified current at TL=100 C (Single phase half-wave 60Hz, resistive or inductive load) | 1.0 |
| IFSM | A | Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load | 30.0 |
| VF | V | Maximum instantaneous forward voltage at 1.0A | 1.0 |
| IR | A | Maximum DC reverse current at rated DC blocking voltage | 0.0023 (at TA=25 C), 0.07 (at TA=125 C) |
| CJ | pF | Typical junction capacitance (Measured at 1MHz and applied reverse voltage of 4.0V D.C.) | 20.0 |
| RqJA | C/W | Typical thermal resistance | 80.0 |
| TJ,TSTG | C | Operating junction and storage temperature range | -55 to +150 |
| Trr | ns | Maximum reverse recovery time (Test condition: IF=0.5A, IR=1.0A, Irr=0.25A) | 75 |
| Weight | ounce / grams | Weight | 0.0023 ounce, 0.07 grams |
| Model | Part Number | US1M-E3/61T-CN |
Characteristic Curves
Refer to figures for detailed characteristic curves:
- FIG. 1- DERATING CURVE OUTPUT RECTIFIED CURRENT
- FIG. 2-MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT PER LEG
- FIG. 3-TYPICAL FORWARD VOLTAGE CHARACTERISTICS
- FIG. 4-TYPICAL REVERSE LEAKAGE CHARACTERISTICS
Package Information
Soldering Profile: The device can be exposed to a maximum temperature of 265C for 10 seconds. Recommended reflow methods include IR, vapor phase oven, hot air oven, wave solder. Devices can be cleaned using standard industry methods and solvents.
Carrier Dimensions (mm):
| Package | A0 | B0 | K0 | D0 | E | F | P0 | P1 | P2 | T | W |
|---|---|---|---|---|---|---|---|---|---|---|---|
| SMA | 2.80 | 4.0 | 5.30 | 4.0 | 2.36 | 2.0 | 1.55 | 0.25 | 1.75 | 5.50 | 0.1 |
Reel Specifications:
| Reel Size | QTY/Reel (Kpcs) | Box Size (mm) | QTY/Box (Kpcs) | Carton Size (mm) | QTY/Carton (Kpcs) | Reel DIA. (mm) |
|---|---|---|---|---|---|---|
| 11' | 5 | 285 | 10 | 355*310*310 | 80 | 278 |
Dimensions (inches and millimeters):
| Dimension | Inches | Millimeters |
|---|---|---|
| A | 0.208 | 5.30 |
| B | 0.177 | 4.50 |
| C | 0.067 | 1.70 |
| D | 0.051 | 1.30 |
| E | 0.153 | 3.90 |
| F | 0.110 | 2.80 |
| G | 0.094 | 2.40 |
| H | 0.060 | 1.52 |
| I | 0.030 | 0.76 |
| J | 0.188 | 4.80 |
| K | 0.012 | 0.305 |
| L | 0.006 | 0.152 |
| M | 0.008 MAX. | 0.203 MAX. |
| N | 0.098 | 2.50 |
| O | 0.078 | 2.00 |
Additional Information
For additional information, please visit our website http://www.chipnobo.com, or consult your nearest Chipnobo sales office for further assistance.
2507091655_ChipNobo-US1M-E3-61T-CN_C42419992.pdf
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