N Channel MOSFET HUASHUO HSH6040 Featuring Trench Technology and Low Gate Charge for Power Switching

Key Attributes
Model Number: HSH6040
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
140A
Operating Temperature -:
-55℃~+150℃
RDS(on):
5.2mΩ@10V,18A
Gate Threshold Voltage (Vgs(th)):
2.5V
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
245pF
Number:
1 N-channel
Input Capacitance(Ciss):
4.706nF
Output Capacitance(Coss):
325pF
Pd - Power Dissipation:
166W
Gate Charge(Qg):
75nC@10V
Mfr. Part #:
HSH6040
Package:
TO-263
Product Description

Product Overview

The HSH6040 is a high cell density trenched N-channel MOSFET designed for fast switching applications. It offers excellent RDS(ON) and gate charge, making it ideal for synchronous buck converter applications. This MOSFET meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approval. Key features include super low gate charge, excellent CdV/dt effect decline, and advanced high cell density trench technology.

Product Attributes

  • Brand: HSH
  • Type: N-Channel MOSFET
  • Technology: Trench
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed

Technical Specifications

Model Parameter Conditions Min. Typ. Max. Units
HSH6040 Drain-Source Voltage (VDS) 60 V
Gate-Source Voltage (VGS) ±20 V
Continuous Drain Current (ID@TC=25, VGS @ 10V) 140 A
Continuous Drain Current (ID@TC=100, VGS @ 10V) 90 A
Pulsed Drain Current (IDM) 300 A
Single Pulse Avalanche Energy (EAS) 125 mJ
Avalanche Current (IAS) 50 A
Total Power Dissipation (PD@TC=25) 166 W
Storage Temperature Range (TSTG) -55 150
Operating Junction Temperature Range (TJ) -55 150
Thermal Resistance Junction-Ambient (RJA) --- 62 /W
Thermal Resistance Junction-Case (RJC) --- 0.75 /W
Drain-Source Breakdown Voltage (BVDSS) VGS=0V, ID=250uA 60 --- --- V
Static Drain-Source On-Resistance (RDS(ON),typ) VGS=10V, ID=18A --- 4.3 5.2 m
Static Drain-Source On-Resistance (RDS(ON),typ) VGS=4.5V, ID=10A --- 6 7 m
Gate Threshold Voltage (VGS(th)) VGS=VDS, ID =250uA 1.2 --- 2.5 V
Drain-Source Leakage Current (IDSS) VDS=48V, VGS=0V, TJ=25 --- --- 1 uA
Drain-Source Leakage Current (IDSS) VDS=48V, VGS=0V, TJ=55 --- --- 5 uA
Gate-Source Leakage Current (IGSS) VGS=±20V, VDS=0V --- --- ±100 nA
Forward Transconductance (gfs) VDS=10V, ID=30A --- 75 --- S
Gate Resistance (Rg) VDS=0V, VGS=0V, f=1MHz --- 0.7 ---
Total Gate Charge (Qg) VDS=48V, VGS=10V, ID=18A --- 75 --- nC
Gate-Source Charge (Qgs) --- 15.5 --- nC
Gate-Drain Charge (Qgd) --- 20.3 --- nC
Turn-On Delay Time (Td(on)) VDD=30V, VGS=10V, RG=3.3, ID=18A --- 18.5 --- ns
Rise Time (Tr) --- 8.8 --- ns
Turn-Off Delay Time (Td(off)) --- 58.8 --- ns
Fall Time (Tf) --- 15.8 --- ns
Input Capacitance (Ciss) VDS=15V, VGS=0V, f=1MHz --- 4706 --- pF
Output Capacitance (Coss) --- 325 --- pF
Reverse Transfer Capacitance (Crss) --- 245 --- pF
Continuous Source Current (IS) VG=VD=0V, Force Current --- --- 140 A
Diode Forward Voltage (VSD) VGS=0V, IS=1A, TJ=25 --- --- 1.2 V
Reverse Recovery Time (trr) IF=18A, di/dt=100A/s, TJ=25 --- 22.9 --- nS
Reverse Recovery Charge (Qrr) --- 11.6 --- nC

2410121448_HUASHUO-HSH6040_C845624.pdf
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