2.5A glass passivated bridge rectifier DIODES MSB25MH-13 compliant with RoHS and environmental standards
Product Overview
The MSB25MH is an advanced, new product featuring a 2.5A surface mount glass-passivated bridge rectifier. It is designed for AC to DC full wave rectification in a variety of applications including Switch Mode Power Supplies (SMPS), LED lighting, adapters, battery chargers, home appliances, office equipment, and telecommunication systems. Key benefits include a compact, thin profile, reliable construction, suitability for SMT manufacturing, and compliance with environmental standards.
Product Attributes
- Brand: Diodes Incorporated
- Construction: Glass Passivated Die
- Certifications: RoHS Compliant, Halogen and Antimony Free ("Green" Device)
- Material: Molded Plastic Case (UL Flammability Classification Rating 94V-0)
- Terminals: Lead Free Plating (Matte Tin Finish)
Technical Specifications
| Characteristic | Symbol | Value | Unit | Condition |
|---|---|---|---|---|
| Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage | VRRM VRWM VR | 1000 | V | |
| RMS Reverse Voltage | VR(RMS) | 700 | V | |
| Average Rectified Output Current | IO | 2.5 | A | @ TC = +110C |
| Non-Repetitive Peak Forward Surge Current (8.3ms) | IFSM | 80 | A | Single Half Sine-Wave Superimposed on Rated Load |
| Non-Repetitive Peak Forward Surge Current (1.0ms) | IFSM | 160 | A | Single Half Sine-Wave Superimposed on Rated Load |
| I2 t Rating for Fusing (1ms < t < 8.3ms) | I2t | 26.5 | AS | |
| Reverse Breakdown Voltage | V(BR)R | 1000 | V | IR = 5A |
| Forward Voltage (Per Element) | VF | 1.1 | V | IF = 2.5A, TA = +25C |
| Forward Voltage (Per Element) | VF | 1.02 | V | IF = 2.5A, TA = +125C |
| Leakage Current (Per Element) | IR | 5 | A | VR = 1000V, TA = +25C |
| Leakage Current (Per Element) | IR | 500 | A | VR = 1000V, TA = +125C |
| Total Capacitance | CT | 30 | pF | VR = 4V, f = 1.0MHz |
| Thermal Resistance, Junction to Ambient (Per Element) | RJA | 35 | C/W | Device mounted on glass-epoxy substrate with 1 oz 20mm x 20mm Cu pad per pin. |
| Thermal Resistance, Junction to Case | RJC | 7.8 | C/W | |
| Thermal Resistance, Junction to Lead | RJL | 16 | C/W | |
| Operating and Storage Temperature Range | TJ, TSTG | -55 to +150 | C |
2308101653_DIODES-MSB25MH-13_C5245223.pdf
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