Low Gate Charge Power MOSFET GL GL200N06A8 with Fast Switching and Single Pulse Avalanche Energy Test

Key Attributes
Model Number: GL200N06A8
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
208A
Operating Temperature -:
-55℃~+175℃
RDS(on):
3mΩ@10V
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
330pF
Number:
1 N-channel
Output Capacitance(Coss):
850pF
Pd - Power Dissipation:
333W
Input Capacitance(Ciss):
9.1nF
Gate Charge(Qg):
120nC@10V
Mfr. Part #:
GL200N06A8
Package:
TO-220AB-3
Product Description

Product Overview

The GL200N06A8 is a N-Channel Power MOSFET from Wuxi Guang Lei Electronic Technology Co., LTD, utilizing advanced trench technology and design for excellent RDS(ON) with low gate charge. It is suitable for a wide variety of applications, including power switching, hard switched and high frequency circuits, and uninterruptible power supplies. The MOSFET is packaged in a TO-220AB package that conforms to RoHS standards. Key features include fast switching, low gate charge and Rdson, low reverse transfer capacitances, and 100% single pulse avalanche energy testing.

Product Attributes

  • Brand: GL Silicon
  • Manufacturer: Wuxi Guang Lei Electronic Technology Co., LTD
  • Product Type: N-Channel Power MOSFET
  • Package: TO-220AB
  • Certifications: RoHS compliant

Technical Specifications

Parameter Test Conditions Rating Units Min. Typ. Max.
Absolute Ratings (Tc= 25 unless otherwise specified)
VDSS Drain-to-Source Voltage 60 V
ID Continuous Drain Current 208 A
ID Continuous Drain Current TC = 100 C 147 A
IDM Pulsed Drain Current 832 A
VGS Gate-to-Source Voltage 20 V
EAS a2 Single Pulse Avalanche Energy 1600 mJ
EAR a1 Avalanche Energy, Repetitive 95 mJ
IAR a1 Avalanche Current 80 A
dv/dt a3 Peak Diode Recovery dv/dt 5.0 V/ns
PD Power Dissipation 333 W
TJ, Tstg Operating Junction and Storage Temperature Range -55 to 175 175
TL Maximum Temperature for Soldering 300
VDSS 60 V
ID 208 A
PD 333 W
RDS(ON)type 2.4 m
Electrical Characteristics (Tc= 25 unless otherwise specified)
OFF Characteristics
VDSS Drain to Source Breakdown Voltage 60 V 60 -- --
BVDSS/TJ Bvdss Temperature Coefficient -- V/ 0.1 --
IDSS Drain to Source Leakage Current -- A -- 1
IDSS Drain to Source Leakage Current VDS = 48V, VG S= 0V, Ta = 125 -- A -- 250
IGSS(F) Gate to Source Forward Leakage -- A -- 1
IGSS(R) Gate to Source Reverse Leakage -- A -- -1
ON Characteristics
RDS(ON) Drain-to-Source On-Resistance -- m 2.4 3.0
VGS(TH) Gate Threshold Voltage 2.0 V 2.0 3.0 4.0
Dynamic Characteristics
gfs Forward Transconductance 110 S 110 -- --
Ciss Input Capacitance -- pF 9100 --
Coss Output Capacitance -- pF 850 --
Crss Reverse Transfer Capacitance -- pF 330 --
Resistive Switching Characteristics
td(ON) Turn-on Delay Time -- ns 55 --
tr Rise Time -- ns 160 --
td(OFF) Turn-Off Delay Time -- ns 95 --
tf Fall Time -- ns 80 --
Qg Total Gate Charge -- nC 120 --
Qgs Gate to Source Charge -- nC 40 --
Qgd Gate to Drain (Miller)Charge -- nC 33 --
Source-Drain Diode Characteristics
IS Continuous Source Current (Body Diode) -- A -- 200
ISM Maximum Pulsed Current (Body Diode) -- A -- 832
VSD Diode Forward Voltage -- V -- 1.5
trr Reverse Recovery Time -- ns 99 --
Qrr Reverse Recovery Charge -- nC 190 --
RJC Junction-to-Case Thermal Resistance /W 0.38

2411220131_GL-GL200N06A8_C2886425.pdf

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