Low leakage current diode ChipNobo S10M with polarity symbol marking and high forward surge current capacity

Key Attributes
Model Number: S10M
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
200A
Voltage - DC Reverse (Vr) (Max):
1kV
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - Forward(Vf@If):
1.1V@10A
Current - Rectified:
10A
Mfr. Part #:
S10M
Package:
SMC
Product Description

Product Overview

This product is a rectifier designed for printed circuit boards, featuring a glass-passivated junction chip. It offers low reverse leakage, high forward surge current capability, and is guaranteed for high-temperature soldering. The plastic package carries an Underwriters Laboratory Flammability Classification 94V-0. It is ideal for use with residential and commercial equipment.

Product Attributes

  • Brand: ChipNobo
  • Flammability Classification: UL 94V-0
  • Material: Molded plastic body, Solder plated terminals
  • Polarity: Polarity symbol marking on body
  • Mounting Position: Any

Technical Specifications

Symbol Units S10M Description
VRRM V 55 to 150 Maximum repetitive peak reverse voltage
VRMS V 10.0 Maximum RMS voltage
VDC V 200.0 Maximum DC blocking voltage
I(AV) A 10.0 Maximum average forward rectified current at TL=100C
IFSM A 200.0 Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load
VF V 1.10 (Max) at 10.0A Maximum instantaneous forward voltage at 10.0A
IR A 5.0 (Max) at rated DC blocking voltage Maximum DC reverse current TA=25C
IR A 1000 (Max) at rated DC blocking voltage Maximum DC reverse current TA=125C
RqJA C/W 70.0 Typical thermal resistance (Note 1)
CJ pF 47.0 (Typ) Typical junction capacitance (Note 1)
TJ,TSTG C -55 to +150 Operating junction and storage temperature range
Weight ounce / grams 0.008 / 0.225 Weight

Note 1: Measured at 1MHz and applied reverse voltage of 4.0V D.C.

Ratings: Ratings at 25C ambient temperature unless otherwise specified. Single phase half-wave 60Hz, resistive or inductive load, for capacitive load current derate by 20%.

Mechanical Data:

  • Dimensions in inches and (millimeters)
  • Package: DO-214AB/SMC

Soldering Profile:

  • Recommended reflow methods: IR, vapor phase oven, hot air oven, wave solder.
  • The device can be exposed to a maximum temperature of 265C for 10 seconds.
  • Devices can be cleaned using standard industry methods and solvents.

Package Information:

Carrier Dimension(mm) A0 B0 K0 D0 E F P0 P1 P2 T W
(mm) 6.05 4.0 8.31 8.0 2.54 2.0 1.55 0.25 1.75 7.50 0.1
(inch) 0.238 0.157 0.327 0.315 0.100 0.079 0.061 0.010 0.069 0.295 0.004

Package Reel Specifications:

Package Reel Size Q'TY/Reel (Kpcs) Box Size (mm) QTY/Box (Kpcs) Carton Size (mm) Q'TY/Carton (Kpcs) Reel DIA. (mm)
SMC 13' 3.0 340*6.0*360 330 360*360*360 48 330

For additional information, please visit our website http://www.chipnobo.com, or consult your nearest Chipnobo sales office for further assistance.


2507091655_ChipNobo-S10M_C45369258.pdf

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