Surface Mount Fast Recovery Rectifier FUXINSEMI SOD1F7 1 Ampere High Speed Switching Device
Product Overview
The Fuxinsemi SOD1F1 through SOD1F7 series are 1.0A Surface Mount Fast Recovery Rectifiers designed for high-speed switching applications. These rectifiers feature a glass-passivated chip junction, low reverse leakage, built-in strain relief for automated placement, and high forward surge current capability. They are ideal for applications requiring efficient and reliable rectification with fast recovery times.
Product Attributes
- Brand: Fuxinsemi
- Case: JEDEC SOD-123 molded plastic body
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Mounting Position: Any
- Flammability Classification: Underwriters Laboratory 94V-0
- Features: Low reverse leakage, built-in strain relief, high forward surge current capability, high temperature soldering guaranteed (260 C/10 seconds at terminals)
Technical Specifications
| PARAMETER | SYMBOLS | UNITS | SOD1F1 | SOD1F2 | SOD1F3 | SOD1F4 | SOD1F5 | SOD1F6 | SOD1F7 |
|---|---|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | V | 50 | 100 | 140 | 200 | 280 | 400 | 600 |
| Maximum RMS voltage | VRMS | V | 35 | 70 | 100 | 140 | 200 | 280 | 420 |
| Maximum DC blocking voltage | VDC | V | 50 | 100 | 140 | 200 | 280 | 400 | 600 |
| Maximum average forward rectified current (0.375 (9.5mm) lead length at TA=75 C) | I(AV) | A | 1.0 | ||||||
| Peak forward surge current (8.3ms single half sine-wave superimposed on rated load (JEDEC Method)) | IFSM | A | 30 | ||||||
| Maximum instantaneous forward voltage at 1.0A | VF | V | 1.0 | ||||||
| Maximum DC reverse current TA=25 C at rated DC blocking voltage | IR | A | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 |
| Maximum DC reverse current TA=100 C at rated DC blocking voltage | IR | mA | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
| Typical thermal resistance (NOTE 3) | RJA | C/W | 85.0 | ||||||
| Typical junction capacitance (NOTE 2) | CJ | pF | 15.0 | ||||||
| Maximum reverse recovery time (NOTE 1) | trr | ns | 150 | 250 | 500 | 500 | 500 | 500 | 500 |
| Operating junction and storage temperature range | TJ,TSTG | C | -55 to +150 | ||||||
Notes:
1. Reverse recovery condition IF=0.5A, IR=1.0A, Irr=0.25A
2. Measured at 1MHz and applied reverse voltage of 4.0V D.C.
3. Thermal resistance from junction to ambient at 0.375 (9.5mm) lead length, P.C.B. mounted
Package Dimensions (SOD-123)
| Dimension | Inches | (Millimeters) |
|---|---|---|
| Length | 2.70.2 | (69.05.0) |
| Width | 1.80.2 | (46.05.0) |
| Height | 1.00.2 | (25.05.0) |
| Lead Bend | 0.60.25 | (15.06.3) |
| Lead Spread | 3.70.2 | (94.05.0) |
| Flat Spring | 1.10.25 | (28.06.3) |
| Flat Spring | 0.10-0.30 | (2.5-7.6) |
Marking Information
| Type Number | Marking Code |
|---|---|
| SOD1F1 | F1 |
| SOD1F2 | F2 |
| SOD1F3 | F3 |
| SOD1F4 | F4 |
| SOD1F5 | F5 |
| SOD1F6 | F6 |
| SOD1F7 | F7 |
Soldering Profile
Reflow soldering
| Profile Feature | Parameter | Value | Unit |
|---|---|---|---|
| Storage environment | Temperature | 5 ~ 40 | C |
| Storage environment | Humidity | 55 25 | % |
| Preheat | Tsmin | 150 | C |
| Preheat | Tsmax | 200 | C |
| Preheat | ts | 60~120 | sec |
| Average ramp-up rate (Tsmax to TL) | < 3 | C/sec | |
| Time maintained above TL | TL | 217 | C |
| Time maintained above TL | tL | 60~260 | sec |
| Peak Temperature | TP | 255 0 / +5 | C |
| Time within 5C of actual peak temperature | tp | 10~30 | sec |
| Ramp-down Rate | < 6 | C/sec | |
| Time 25C to Peak Temperature | < 6 | minutes |
2309041613_FUXINSEMI-SOD1F7_C7503105.pdf
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