IGBT Transistor HXY MOSFET BIDW50N65T-HXY Featuring Reduced Conduction Losses for Motor Drives and UPS

Key Attributes
Model Number: BIDW50N65T-HXY
Product Custom Attributes
Td(off):
122ns
Pd - Power Dissipation:
300W
Td(on):
24ns
Collector-Emitter Breakdown Voltage (Vces):
650V
Reverse Transfer Capacitance (Cres):
92pF
IGBT Type:
FS (Field Stop)
Gate-Emitter Threshold Voltage (Vge(th)@Ic):
4.5V@1mA
Gate Charge(Qg):
179nC@15V
Reverse Recovery Time(trr):
98ns
Switching Energy(Eoff):
1.14mJ
Turn-On Energy (Eon):
1.38mJ
Input Capacitance(Cies):
3.363nF
Pulsed Current- Forward(Ifm):
200A
Output Capacitance(Coes):
206pF
Mfr. Part #:
BIDW50N65T-HXY
Package:
TO-247
Product Description

Product Overview

The BIDW50N65T is an Insulated Gate Bipolar Transistor (IGBT) utilizing advanced Trench and Field Stop (T-FS) technology. This design enhances performance by reducing conduction losses, improving switching speed, and increasing avalanche energy capability. It is suitable for applications such as UPS, motor drives, boost converters, and portable power stations.

Product Attributes

  • Brand: HUAXUANYANG
  • Model: BIDW50N65T
  • Origin: Shenzhen HuaXuanYang Electronics CO.,LTD
  • Technology: Trench and Field Stop (T-FS)
  • Certifications: Halogen Free, Green Devices Available, RoHS Compliant
  • Package Type: TO-247

Technical Specifications

ParameterValueUnitConditions
Absolute Ratings
VCES650V
IC100A@TC=25C
IC50A@TC=100C
ICM200APulsed Collector Current, tp limited by TJmax
IF100ADiode Continuous Forward Current @TC=25C
IF50ADiode Continuous Forward Current @TC=100C
IFM200ADiode Maximum Forward Current, limited by TJmax
VGES30V
tSC4sShort circuit withstand time VGE=15V, VCC400V, allowed number of short circuits<1000, times between short circuits1.0s, TJ175C
PD300W@TC=25C
TJmax, Tstg55 to 175Operating Junction and Storage Temperature Range
TL260Maximum Temperature for Soldering
Thermal Characteristics
RJC (IGBT)0.50/WJunction-to-Case
RJC (Diode)0.65/WJunction-to-Case
RJA40/WJunction-to-Ambient
Electrical Characteristics (Static)
VCES (Breakdown Voltage)650VVGE =0V, IC=1mA
VCE(sat)1.65VVGE =15V, IC =50A, TJ=25 (Typ.)
VGE(TH) (Gate Threshold Voltage)4.5 - 6.5VVCE=VGE, IC=1mA
VF (Diode Forward Voltage)1.45VIF=50A, TJ=25 (Typ.)
ICES (Leakage Current)10AVCE=650V, VGE=0V (Max.)
IGES(F) (Gate Forward Leakage)100nAVGE=+20V (Max.)
IGES(R) (Gate Reverse Leakage)-100nAVGE=-20V (Max.)
Electrical Characteristics (Dynamic)
Cies (Input Capacitance)3363pFVGE=0V, VCE=25V, f=1.0MHz (Typ.)
Coes (Output Capacitance)206pF(Typ.)
Cres (Reverse Transfer Capacitance)92pF(Typ.)
Qg (Gate Charge)179nCVCC=520V, ICE=50A, VGE=15V (Typ.)
Qge (Gate-Emitter Charge)31nC(Typ.)
Qgc (Gate-Collector Charge)87nC(Typ.)
IC(SC) (Short Circuit Collector Current)469AVGE=15V,VCC400V, tSC4s,TJ175 (Max.)
IGBT Switching Characteristics (TJ=25)
td(on) (Turn-on Delay Time)24nsIC=50A, VCC=400V, VGE=15V, Rg=5 (Typ.)
tr (Rise Time)86ns(Typ.)
td(off) (Turn-Off Delay Time)122ns(Typ.)
tf (Fall Time)74ns(Typ.)
Eon (Turn-On Switching Loss)1.38mJ(Typ.)
Eoff (Turn-Off Switching Loss)1.14mJ(Typ.)
Ets (Total Switching Loss)2.52mJ(Typ.)
IGBT Switching Characteristics (TJ=175)
td(on) (Turn-on Delay Time)33nsIC=50A, VCC=400V, VGE=15V, Rg=5 (Typ.)
tr (Rise Time)97ns(Typ.)
td(off) (Turn-Off Delay Time)146ns(Typ.)
tf (Fall Time)84ns(Typ.)
Eon (Turn-On Switching Loss)1.65mJ(Typ.)
Eoff (Turn-Off Switching Loss)1.32mJ(Typ.)
Ets (Total Switching Loss)2.97mJ(Typ.)
Diode Characteristics (TJ=25)
Trr (Reverse Recovery Time)98nsIF=50A, VCC=400V, di/dt=200A/s (Typ.)
Qrr (Reverse Recovery Charge)1580C(Typ.)
Irrm (Reverse Recovery Current)26A(Typ.)
Diode Characteristics (TJ=175)
Trr (Reverse Recovery Time)104nsIF=50A, VCC=400V, di/dt=200A/s (Typ.)
Qrr (Reverse Recovery Charge)1640C(Typ.)
Irrm (Reverse Recovery Current)27A(Typ.)

2509181737_HXY-MOSFET-BIDW50N65T-HXY_C49003330.pdf

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