High surge current ChipNobo MURS160T3G-CN rectifier with molded plastic body and solder plated terminals

Key Attributes
Model Number: MURS160T3G-CN
Product Custom Attributes
Mfr. Part #:
MURS160T3G-CN
Package:
SMB
Product Description

Product Overview

The MURS160T3G-CN is a rectifier designed for printed circuit boards, featuring a glass-passivated junction chip for low reverse leakage and high forward surge current capability. It is suitable for residential and commercial equipment and is guaranteed for high-temperature soldering. The product comes in a molded plastic body with solder-plated terminals.

Product Attributes

  • Brand: ChipNobo
  • Package: DO-214AA/SMB
  • Flammability Classification: Underwriters Laboratory 94V-0
  • Material: Molded plastic body, Solder plated terminals
  • Polarity: Polarity symbol marking on body
  • Mounting Position: Any

Technical Specifications

Parameter Symbol Unit Rating Conditions
Maximum repetitive peak reverse voltage VRRM V 600
Maximum RMS voltage VRMS V 420
Maximum DC blocking voltage VDC V 600
Maximum average forward rectified current I(AV) A 2.0 TL=100 C
Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load IFSM A 50.0
Maximum instantaneous forward voltage at 2.0A VF V 0.0035 at 2.0A
Maximum DC reverse current at rated DC blocking voltage IR A 0.0001 TA =25 C
Maximum DC reverse current at rated DC blocking voltage IR A 0.0005 TA=125 C
Typical junction capacitance CJ pF 50.0 Measured at 1MHz and applied reverse voltage of 4.0V D.C. (Note2)
Typical thermal resistance RqJA C/W 85.0
Operating junction and storage temperature range TJ,TSTG C -55 to +150
Maximum reverse recovery time Trr ns 75 IF=0.5A, IR=1.0A, Irr=0.25A (Note 1)
Weight ounce, grams 0.0035, 0.098

Dimensions (DO-214AA/SMB)

Symbol Unit (inch) Unit (mm)
A 0.161 4.10
B 0.091 2.30
C 0.078 2.00
D 0.161 4.10
E 0.091 2.30
F 0.078 2.00

Package Information

Package Reel Size Q'TY/Reel (Kpcs) Box Size (mm) QTY/Box (Kpcs) Carton Size (mm) Q'TY/Carton (Kpcs)
SMB 13' 3.0 340*360*360 330 48

Soldering Specifications

  • High temperature soldering guaranteed: 250 C/10 seconds at terminals.
  • Recommended reflow methods: IR, vapor phase oven, hot air oven, wave solder.
  • Maximum temperature exposure: 265C for 10 seconds.

Additional Information

  • Website: http://www.chipnobo.com

2507091655_ChipNobo-MURS160T3G-CN_C45369248.pdf

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