High Temperature Soldering Compatible Rectifiers Featuring FUXINSEMI M7A With Built In Strain Relief

Key Attributes
Model Number: M7A
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
30A
Reverse Leakage Current (Ir):
5uA@1kV
Voltage - DC Reverse (Vr) (Max):
1kV
Diode Configuration:
-
Voltage - Forward(Vf@If):
1.1V@1A
Current - Rectified:
1A
Mfr. Part #:
M7A
Package:
DO-214AC(SMA)
Product Description

Product Overview

The 1.0A Surface Mount General Purpose Rectifiers, series M1A through M7A, are designed for general purpose applications with a voltage range from 50V to 1000V. These rectifiers feature a glass passivated chip junction, low reverse leakage, and built-in strain relief, making them ideal for automated placement. They offer high forward surge current capability and are suitable for high-temperature soldering processes, guaranteed at 250C for 10 seconds at the terminals. The plastic package carries an Underwriters Laboratory Flammability Classification 94V-0. These rectifiers are compliant with the RoHS Directive 2011/65/EU.

Product Attributes

  • Brand: Fuxin Semiconductor (implied by www.fuxinsemi.com)
  • Certifications: Underwriters Laboratory Flammability Classification 94V-0
  • Compliance: RoHS Directive 2011/65/EU
  • Material: Glass passivated chip junction, Solder plated terminals
  • Package: JEDEC SMA molded plastic body

Technical Specifications

Symbol VRRM (V) VRMS (V) VR (V) VF (V) IO (A) IFSM (A) IR (A) RJA (OC/W) CJ (pF) TSTG (OC) TJ (OC)
M1A 50 35 50 1.10 1.0 30 5.0 70 50 -55 to +150 +150
M2A 100 70 100 1.10 1.0 30 5.0 70 50 -55 to +150 +150
M3A 200 140 200 1.10 1.0 30 5.0 70 50 -55 to +150 +150
M4A 400 280 400 1.10 1.0 30 5.0 70 50 -55 to +150 +150
M5A 600 420 600 1.10 1.0 30 5.0 70 50 -55 to +150 +150
M6A 800 560 800 1.10 1.0 30 5.0 70 50 -55 to +150 +150
M7A 1000 700 1000 1.10 1.0 30 5.0 70 50 -55 to +150 +150
Mechanical Data
Case JEDEC SMA molded plastic body
Terminals Solder plated, solderable per MIL-STD-750, Method 2026
Polarity Color band denotes cathode end
Mounting Position Any
Dimensions (inches and millimeters) See diagrams on pages 1 and 3.
Suggested solder pad layout See diagram on page 3.
Soldering Condition
Storage environment Temperature=5~40C, Humidity=55%25%
Reflow soldering of surface-mount devices 10~30 seconds
Suggested thermal profiles for soldering processes See diagram on page 4.

2108072030_FUXINSEMI-M7A_C2844173.pdf

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