Power Switching Silicon N Channel MOSFET GL GL18N30FA9 Featuring Low Gate Charge and TO 220F Package

Key Attributes
Model Number: GL18N30FA9
Product Custom Attributes
Drain To Source Voltage:
300V
Current - Continuous Drain(Id):
18A
Operating Temperature -:
-55℃~+150℃
RDS(on):
220mΩ@10V
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
10pF@25V
Input Capacitance(Ciss):
1.9nF@25V
Pd - Power Dissipation:
45W
Gate Charge(Qg):
33nC@10V
Mfr. Part #:
GL18N30FA9
Package:
TO-220F
Product Description

Product Overview

The GL18N30FA9 is a silicon N-channel Enhanced VDMOSFET developed using self-aligned planar technology. This design enhances switching performance, reduces conduction losses, and improves avalanche energy. It is suitable for various power switching circuits, contributing to system miniaturization and higher efficiency. The device comes in a RoHS-compliant TO-220F package. Key features include fast switching, low ON resistance (Rdson 0.22), low gate charge, and low reverse transfer capacitances. It has undergone 100% single pulse avalanche energy testing. Typical applications include power switch circuits for adaptors and chargers.

Product Attributes

  • Brand: Wuxi Guang Lei
  • Product Type: Silicon N-Channel Power MOSFET
  • Technology: Self-aligned planar Technology
  • Package: TO-220F
  • Compliance: RoHS standard

Technical Specifications

Symbol Parameter Test Conditions Rating Units
Absolute Maximum Ratings (Tc=25 unless otherwise specified)
VDSS Drain-to-Source Voltage 300 V
ID Continuous Drain Current 18 A
ID Continuous Drain Current TC=100 C 11.2 A
IDMa1 Pulsed Drain Current 72 A
VGS Gate-to-Source Voltage 30 V
EAS Single Pulse Avalanche Energy 850 mJ
EARa1 Avalanche Energy, Repetitive 90 mJ
IARa1 Avalanche Current 4.2 A
dv/dta3 Peak Diode Recovery dv/dt 5.0 V/ns
PD Power Dissipation 45 W
Derating Factor above 25C 0.36 W/
TJ, Tstg Operating Junction and Storage Temperature Range 55 to 150
TL Maximum Temperature for Soldering 300
Thermal Characteristics
RJC Thermal Resistance, Junction-to-Case 2.78 / W
RJA Thermal Resistance, Junction-to-Ambient 62.5 / W
Electrical Characteristics (Tc= 25 unless otherwise specified)
OFF Characteristics
VDSS Drain to Source Breakdown Voltage VGS=0V, ID=250A 300 V
BVDSS/TJ Bvdss Temperature Coefficient ID=250uA,Reference25 0.55 V/
IDSS Drain to Source Leakage Current VDS=300V, VGS=0V,Ta=25 10 A
VDS=240V, VGS=0V,Ta=125 100 A
IGSS(F) Gate to Source Forward Leakage VGS=+30V 100 nA
IGSS(R) Gate to Source Reverse Leakage VGS=-30V -100 nA
ON Characteristics
RDS(ON) Drain-to-Source On-Resistance VGS=10V,ID=10.0A 0.17 - 0.22
VGS(TH) Gate Threshold Voltage VDS=VGS,ID=250A 2.0 - 4.0 V
gfs Forward Transconductance VDS=15V,ID=9A 13 S
Dynamic Characteristics
Ciss Input Capacitance VGS=0V VDS=25V f=1.0MHz 1900 pF
Coss Output Capacitance 132 pF
Crss Reverse Transfer Capacitance 10 pF
Resistive Switching Characteristics
td(ON) Turn-on Delay Time ID=9A,VDD=150V VGS=10V,Rg=6.1 26 ns
tr Rise Time 18 ns
td(OFF) Turn-Off Delay Time 50 ns
tf Fall Time 22 ns
Qg Total Gate Charge ID=18A,VDD=150V VGS=10V 33 nC
Qgs Gate to Source Charge 8.8 nC
Qgd Gate to Drain (Miller)Charge 10 nC
Source-Drain Diode Characteristics
ISD Continuous Source Current (Body Diode) 18 A
ISM Maximum Pulsed Current (Body Diode) 72 A
VSD Diode Forward Voltage IS=18A,VGS=0V 1.5 V
trr Reverse Recovery Time IS=18A,Tj=25 dIF/dt=100A/s,VGS=0V 360 ns
Qrr Reverse Recovery Charge 3.8 C

a1: Repetitive rating; pulse width limited by maximum junction temperature.
a3: L=10mH, ID=15A, Start TJ=25


2410121536_GL-GL18N30FA9_C3025198.pdf

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