Surface mount diode FUXINSEMI SS56C with molded plastic body JEDEC DO214AB and halogen free option
Key Attributes
Model Number:
SS56C
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
120A
Reverse Leakage Current (Ir):
100uA@60V
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - DC Reverse (Vr) (Max):
60V
Diode Configuration:
Independent
Voltage - Forward(Vf@If):
700mV@5A
Current - Rectified:
5A
Mfr. Part #:
SS56C
Package:
SMC(DO-214AB)
Product Description
Product Overview
The SS52C THRU SS520C A series are surface mount Schottky barrier rectifiers designed for high-efficiency applications. These rectifiers feature a metal silicon junction with majority carrier conduction, resulting in low power loss. They are built with a molded plastic body (JEDEC DO-214AB) and offer built-in strain relief for automated placement. Key advantages include high forward surge current capability and high temperature soldering guarantees. These rectifiers are compliant with RoHS 2.0 and are ideal for various surface-mounted applications.
Product Attributes
- Brand: Fuxin (implied by www.fuxinsemi.com)
- Package Type: JEDEC DO-214AB (SMC)
- Material: Metal silicon junction
- Conduction Type: Majority carrier conduction
- Certifications: Underwriters Laboratory Flammability Classification 94V-0, RoHS 2.0 compliant
- Feature: Halogen-free option available (suffix "-H")
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Mounting: Surface mount, suitable for automated placement
Technical Specifications
| Model | VRRM (V) | VRMS (V) | VDC (V) | I(AV) (A) | IFSM (A) | VF (V) @ 5.0A | IR (mA) @ TA=25C | CJ (pF) | RJA (C/W) | TJ, TSTG (C) |
|---|---|---|---|---|---|---|---|---|---|---|
| SS52C | 20 | 14 | 20 | 5.0 | 60 | 0.55 | 0.1 | 35 | ~2.0 | -55 to +150 |
| SS53C | 30 | 21 | 30 | 5.0 | 60 | 0.55 | 0.1 | 35 | ~2.0 | -55 to +150 |
| SS54C | 40 | 28 | 40 | 5.0 | 60 | 0.55 | 0.1 | 35 | ~2.0 | -55 to +150 |
| SS55C | 50 | 35 | 50 | 5.0 | 60 | 0.70 | 0.5 | 35 | ~2.0 | -55 to +125 |
| SS56C | 60 | 42 | 60 | 5.0 | 60 | 0.70 | 0.5 | 35 | ~2.0 | -55 to +125 |
| SS58C | 80 | 56 | 80 | 5.0 | 60 | 0.70 | 0.5 | 35 | ~2.0 | -55 to +125 |
| SS510C | 100 | 70 | 100 | 5.0 | 60 | 0.70 | 0.5 | 35 | ~2.0 | -55 to +125 |
| SS515C | 150 | 105 | 150 | 5.0 | 60 | 0.95 | 1.0 | 35 | ~2.0 | -55 to +125 |
| SS520C | 200 | 140 | 200 | 5.0 | 60 | 0.95 | 1.0 | 35 | ~2.0 | -55 to +125 |
Dimensions (SMC/DO-214AB):
- Body Length: 0.280(7.11) - 0.260(6.60) inches (mm)
- Body Width: 0.245(6.22) - 0.220(5.59) inches (mm)
- Height: 0.126 (3.20) - 0.114 (2.90) inches (mm)
- Lead Width: 0.060(1.52) - 0.030(0.76) inches (mm)
- Overall Length: 0.320(8.13) - 0.305(7.75) inches (mm)
- Lead Thickness: 0.012(0.305) - 0.006(0.152) inches (mm)
- Terminal to Terminal: 0.103(2.62) - 0.079(2.06) inches (mm)
Marking Codes:
- SS52: SS52
- SS53: SS53
- SS54: SS54
- SS55: SS55
- SS56: SS56
- SS58: SS58
- SS510: SS510
- SS515: SS515
- SS520: SS520
Soldering Conditions:
- Reflow soldering: 10~30 seconds at terminals
- Peak Temperature (TP): 255C +0/-5C
- Time within 5C of actual Peak Temperature (tP): 10~30 seconds
- Average ramp-up rate (TL to TP): <3C/sec
- Preheat Temperature (Tsmax): 200C
- Preheat Time (ts): 60~120 sec
- Temperature Maintained Above TL (217C): 60~260 sec
- Ramp-down Rate: <6C/sec
- Time 25C to Peak: <6 minutes
Storage Environment:
- Temperature: 5C ~ 40C
- Humidity: 55% 25%
2201242100_FUXINSEMI-SS56C_C908245.pdf
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