Fast switching MOSFET HUASHUO HSSX2303 dual P channel 20V with trench technology and low gate charge

Key Attributes
Model Number: HSSX2303
Product Custom Attributes
Drain To Source Voltage:
20V
Current - Continuous Drain(Id):
800mA
RDS(on):
800mΩ@4.5V,0.8A
Operating Temperature -:
-55℃~+150℃@(Tj)
Gate Threshold Voltage (Vgs(th)):
-
Reverse Transfer Capacitance (Crss@Vds):
10pF@6V
Number:
2 P-Channel
Input Capacitance(Ciss):
145pF@6V
Pd - Power Dissipation:
150mW
Gate Charge(Qg):
18nC@4.5V
Mfr. Part #:
HSSX2303
Package:
SOT-563
Product Description

Product Overview

The HSSX2303 is a dual P-channel, 20V fast switching MOSFET designed for high-density trench technology. It offers excellent RDS(ON) and gate charge, making it suitable for synchronous buck converter applications. This product meets RoHS and Green Product requirements with full function reliability approval. Key features include super low gate charge, low threshold voltage, and suitability for high-side switching. The MOSFET is ESD protected up to 2KV.

Product Attributes

  • Brand: HS-Semi
  • Certifications: RoHS, Green Product
  • Technology: Advanced high cell density Trench technology
  • Protection: ESD Protected up to 2KV

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage -20 V
VGS Gate-Source Voltage 8 V
ID@TA=25 Continuous Drain Current, VGS @ -4.5V1 -0.8 A
IDM Pulsed Drain Current2 -3 A
PD@TA=25 Total Power Dissipation3 0.15 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient --- 800 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=-250uA -20 --- --- V
BVDSS/TJ BVDSS Temperature Coefficient Reference to 25 , ID=-1mA --- -0.014 --- V/
RDS(ON) Static Drain-Source On-Resistance2 VGS=-4.5V , ID=-0.8A --- 600 800 m
VGS=-2.5V , ID=-0.6A --- 800 1000 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =-250uA -0.5 -0.67 -1.0 V
--- 3.95 --- mV/
IDSS Drain-Source Leakage Current VDS=-16V , VGS=0V , TJ=25 --- --- -1 uA
VDS=-16V , VGS=0V , TJ=55 --- --- -5 uA
IGSS Gate-Source Leakage Current VGS=8V , VDS=0V --- --- 10 uA
Qg Total Gate Charge (-4.5V) VDS=-6V , VGS=-4.5V , ID=-0.8A --- 18 --- nC
Qgs Gate-Source Charge --- 4.2
Qgd Gate-Drain Charge --- 2.6
Timing Td(on) Turn-On Delay Time VDD=-6V , VGS=-4.5V , RG=6, ID=-0.8A --- 6 --- ns
Tr Rise Time --- 12 ---
Td(off) Turn-Off Delay Time --- 25 ---
Tf Fall Time --- 6.8 ---
Capacitance Ciss Input Capacitance VDS=-6V , VGS=0V , f=1MHz --- 145 --- pF
Coss Output Capacitance --- 115 ---
Crss Reverse Transfer Capacitance --- 10 ---
Diode Characteristics
VSD Diode Forward Voltage2 VGS=0V , IS=-1A , TJ=25 --- --- -1.2 V
Ordering Information
Part Number Package code Packaging
HSSX2303 SOT-563 3000/Tape&Reel

Notes:
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width 300us, duty cycle 2%.
3. The power dissipation is limited by 150 junction temperature.
4. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.


2410121435_HUASHUO-HSSX2303_C7543682.pdf
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