single phase surface mount bridge rectifiers offering FUXINSEMI ABS10 with UL94 V0 flame retardant rating
Key Attributes
Model Number:
ABS10
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
30A
Operating Junction Temperature Range:
-55℃~+150℃@(Tj)
Voltage - Forward(Vf@If):
1.1V@1A
Current - Rectified:
1A
Voltage - DC Reverse(Vr):
1kV
Mfr. Part #:
ABS10
Package:
ABS
Product Description
Product Overview
The ABS05 thru ABS10 series are 1.0A miniature glass passivated single-phase surface mount bridge rectifiers, offering voltage ratings from 50V to 1000V. These rectifiers are designed for applications requiring surge overload protection up to 30 amperes peak. Their compact design saves space on printed circuit boards and is ideal for automated replacement. Constructed with reliable, low-cost molded plastic technology and featuring glass passivated chip junctions, these lead-free parts meet RoHS requirements. They are suitable for various general-purpose rectification applications.
Product Attributes
- Brand: Fuxin Semiconductor (implied by website domain)
- Construction: Molded plastic technology
- Chip Junctions: Glass passivated
- Flame Retardant Rating: UL94-V0
- Case Material: Molded plastic, ABS
- Terminal Finish: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Marked on body
- Mounting Position: Any
- Compliance: Lead-free parts meet RoHS requirements
- Optional Suffix: "-H" indicates Halogen free part
Technical Specifications
| Characteristic | Symbol | ABS05 | ABS1 | ABS2 | ABS4 | ABS6 | ABS8 | ABS10 | Unit |
|---|---|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| Maximum RMS Voltage | VRMS | 35 | 70 | 140 | 280 | 420 | 560 | 700 | V |
| Maximum DC Blocking Voltage | VDC | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| Maximum Average Forward Rectified Current @TA=25 | I(AV) | 1.0 | A | ||||||
| Peak Forward Surge Current 8.3ms Single Half Sine-Wave Super Imposed on Rated Load (JEDEC Method) | IFSM | 30 | A | ||||||
| Maximum Forward Voltage at 1.0A DC | VF | 1.1 | V | ||||||
| Maximum DC Reverse Current @TJ=25 at Rated DC Bolcking Voltage | IR | 10 | µA | ||||||
| Maximum DC Reverse Current @TJ=125 at Rated DC Bolcking Voltage | IR | 500 | µA | ||||||
| I2t Rating for Fusing (t<8.3ms) | I2t | 15 | A2s | ||||||
| Typical Junction Capacitance Per Element (Note 1) | CJ | 60 | pF | ||||||
| Typical Thermal Resistance (Note 2) | RJA | 3.74 | /W | ||||||
| Operating Temperature Range | TJ | -55 to +150 | |||||||
| Storage Temperature Range | TSTG | -55 to +150 | |||||||
Notes:
- Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
- Thermal resistance from junction to ambient mounted on P.C.B with 0.5*0.5"(13*13mm)copper pads.
Dimensions (ABS Package):
| Symbol | A | B | C | D |
|---|---|---|---|---|
| Inches (mm) | 0.236 (6.0) | 0.268 (6.8) | 0.132 (3.35) | 0.193 (4.90) |
Marking Code Examples:
- ABS05: ABS05
- ABS1: ABS1
- ABS2: ABS2
- ABS4: ABS4
- ABS6: ABS6
- ABS8: ABS8
- ABS10: ABS10
- Halogen-free part: Add "-H" suffix to the part number (e.g., ABS2-H)
Soldering Conditions:
| Profile Feature | Value | Unit |
|---|---|---|
| Average ramp-up rate (Tsmin to Tsmax) | <3 | /sec |
| Preheat -Temperature Min (Tsmin) | 150 | |
| Preheat -Temperature Max (Tsmax) | 200 | |
| Preheat -Time (tsmin to tsmax) | 60~120 | sec |
| Time maintained above: Temperature (TL) | 217 | |
| Time maintained above: Time (tL) | 60~260 | sec |
| Peak Temperature (TP) | 255 (0/+5) | |
| Time within 5 of actual Peak Temperature (tp) | 10~30 | sec |
| Ramp-down Rate | <6 | /sec |
| Time 25 to Peak Temperature | <6 | minutes |
Storage Environment: Temperature = 5~40, Humidity = 55%25%
2011091105_FUXINSEMI-ABS10_C915619.pdf
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