High surge current surface mount bridge rectifier Guangdong Hottech MB8F with transfer molded epoxy case
Product Overview
The MB05F-MB10F series are surface mount bridge rectifiers designed for printed circuit board applications. These UL Recognized Components offer high surge current capability and are housed in a plastic package with UL Flammability Classification 94V-0. They are suitable for various mounting positions and feature plated leads solderable per MIL-STD-750, Method 2026. Ratings are specified at 25C ambient temperature unless otherwise noted, for single phase, half wave, 60 Hz operation with resistive or inductive loads. Capacitive loads require a 20% current derating.
Product Attributes
- Brand: GUANGDONG HOTTECH INDUSTRIAL CO.,LTD
- Certification: UL Recognized Component
- Material: Transfer Molded Epoxy (Case)
- Flammability Classification: UL 94V-0
- Mounting Position: Any
- Terminal Plating: Solderable per MIL-STD-750, Method 2026
Technical Specifications
| Characteristic | Symbol | MB05F | MB1F | MB2F | MB4F | MB6F | MB8F | MB10F | Unit |
|---|---|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| Maximum RMS Voltage | VRMS | 35 | 70 | 140 | 280 | 420 | 560 | 700 | V |
| Maximum DC Blocking Voltage | VDC | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| Maximum Average Forward Rectified Current @TA=40C | I(AV) | 0.8 | A | ||||||
| Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method) | I FSM | 35 | A | ||||||
| Peak Forward Voltage at 0.8A DC | VFM | 1.0 | V | ||||||
| Maximum DC Reverse Current at Rated DC Blocking Voltage @TA=25C | IRM | 5.0 | A | ||||||
| Maximum DC Reverse Current at Rated DC Blocking Voltage @TA=100C | IRM | 500 | A | ||||||
| Typical Junction Capacitance | CJ | 15 | pF | ||||||
| Typical Thermal Resistance (Note 1) | RJA | 75 | C/W | ||||||
| Operating and Storage Temperature Range | Tj, TSTG | -55 to +150 | C | ||||||
Dimensions: Inches and (millimeters)
Note 1: On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad.
2410121513_Guangdong-Hottech-MB8F_C2886735.pdf
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