Silicon N Channel Transistor GL GL40N30A8 with TO 220AB Package and Enhanced Avalanche Energy Rating

Key Attributes
Model Number: GL40N30A8
Product Custom Attributes
Drain To Source Voltage:
300V
Current - Continuous Drain(Id):
40A
RDS(on):
90mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
45pF
Output Capacitance(Coss):
320pF
Pd - Power Dissipation:
340W
Input Capacitance(Ciss):
3.1nF
Gate Charge(Qg):
65nC@10V
Mfr. Part #:
GL40N30A8
Package:
TO-220AB
Product Description

Product Overview

The GL40N30A8 is a silicon N-channel Enhanced VDMOSFET manufactured using a self-aligned planar technology. This design contributes to reduced conduction losses, improved switching performance, and enhanced avalanche energy. It is suitable for various power switching circuits, promoting system miniaturization and higher efficiency. The device is packaged in a RoHS-compliant TO-220AB package.

Product Attributes

  • Brand: Guang Lei ()
  • Origin: Wuxi, China
  • Technology: Silicon N-Channel Enhanced VDMOSFET
  • Package Type: TO-220AB
  • Certification: RoHS Standard

Technical Specifications

Symbol Parameter Test Conditions Rating Units
Absolute Maximum Ratings (Tc=25 unless otherwise specified)
VDSS Drain-to-Source Voltage 300 V
ID Continuous Drain Current 40 A
ID Continuous Drain Current TC=100 C 28 A
IDM Pulsed Drain Current 160 A
VGS Gate-to-Source Voltage 30 V
EAS Single Pulse Avalanche Energy 1200 mJ
EAR Avalanche Energy, Repetitive 100 mJ
IAR Avalanche Current 6.5 A
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
PD Power Dissipation 340 W
Derating Factor above 25C 2.72 W/
TJ, Tstg Operating Junction and Storage Temperature Range 55 to 150
TL Maximum Temperature for Soldering 300
Electrical Characteristics (Tc= 25 unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Units
VDSS Drain to Source Breakdown Voltage VGS=0V,ID=250A 300 -- -- V
BVDSS/TJ Bvdss Temperature Coefficient ID=250uA,Reference25 -- 0.2 -- V/
IDSS Drain to Source Leakage Current VDS=300V, VGS=0V,Ta=25 -- -- 1.0 A
IDSS Drain to Source Leakage Current VDS=240V, VGS=0V,Ta=125 -- -- 100 A
IGSS(F) Gate to Source Forward Leakage VGS=+30V -- -- 100 nA
IGSS(R) Gate to Source Reverse Leakage VGS=-30V -- -- -100 nA
RDS(ON) Drain-to-Source On-Resistance VGS=10V,ID=20A -- 75 90 m
VGS(TH) Gate Threshold Voltage VDS=VGS,ID=250A 2.0 -- 4.0 V
gfs Forward Transconductance VDS=15V,ID=20A -- 25 -- S
Dynamic Characteristics
Ciss Input Capacitance VGS=0V, VDS=25V, f=1.0MHz -- 3100 -- pF
Coss Output Capacitance -- 320 -- pF
Crss Reverse Transfer Capacitance -- 45 -- pF
Resistive Switching Characteristics
td(ON) Turn-on Delay Time ID=40A,VDD=150V, VGS=10V,Rg=12 -- 35 -- ns
tr Rise Time -- 82 -- ns
td(OFF) Turn-Off Delay Time -- 180 -- ns
tf Fall Time -- 90 -- ns
Qg Total Gate Charge ID=40A,VDD=150V, VGS=10V -- 65 -- nC
Qgs Gate to Source Charge -- 15 -- nC
Qgd Gate to Drain (Miller)Charge -- 35 -- nC
Source-Drain Diode Characteristics
ISD Continuous Source Current (Body Diode) -- -- 40 A
ISM Maximum Pulsed Current (Body Diode) -- -- 160 A
VSD Diode Forward Voltage IS=40A,VGS=0V -- -- 1.5 V
trr Reverse Recovery Time IS=40A,Tj=25, dIF/dt=100A/s,VGS=0V -- 400 -- ns
Qrr Reverse Recovery Charge -- 3.4 -- C
Thermal Characteristics
RJC Thermal Resistance, Junction-to-Case 0.37 / W
RJA Thermal Resistance, Junction-to-Ambient 62 / W

Applications

  • Power switch circuit of adaptors and chargers

2410121449_GL-GL40N30A8_C2880535.pdf

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