Power switching Huixin H12N90 N Channel MOSFET featuring low gate charge and robust avalanche testing

Key Attributes
Model Number: H12N90
Product Custom Attributes
Drain To Source Voltage:
900V
Current - Continuous Drain(Id):
12A
Operating Temperature -:
-55℃~+150℃
RDS(on):
750mΩ@10V
Gate Threshold Voltage (Vgs(th)):
4V
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
30pF
Number:
1 N-channel
Output Capacitance(Coss):
260pF
Pd - Power Dissipation:
300W
Input Capacitance(Ciss):
2.7nF
Gate Charge(Qg):
72nC@10V
Mfr. Part #:
H12N90
Package:
TO-3PB
Product Description

Product Overview

The H12N90 is a high-performance N-Channel MOSFET designed for power switching applications. It features low gate charge, low Crss, and is 100% avalanche tested, making it suitable for demanding applications. This RoHS compliant device offers robust performance and reliability.

Product Attributes

  • Brand: Not specified
  • Origin: Not specified
  • Material: Not specified
  • Color: Not specified
  • Certifications: RoHS compliant, UL

Technical Specifications

SymbolParameterTest ConditionsMinTypMaxUnit
Maximum Ratings
PDPower Dissipation(TC = 25C)----300W
Derate Above 25C----1.4W/C
TJ, TSTGOperating and Storage Temperature Range---55--+150C
TLMaximum Lead Temperature for Soldering Purpose, 1/8 from Case for 5 Seconds------300C
RJCThermal Resistance, Junction to Case, Max----0.42C/W
RJAThermal Resistance, Junction to Ambient, Max----40C/W
VDSSDrain to Source Voltage------900V
IDDrain Current - Continuous(TC = 25C)----12A
IDDrain Current - Continuous(TC = 100C)----7.5A
IDMDrain Current - Pulsed (Note 1)------48A
VGSSGate to Source Voltage---30--+30V
EASSingle Pulsed Avalanche Energy (Note 2)----1200mJ
IARAvalanche Current (Note 1)----11.4A
EARRepetitive Avalanche Energy (Note 1)----30mJ
dv/dtPeak Diode Recovery dv/dt (Note 3)----5.0V/ns
Electrical Characteristics
BVDSSDrain-Source Breakdown VoltageVGS = 0 V, ID = 250 A900----V
BVDSS / TJBreakdown Voltage Temperature CoefficientID = 250 A, Referenced to 25C--1.0--V/C
IDSSZero Gate Voltage Drain CurrentVDS = 900 V, VGS = 0 V----1.0A
IDSSZero Gate Voltage Drain CurrentVDS = 720 V, TC = 125C----125A
IGSSFGate-Body Leakage Current, ForwardVGS = 30 V, VDS = 0 V----100nA
IGSSRGate-Body Leakage Current, ReverseVGS = -30 V, VDS = 0 V-----100nA
VGS(th)Gate Threshold VoltageVDS = VGS, ID = 250 A2.0--4.0V
RDS(on)Static Drain-Source On-ResistanceVGS = 10 V, ID = 5.7 A--0.750.96
gFSForward TransconductanceVDS = 25 V, ID = 5.7 A--32--S
CissInput CapacitanceVDS = 25 V, VGS = 0 V, f = 1.0 MHz--27003500pF
CossOutput Capacitance----260340pF
CrssReverse Transfer Capacitance----3040pF
td(on)Turn-On Delay TimeVDD = 450 V, ID = 11.4 A, RG = 25 (note 4)--65140ns
trTurn-On Rise Time----135280ns
td(off)Turn-Off Delay Time----165340ns
tfTurn-Off Fall Time----90190ns
QgTotal Gate ChargeVDS = 720 V, ID = 11.4 A, VGS = 10 V (note 4)--7294nC
QgsGate-Source Charge----16--nC
QgdGate-Drain Charge----35--nC
Drain-Source Diode Characteristics and Maximum Ratings
ISMaximum Continuous Drain-Source Diode Forward Current------11.4A
ISMMaximum Pulsed Drain-Source Diode Forward Current------45.6A
VSDDrain-Source Diode Forward VoltageVGS = 0 V, IS = 11.4 A----1.4V
trrReverse Recovery TimeVGS = 0 V, IS = 11.4 A, dIF / dt = 100 A/s--850--ns
QrrReverse Recovery Charge----11.2--C

2507301400_Huixin-H12N90_C49435647.pdf

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