Fast switching trench technology MOSFET HUASHUO HSM4407 30V P channel for power management solutions

Key Attributes
Model Number: HSM4407
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
11.5A
Operating Temperature -:
-55℃~+150℃
RDS(on):
16mΩ@4.5V,10A
Gate Threshold Voltage (Vgs(th)):
1V
Reverse Transfer Capacitance (Crss@Vds):
237pF@15V
Number:
1 P-Channel
Input Capacitance(Ciss):
2.215nF@15V
Pd - Power Dissipation:
1.5W
Gate Charge(Qg):
20nC@4.5V
Mfr. Part #:
HSM4407
Package:
SOP-8
Product Description

Product Overview

The HSM4407 is a P-channel, 30V fast-switching MOSFET featuring high cell density trench technology. It offers excellent RDS(ON) and gate charge, making it suitable for most synchronous buck converter applications. This device meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approval. Key advantages include super low gate charge, excellent CdV/dt effect decline, and advanced high cell density trench technology.

Product Attributes

  • Brand: HS-Semi
  • Product Type: P-Ch MOSFETs
  • Technology: Trench
  • Certifications: RoHS, Green Product
  • EAS Guaranteed: 100%
  • Package: SOP-8
  • Packaging: Tape&Reel (4000/Tape&Reel)

Technical Specifications

Model Parameter Conditions Min. Typ. Max. Unit
HSM4407 Drain-Source Voltage (VDS) -30 V
Gate-Source Voltage (VGS) ±20 V
Continuous Drain Current (ID@TA=25) VGS @ -10V -11.5 A
Continuous Drain Current (ID@TA=70) VGS @ -10V -9 A
Pulsed Drain Current (IDM) -46 A
Single Pulse Avalanche Energy (EAS) 125 mJ
Avalanche Current (IAS) -50 A
Total Power Dissipation (PD@TA=25) 1.5 W
Storage Temperature Range (TSTG) -55 150
Operating Junction Temperature Range (TJ) -55 150
Drain-Source Breakdown Voltage (BVDSS) VGS=0V , ID=-250uA -30 V
Static Drain-Source On-Resistance (RDS(ON),max) VGS=-10V , ID=-10A 10 15 m
Static Drain-Source On-Resistance (RDS(ON),max) VGS=-4.5V , ID=-10A 16 25 m
Gate Threshold Voltage (VGS(th)) VGS=VDS , ID =-250uA -1.0 -2.5 V
Drain-Source Leakage Current (IDSS) VDS=-24V , VGS=0V , TJ=25 -1 μA
HSM4407 Drain-Source Leakage Current (IDSS) VDS=-24V , VGS=0V , TJ=55 -5 μA
Gate-Source Leakage Current (IGSS) VGS=±20V , VDS=0V ±100 nA
Forward Transconductance (gfs) VDS=-5V , ID=-10A 24 S
Gate Resistance (Rg) VDS=0V , VGS=0V , f=1MHz 9 Ω
Total Gate Charge (Qg) VDS=-15V , VGS=-4.5V , ID=-10A 20 nC
Gate-Source Charge (Qgs) 5.1 nC
Gate-Drain Charge (Qgd) 7.3 nC
Turn-On Delay Time (Td(on)) VDD=-15V , VGS=-10V , RG=3.3Ω ID=-1A 33.8 ns
Rise Time (Tr) 35.8 ns
Turn-Off Delay Time (Td(off)) 72.8 ns
Fall Time (Tf) 10.6 ns
Input Capacitance (Ciss) VDS=-15V , VGS=0V , f=1MHz 2215 pF
Output Capacitance (Coss) 310 pF
Reverse Transfer Capacitance (Crss) 237 pF
Continuous Source Current (IS) VG=VD=0V , Force Current -11.5 A
HSM4407 Diode Forward Voltage (VSD) VGS=0V , IS=-1A , TJ=25 -1 V
Thermal Resistance Junction-Ambient (RJA) (t≤10s) 40 /W
HSM4407 Thermal Resistance Junction-Ambient (RJA) 75 /W
HSM4407 Thermal Resistance Junction-Case (RJC) 24 /W

2410121516_HUASHUO-HSM4407_C508781.pdf
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