JEDEC Standard Molded Plastic PowerDI123 Package With FUXINSEMI DFLS2100 Semiconductor Device
Key Attributes
Model Number:
DFLS2100
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
50A
Reverse Leakage Current (Ir):
1uA@100V
Operating Junction Temperature Range:
-55℃~+175℃
Voltage - DC Reverse (Vr) (Max):
100V
Voltage - Forward(Vf@If):
850mV@2A
Current - Rectified:
2A
Mfr. Part #:
DFLS2100
Package:
PowerDI-123
Product Description
Product Overview
The JEDEC PowerDI-123 is a molded plastic body package designed for electronic components. It offers a standardized form factor for various applications.
Product Attributes
- Package Type: PowerDI-123
- Body Material: Molded Plastic
- Standard: JEDEC
Technical Specifications
| Model | Case | Description |
|---|---|---|
| PowerDI-123 F09A | PowerDI-123 | Molded plastic body |
2208191430_FUXINSEMI-DFLS2100_C3018522.pdf
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