Glass Passivated Chip Junction Bridge Rectifier Molded Plastic Technology FUXINSEMI GBU2510 Lead Free
Key Attributes
Model Number:
GBU2510
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
350A
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - Forward(Vf@If):
1.2V@25A
Current - Rectified:
25A
Voltage - DC Reverse(Vr):
1kV
Mfr. Part #:
GBU2510
Package:
GBU
Product Description
Product Overview
The Fuxin GBU series of Glass Passivated Single Phase Bridge Rectifiers are designed for non-automatic applications, offering space-saving benefits on printed circuit boards. They are ideal for automatic insertion and feature a reliable, low-cost construction utilizing molded plastic technology. These rectifiers are built with glass-passivated chip junctions and lead-free parts that meet RoHS requirements. The series is suitable for various power applications requiring efficient rectification.
Product Attributes
- Brand: Fuxin
- Construction: Molded plastic technology
- Chip Junctions: Glass passivated
- Compliance: Lead-free parts meet RoHS requirements
- Suffix "-H": Indicates Halogen free parts
- Epoxy: UL94-V0 rated flame retardant
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Marked on body
- Mounting Position: Any
Technical Specifications
| TYPE NUMBER | SYMBOL | GBU25005 | GBU2501 | GBU2502 | GBU2504 | GBU2506 | GBU2508 | GBU2510 | UNITS |
|---|---|---|---|---|---|---|---|---|---|
| VRRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V | |
| VRWM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | VDC | |
| VRMS | 35 | 70 | 140 | 280 | 420 | 560 | 700 | V | |
| IF(AV) Note 1 @TA=90C | 25.0 | A | |||||||
| IFSM Rating for fusing (t <8.3ms) | 200 | A | |||||||
| I2t Rating for fusing (t <8.3ms) | 1.2 | A2s | |||||||
| VFM per element @IF=12.5A | 1.1 | V | |||||||
| VFM per element @IF=25A | 350 | mV | |||||||
| IR @ Rated DC Blocking Voltage @TJ=25C | 5.0 | uA | |||||||
| IR @ Rated DC Blocking Voltage @TJ=125C | 200 | uA | |||||||
| CJ Note 2 | 20 | pF | |||||||
| RJA | 35 | C/W | |||||||
| RJC | 5.0 | C/W | |||||||
| RJL | 50 | C/W | |||||||
| VIDS Dielectric Strength | 2500 | V | |||||||
| TJ,TSTG | -55 to +150 | C | |||||||
| Proposed installation torque | 5.0 | Kgf.cm | |||||||
| Max torque | 8.0 | Kgf.cm | |||||||
Notes:
1. Mounted on glass epoxy PC board with 1.3mm solder pad.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
Soldering Condition
Reflow soldering
| Parameter | Value | Unit |
|---|---|---|
| Preheat - Temperature Min (Tsmin) | 150 | C |
| Preheat - Temperature Max (Tsmax) | 200 | C |
| Preheat - Time (tsmin to tsmax) | 60~120 | sec |
| Ramp-up Rate (Tsmax to TP) | <3 | C/sec |
| Time maintained above TL | 217 | C |
| Time (tL) | 60~260 | sec |
| Peak Temperature (TP) | 255 | C |
| Time within 5C of actual Peak Temperature (tP) | 10~30 | sec |
| Ramp-down Rate (TP to 25C) | <6 | C/sec |
| Time 25C to Peak Temperature | <6 | minutes |
Storage environment: Temperature=5 ~40 C, Humidity=55%25%
2010151636_FUXINSEMI-GBU2510_C880916.pdf
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