Surface Mount Schottky Rectifier FUXINSEMI SS34B Featuring RoHS 20 Compliance and Molded Plastic Body
Product Overview
The SS32B THRU SS320B series are Surface Mount Schottky Barrier Rectifiers designed for applications requiring high forward surge current capability and low power loss. Featuring a metal silicon junction with majority carrier conduction, these rectifiers offer high efficiency. The JEDEC DO-214AC molded plastic body with built-in strain relief is ideal for automated placement. They are compliant with RoHS 2.0 and suitable for surface mounting, with terminals solderable per MIL-STD-750, Method 2026. High temperature soldering is guaranteed at 260C for 10 seconds.
Product Attributes
- Case: JEDEC DO-214AC molded plastic body
- Terminals: Solder plated
- Polarity: Color band denotes cathode end
- Mounting Position: Any
- Flammability Classification: Underwriters Laboratory 94V-0
- Compliance: RoHS 2.0
Technical Specifications
| Model | Maximum Ratings | Typical Junction Capacitance (pF) (NOTE 1) | Typical Thermal Resistance (JA) (NOTE 2) | Operating Junction Temperature Range (C) | Storage Temperature Range (C) | ||
|---|---|---|---|---|---|---|---|
| VRRM (V) | VRMS (V) | VDC (V) | |||||
| SS32B | 20 | 14 | 20 | 60 | 80.0 | -55 to +150 | -55 to +150 |
| SS33B | 30 | 21 | 30 | 60 | 80.0 | -55 to +150 | -55 to +150 |
| SS34B | 40 | 28 | 40 | 60 | 80.0 | -55 to +150 | -55 to +150 |
| SS35B | 50 | 35 | 50 | 60 | 80.0 | -55 to +150 | -55 to +150 |
| SS36B | 60 | 42 | 60 | 60 | 80.0 | -55 to +150 | -55 to +150 |
| SS38B | 80 | 56 | 80 | 60 | 80.0 | -55 to +150 | -55 to +150 |
| SS310B | 100 | 70 | 100 | 60 | 80.0 | -55 to +150 | -55 to +150 |
| SS315B | 150 | 105 | 150 | 60 | 80.0 | -55 to +125 | -55 to +150 |
| SS320B | 200 | 140 | 200 | 60 | 80.0 | -55 to +125 | -55 to +150 |
Note 1: Measured at 1MHz and applied reverse voltage of 4.0V D.C.
Note 2: P.C.B. mounted with 2.0x2.0 (5.0x5.0cm) copper pad areas.
Electrical Characteristics (AT TA=25C unless otherwise noted)
| Symbol | Description | SS32B-SS34B | SS35B-SS36B | SS38B-SS310B | SS315B-SS320B | Units |
|---|---|---|---|---|---|---|
| I(AV) | Maximum average forward rectified current at TL(see fig.1) | 3.0 | 5.0 | 10.0 | 10.0 | A |
| IFSM | Peak forward surge current 8.3ms single half sine-wave superimposed on rated load | 450 | 450 | 450 | 450 | A |
| VF | Maximum instantaneous forward voltage at 3.0A | 0.55 | 0.70 | 0.85 | 0.95 | V |
| IR | Maximum DC reverse current at TA=25C at rated DC blocking voltage | 0.1 | 0.1 | 0.1 | 0.1 | mA |
| IR | Maximum DC reverse current at TA=100C at rated DC blocking voltage | 2.0 | 2.0 | 2.0 | 2.0 | mA |
Dimensions
| Part Number | A (inch/mm) | B (inch/mm) | C (inch/mm) |
|---|---|---|---|
| SMB (DO-214AA) | 0.078 (2.00) | 0.059 (1.50) | 0.110 (2.80) |
Marking
| Type Number | Marking Code |
|---|---|
| SS32B | SS32 |
| SS33B | SS33 |
| SS34B | SS34 |
| SS35B | SS35 |
| SS36B | SS36 |
| SS38B | SS38 |
| SS310B | SS310 |
| SS315B | SS315 |
| SS320B | SS320 |
Soldering Conditions
Suggested thermal profiles for soldering processes:
Reflow soldering:
- Storage environment: Temperature=5~40C, Humidity=55%25%
- Preheat: Temperature (Tsmin) 150C to (Tsmax) 200C, Time (ts) 60~120sec
- Ramp-up Rate: Tsmax to TL < 3C/sec
- Time maintained above: Temperature (TL) 217C, Time (tL) 60~260sec
- Peak Temperature: (TP) 255C (0/-5C)
- Time within 5C of actual Peak Temperature (tP): 10~30sec
- Ramp-down Rate: TP to 25C < 6C/sec
- Time 25C to Peak: < 6 minutes
2304140030_FUXINSEMI-SS34B_C842790.pdf
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