High Temperature Soldering Compatible Rectifiers Featuring FUXINSEMI M7A With Built In Strain Relief
Product Overview
The 1.0A Surface Mount General Purpose Rectifiers, series M1A through M7A, are designed for general purpose applications with a voltage range from 50V to 1000V. These rectifiers feature a glass passivated chip junction, low reverse leakage, and built-in strain relief, making them ideal for automated placement. They offer high forward surge current capability and are suitable for high-temperature soldering processes, guaranteed at 250C for 10 seconds at the terminals. The plastic package carries an Underwriters Laboratory Flammability Classification 94V-0. These rectifiers are compliant with the RoHS Directive 2011/65/EU.
Product Attributes
- Brand: Fuxin Semiconductor (implied by www.fuxinsemi.com)
- Certifications: Underwriters Laboratory Flammability Classification 94V-0
- Compliance: RoHS Directive 2011/65/EU
- Material: Glass passivated chip junction, Solder plated terminals
- Package: JEDEC SMA molded plastic body
Technical Specifications
| Symbol | VRRM (V) | VRMS (V) | VR (V) | VF (V) | IO (A) | IFSM (A) | IR (A) | RJA (OC/W) | CJ (pF) | TSTG (OC) | TJ (OC) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| M1A | 50 | 35 | 50 | 1.10 | 1.0 | 30 | 5.0 | 70 | 50 | -55 to +150 | +150 |
| M2A | 100 | 70 | 100 | 1.10 | 1.0 | 30 | 5.0 | 70 | 50 | -55 to +150 | +150 |
| M3A | 200 | 140 | 200 | 1.10 | 1.0 | 30 | 5.0 | 70 | 50 | -55 to +150 | +150 |
| M4A | 400 | 280 | 400 | 1.10 | 1.0 | 30 | 5.0 | 70 | 50 | -55 to +150 | +150 |
| M5A | 600 | 420 | 600 | 1.10 | 1.0 | 30 | 5.0 | 70 | 50 | -55 to +150 | +150 |
| M6A | 800 | 560 | 800 | 1.10 | 1.0 | 30 | 5.0 | 70 | 50 | -55 to +150 | +150 |
| M7A | 1000 | 700 | 1000 | 1.10 | 1.0 | 30 | 5.0 | 70 | 50 | -55 to +150 | +150 |
| Mechanical Data | |
|---|---|
| Case | JEDEC SMA molded plastic body |
| Terminals | Solder plated, solderable per MIL-STD-750, Method 2026 |
| Polarity | Color band denotes cathode end |
| Mounting Position | Any |
| Dimensions (inches and millimeters) | See diagrams on pages 1 and 3. |
| Suggested solder pad layout | See diagram on page 3. |
| Soldering Condition | |
|---|---|
| Storage environment | Temperature=5~40C, Humidity=55%25% |
| Reflow soldering of surface-mount devices | 10~30 seconds |
| Suggested thermal profiles for soldering processes | See diagram on page 4. |
2108072030_FUXINSEMI-M7A_C2844173.pdf
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