axial Schottky barrier rectifier FUXINSEMI SR3100 with low forward voltage drop and high surge capability

Key Attributes
Model Number: SR3100
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
80A
Reverse Leakage Current (Ir):
500nA
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - DC Reverse (Vr) (Max):
100V
Diode Configuration:
Independent
Voltage - Forward(Vf@If):
850mV@3A
Current - Rectified:
3A
Mfr. Part #:
SR3100
Package:
DO-27
Product Description

Product Overview

The SR320 THRU SR3200 series are 3.0A Axial Schottky Barrier Rectifiers designed for through-hole mounting. These devices offer low power loss, high efficiency, and high current capability with ultra-high-speed switching. Featuring a silicon epitaxial planar chip with a metal silicon junction, they provide low forward voltage drop and high surge capability. A guardring is integrated for overvoltage protection. These rectifiers are suitable for applications requiring reliable and efficient rectification from 20V to 200V. Lead-free parts meet environmental standards of MIL-STD-19500/228.

Product Attributes

  • Brand: FUXIN SEMI
  • Chip Type: Silicon epitaxial planar chip, metal silicon junction
  • Case Material: Molded plastic, DO-201AD
  • Lead Material: Axial leads, solderable per MIL-STD-202, Method 208
  • Flame Retardant Rating: Epoxy : UL94-V0 rated
  • Environmental Compliance: Lead-free parts meet environmental standards of MIL-STD-19500 /228
  • Halogen-Free Option: Suffix "-H" for Halogen-free part (e.g., SR320-H)
  • Mounting Position: Any

Technical Specifications

Parameter Symbol Conditions MIN. TYP. MAX. UNIT
Forward rectified current IO TA = 25C 3.0 A
Forward surge current IFSM 8.3ms single half sine-wave (JEDEC methode) 80 A
Reverse current IR VR = VRRM J , TJ = 100C 0.5 mA
Maximum forward voltage VF IF = 3.0A, TJ = 25C See Fig.2 V
Thermal resistance Junction to ambient RJA 40 C/W
Thermal resistance Junction to lead RJL 10 C/W
Diode junction capacitance CJ f=1MHz and applied 4V DC reverse voltage 250 pF
Storage temperature TSTG -55 +150 C
Operating temperature TJ -55 +150 C
Model VRRM (V) VRMS (V) VR (V) VF (V) @ IF=3.0A IR (A) @ VR=VRRM, TJ=25C RJL (C/W)
SR320 20 14 20 0.55 100 10
SR330 30 21 30 0.55 100 10
SR340 40 28 40 0.55 100 10
SR345 45 32 45 0.55 100 10
SR350 50 35 50 0.70 100 10
SR360 60 42 60 0.70 100 10
SR380 80 56 80 0.85 100 10
SR3100 100 70 100 0.85 100 10
SR3150 150 105 150 0.92 100 10
SR3200 200 140 200 0.92 100 10

Mechanical Data

Case: Molded plastic, DO-201AD

Dimensions:

DO-201AD

  • Body Diameter: 0.220" (5.0mm) to 0.285" (7.2mm)
  • Length of Lead: 0.94" (24.0mm) MIN.
  • Overall Length: 1.25" (31.7mm) MAX.
  • Lead Diameter: 0.043" (1.10mm) to 0.051" (1.30mm)

Soldering Profile

Suggested thermal profiles for soldering processes are provided, with specific recommendations for lead-free wave soldering, including preheat, peak soldering temperature not to exceed 260C, and cool-down gradients.


2009181038_FUXINSEMI-SR3100_C784809.pdf

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