Fast Switching N Channel MOSFET HSBA6032 Featuring High Cell Density Trench Technology and Operation
Key Attributes
Model Number:
HSBA6032
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
60A
Operating Temperature -:
-55℃~+150℃
RDS(on):
7.1mΩ@10V,20A
Gate Threshold Voltage (Vgs(th)):
1.2V
Reverse Transfer Capacitance (Crss@Vds):
151pF@30V
Number:
1 N-channel
Input Capacitance(Ciss):
3.307nF@30V
Pd - Power Dissipation:
52W
Gate Charge(Qg):
57nC@10V
Mfr. Part #:
HSBA6032
Package:
PRPAK5x6-8L
Product Description
Product Overview
The HSBA6032 is a high cell density trenched N-channel Fast Switching MOSFET designed for synchronous buck converter applications. It offers excellent RDS(ON) and gate charge characteristics. This product meets RoHS and Green Product requirements, is 100% EAS guaranteed, and has full function reliability approval. Its advanced high cell density Trench technology contributes to its superior performance.Product Attributes
- Brand: HS-Semi
- Product Type: N-Channel MOSFET
- Switching Speed: Fast Switching
- Technology: Advanced high cell density Trench technology
- Certifications: RoHS, Green Product
- Reliability: 100% EAS Guaranteed, Full function reliability approved
Technical Specifications
| Product Summary | Symbol | Parameter | Conditions | Min. | Typ. | Max. | Unit | |
|---|---|---|---|---|---|---|---|---|
| HSBA6032 | BVDSS | Drain-Source Breakdown Voltage | VGS=0V , ID=250uA | 60 | --- | --- | V | |
| RDS(ON) | Static Drain-Source On-Resistance | VGS=10V , ID=20A | --- | 7.1 | 8.5 | m | ||
| VGS=4.5V , ID=15A | --- | 9.5 | 12 | m | ||||
| VGS(th) | Gate Threshold Voltage | VGS=VDS , ID =250uA | 1.2 | --- | 2.5 | V | ||
| IDSS | Drain-Source Leakage Current | VDS=48V , VGS=0V , TJ=25 | --- | --- | 1 | uA | ||
| VDS=48V , VGS=0V , TJ=55 | --- | --- | 5 | uA | ||||
| IGSS | Gate-Source Leakage Current | VGS=20V , VDS=0V | --- | --- | 100 | nA | ||
| Rg | Gate Resistance | VDS=0V , VGS=0V , f=1MHz | --- | 1.2 | --- | |||
| Qg | Total Gate Charge (10V) | VDS=30V , VGS=10V , ID=20A | --- | 57 | --- | nC | ||
| Qgs | Gate-Source Charge | --- | 8.7 | --- | nC | |||
| Qgd | Gate-Drain Charge | --- | 14 | --- | nC | |||
| Td(on) | Turn-On Delay Time | VDD=30V , VGS=10V , RG=3.3, ID=20A | --- | 16.2 | --- | ns | ||
| Tr | Rise Time | --- | 41.2 | --- | ns | |||
| Td(off) | Turn-Off Delay Time | --- | 56.4 | --- | ns | |||
| Tf | Fall Time | --- | 16.2 | --- | ns | |||
| Ciss | Input Capacitance | VDS=30V , VGS=0V , f=1MHz | --- | 3307 | --- | pF | ||
| Coss | Output Capacitance | --- | 201 | --- | pF | |||
| Crss | Reverse Transfer Capacitance | --- | 151 | --- | pF | |||
| IS | Continuous Source Current | VG=VD=0V , Force Current | --- | --- | 60 | A | ||
| VSD | Diode Forward Voltage | VGS=0V , IS=1A , TJ=25 | --- | --- | 1.2 | V | ||
| trr | Reverse Recovery Time | IF=20A , dI/dt=100A/s , TJ=25 | --- | 22 | --- | nS | ||
| Qrr | Reverse Recovery Charge | --- | 72 | --- | nC | |||
| Absolute Maximum Ratings | Parameter | Rating | Units | |
|---|---|---|---|---|
| VDS | Drain-Source Voltage | 60 | V | |
| VGS | Gate-Source Voltage | 20 | V | |
| ID@TC=25 | Continuous Drain Current, VGS @ 10V1 | 60 | A | |
| ID@TC=100 | Continuous Drain Current, VGS @ 10V1 | 38 | A | |
| IDM | Pulsed Drain Current2 | 280 | A | |
| EAS | Single Pulse Avalanche Energy3 | 80 | mJ | |
| IAS | Avalanche Current | 40 | A | |
| PD@TC=25 | Total Power Dissipation4 | 52 | W | |
| TSTG | Storage Temperature Range | -55 to 150 | ||
| TJ | Operating Junction Temperature Range | -55 to 150 |
| Thermal Data | Parameter | Conditions | Typ. | Max. | Unit |
|---|---|---|---|---|---|
| RJA | Thermal Resistance Junction-ambient1 | --- | 62 | /W | |
| RJC | Thermal Resistance Junction-case1 | --- | 2.4 | /W |
| Package | Dimensions |
|---|---|
| PRPAK5X6 | (See attached diagram) |
2409291036_HUASHUO-HSBA6032_C508830.pdf
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