Metal silicon junction Schottky diode FUXINSEMI SS16A surface mount rectifier with RoHS 2.0 compliance

Key Attributes
Model Number: SS16A
Product Custom Attributes
Reverse Leakage Current (Ir):
100uA@60V
Voltage - DC Reverse (Vr) (Max):
60V
Diode Configuration:
Independent
Voltage - Forward(Vf@If):
700mV@1A
Current - Rectified:
1A
Mfr. Part #:
SS16A
Package:
SMA(DO-214AC)
Product Description

Product Overview

The SS12A thru SS120A series are surface mount Schottky barrier rectifiers offering a voltage range from 20V to 200V. These rectifiers are designed for surface mounted applications, featuring built-in strain relief for automated placement. They provide high forward surge current capability and high-temperature soldering performance, guaranteed at 260C for 10 seconds at the terminals. Constructed with a metal silicon junction and majority carrier conduction, they offer low power loss and high efficiency. These rectifiers are compliant with RoHS 2.0 standards.

Product Attributes

  • Brand: Fuxinsemi
  • Package: SMA/DO-214AC
  • Material: Metal silicon junction
  • Conduction: Majority carrier
  • Certifications: RoHS 2.0 compliant, Halogen-free option available (suffix "-H")
  • Flammability Classification: UL 94V-0

Technical Specifications

Parameter Symbol SS12A SS13A SS14A SS15A SS16A SS18A SS110A SS115A SS120A Units
Maximum repetitive peak reverse voltage VRRM 20 to 200 V
Maximum RMS voltage VRMS 14 to 140 V
Maximum DC blocking voltage VDC 20 to 200 V
Maximum average forward rectified current at TL (see fig.1) I(AV) 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 A
Peak forward surge current 8.3ms single half sine-wave superimposed on rated load IFSM 30.0 30.0 30.0 35.0 40.0 50.0 60.0 105.0 140.0 A
Maximum instantaneous forward voltage at 1.0A VF 0.55 0.55 0.55 0.70 0.70 0.85 0.85 0.95 0.95 V
Maximum DC reverse current TA=25 C at rated DC blocking voltage IR 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 mA
Maximum DC reverse current TA=100 C at rated DC blocking voltage IR 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 mA
Typical junction capacitance (NOTE 1) CJ 20 21 28 35 42 56 70 105 140 pF
Typical thermal resistance (NOTE 2) RJA 90 C/W
Operating junction temperature range TJ -55 to +150 C
Storage temperature range TSTG -55 to +125 C

Dimensions (SMA/DO-214AC):

  • Package Outline: 0.177(4.50) x 0.108(2.75) inches (mm)
  • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
  • Polarity: Color band denotes cathode end
  • Mounting Position: Any

Marking Code:

Type Number Marking Code
SS12A SS12
SS13A SS13
SS14A SS14
SS15A SS15
SS16A SS16
SS18A SS18
SS110A SS110
SS115A SS115
SS120A SS120

Soldering Conditions:

Reflow soldering:

  • Average ramp-up rate (Tsmin to Tsmax): <3 C/sec
  • Preheat Temperature (Tsmin): 150 C
  • Preheat Temperature (Tsmax): 200 C
  • Time (tsmin to tsmax): 60~120 sec
  • Ramp-up Rate (Tsmax to TL): <3 C/sec
  • Time maintained above: Temperature (TL) 217 C, Time (tL) 60~260 sec
  • Peak Temperature (TP): 255 +0/-5 C
  • Time within 5 C of actual Peak Temperature (tP): 10~30 sec
  • Ramp-down Rate: <6 C/sec
  • Time 25 C to Peak Temperature: <6 minutes

Storage Environment: Temperature=5 ~40 C, Humidity=55%25%


2108072030_FUXINSEMI-SS16A_C2844170.pdf

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