molded plastic body and solder plated terminals ChipNobo SMAZ15-13-F-CN voltage range 3.3 to 100 volts
Product Overview
This product features a molded plastic body with solder-plated, solderable terminals per MIL-STD-750, Method 2026. It offers a complete voltage range from 3.3 to 100 volts, high peak reverse power dissipation, high reliability, and low leakage current. The standard zener voltage tolerance is 5%. It is designed for use with residential and commercial equipment.
Product Attributes
- Case: Molded plastic body
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Polarity symbol marking on body
- Mounting Position: Any
- Brand: ChipNobo
Technical Specifications
| Feature | Value | Unit |
|---|---|---|
| Voltage Range | 3.3 to 100 | Volts |
| Weight | 0.0023 | ounce |
| Weight | 0.07 | grams |
| DC Power Dissipation at TL = 75 C (Note1) | 1.0 | W |
| Maximum Forward Voltage at IF = 200 mA | 1.2 | V |
| Junction Temperature Range | -55 to +150 | C |
| Storage Temperature Range | -55 to +150 | C |
| Nominal Zener Voltage (VZ @ IZT) | 15 | V |
| ZT @ IZT | 17.0 | mA |
| ZZT @ IZT | 14 | |
| ZZK @ IZK | 700 | |
| IZK | 0.25 | mA |
| IR @ VR | 5.0 | A |
| IRM(2) (V) | 11.4 | V |
| IZM | 61 | mA |
| Maximum Surge Current | 305 | mApk |
| Type Device Marking | 744A | |
| Standard Zener Voltage Tolerance | 5% | |
| Reverse Surge Current (Note 2) | Non-repetitive, 8.3ms pulse width square wave or equivalent sine-wave superimposed on IZT per JEDEC Method |
Dimensions (DO-214AC/SMA)
| Symbol | Unit (inch) | Unit (mm) |
|---|---|---|
| A | 0.208 | 5.30 |
| B | 0.067 | 1.70 |
| C | 0.153 | 3.90 |
| D | 0.110 | 2.80 |
| E | 0.094 | 2.40 |
| F | 0.188 | 4.80 |
| G | 0.051 | 1.30 |
| H | 0.177 | 4.50 |
| J | 0.006 | 0.152 |
| K | 0.012 | 0.305 |
| L | 0.098 | 2.50 |
| M | 0.078 | 2.00 |
| N | 0.008 | 0.203 |
Package Information
| Package | Reel Size | QTY/Reel (Kpcs) | Box Size (mm) | QTY/Box (Kpcs) | Carton Size (mm) | QTY/Carton (Kpcs) | Reel DIA. (mm) |
|---|---|---|---|---|---|---|---|
| SMA | 11' | 5 | 285*10 | 2.36 | 355*310*310 | 80 | 278 |
Suggested Soldering Temperature Profile
Recommended reflow methods: IR, vapor phase oven, hot air oven, wave solder. The device can be exposed to a maximum temperature of 265C for 10 seconds. Devices can be cleaned using standard industry methods and solvents. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Carrier Dimension (mm)
| A0 | B0 | K0 | D0 | E | F | P0 | P1 | P2 | T | W |
|---|---|---|---|---|---|---|---|---|---|---|
| 2.80 | 4.0 | 5.30 | 4.0 | 2.36 | 2.0 | 1.55 | 0.25 | 1.75 | 12 | 5.50 |
Note: The information presented in this document is for reference only. ChipNobo reserves the right to adjust product indicators and upgrade some technical parameters for product optimization and productivity improvement. ChipNobo is exempt from liability for any delay or non-delivery in the information disclosure process.
The product listed herein is designed for use with residential and commercial equipment, and does not support sensitive items and specialized equipment in areas where sanctions exist. ChipNobo Co., Ltd or its representatives assume no responsibility or liability for any damages resulting from improper use.
For additional information, please visit http://www.chipnobo.com, or consult your nearest Chipnobo sales office.
2507091655_ChipNobo-SMAZ15-13-F-CN_C42458959.pdf
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