Load Switch MOSFET GL GL5N04 Featuring Low Reverse Transfer Capacitance and High Pulsed Drain Current Capability

Key Attributes
Model Number: GL5N04
Product Custom Attributes
Drain To Source Voltage:
40V
Current - Continuous Drain(Id):
5A
RDS(on):
60mΩ@4.5V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
50pF
Number:
1 N-channel
Output Capacitance(Coss):
130pF
Input Capacitance(Ciss):
620pF
Pd - Power Dissipation:
1.4W
Gate Charge(Qg):
10nC@10V
Mfr. Part #:
GL5N04
Package:
SOT-23-3L
Product Description

Product Overview

The GL5N04 is a Silicon N-Channel Power MOSFET from Wuxi Guang Lei electronic technology co., LTD, utilizing advanced trench technology for excellent RDS(ON) and low gate charge. It is designed for a wide variety of applications including PWM applications, load switches, and power management. The SOT-23-3L package complies with RoHS standards. Key features include fast switching, low gate charge and Rdson, low reverse transfer capacitances, and 100% single pulse avalanche energy testing.

Product Attributes

  • Brand: GL Silicon
  • Manufacturer: Wuxi Guang Lei electronic technology co., LTD
  • Package Type: SOT-23-3L
  • Compliance: RoHS standard
  • Channel Type: N-Channel

Technical Specifications

Symbol Parameter Test Conditions Rating Units
Absolute Ratings (Tc= 25 unless otherwise specified)
VDSS Drain-to-Source Voltage 40 V
ID Continuous Drain Current 5 A
ID Continuous Drain Current TC = 70 C 3.8 A
IDMa1 Pulsed Drain Current 20 A
VGS Gate-to-Source Voltage ±20 V
dv/dta3 Peak Diode Recovery dv/dt 5.0 V/ns
PD Power Dissipation 1.4 W
TJ,Tstg Operating Junction and Storage Temperature Range 55 to 150
TL Maximum Temperature for Soldering 300
Electrical Characteristics (Tc= 25 unless otherwise specified)
OFF Characteristics
VDSS Drain to Source Breakdown Voltage VGS=0V, ID=-250µA 40 V
ΔBVDSS/ΔTJ Bvdss Temperature Coefficient ID=-250uA,Reference25 -- 0.1 V/
IDSS Drain to Source Leakage Current VDS=40,VGS=0V,Ta=25 -- 1 µA
IDSS Drain to Source Leakage Current VDS=32V,VGS=0V,Ta=125 -- 250 µA
IGSS(F) Gate to Source Forward Leakage VGS=+20V -- 1 µA
IGSS(R) Gate to Source Reverse Leakage VGS=-20V -- -1 µA
ON Characteristics
RDS(ON) Drain-to-Source On-Resistance VGS=10V,ID=2.5A -- 30-45 mΩ
RDS(ON) Drain-to-Source On-Resistance VGS=4.5V,ID=2.5A -- 40-60 mΩ
VGS(TH) Gate Threshold Voltage VDS = VGS, ID = 250µA 1-2.5 V
Dynamic Characteristics
gfs Forward Transconductance VDS=15V,ID=5.0A 10 S
Ciss Input Capacitance VGS=0V,VDS=10V, f=1.0MHz -- 620 pF
Coss Output Capacitance -- 130 pF
Crss Reverse Transfer Capacitance -- 50 pF
Resistive Switching Characteristics
td(ON) Turn-on Delay Time ID=1.0A,VDD=15V, VGS=10V,RG=5.0Ω -- 7 ns
tr Rise Time -- 21 ns
td(OFF) Turn-Off Delay Time -- 27 ns
tf Fall Time -- 7 ns
Qg Total Gate Charge ID=5.0A,VDD=15V, VGS=10V -- 10 nC
Qgs Gate to Source Charge -- 1.9 nC
Qgd Gate to Drain (Miller)Charge -- 2.8 nC
Source-Drain Diode Characteristics
IS Continuous Source Current (Body Diode) -- 5.0 A
ISM Maximum Pulsed Current (Body Diode) -- 20 A
VSD Diode Forward Voltage IS=5.0A,VGS=0V -- 1.5 V
trr Reverse Recovery Time IS=5.0A,Tj = 25°C, dIF/dt=100A/us,VGS=0V -- 50 ns
Qrr Reverse Recovery Charge Pulse width tp≤380µs, δ≤2% -- 120 nC
RθJA Junction-to-Ambient 90 °C/W

2410121333_GL-GL5N04_C2890388.pdf

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