Power MOSFET JSCJ CJFB30H20 N Channel with Plastic Encapsulate Package and Excellent Thermal Performance

Key Attributes
Model Number: CJFB30H20
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
20A
Operating Temperature -:
-55℃~+150℃
RDS(on):
12mΩ@4.5V
Gate Threshold Voltage (Vgs(th)):
1V
Reverse Transfer Capacitance (Crss@Vds):
100pF
Number:
1 N-channel
Input Capacitance(Ciss):
823pF@15V
Pd - Power Dissipation:
1.5W
Gate Charge(Qg):
13nC@10V
Mfr. Part #:
CJFB30H20
Package:
DFNWB-8(5x6)
Product Description

Product Overview

The CJFB30H20 is an N-Channel Power MOSFET utilizing advanced trench technology and design. It offers excellent RDS(ON) with low gate charge, making it suitable for a wide range of applications including full bridge switches, load switches, SMPS, general purpose applications, and hard switched/high frequency circuits. Key features include a high-density cell design for ultra-low RDS(ON), fully characterized avalanche voltage and current, good stability and uniformity with high EAS, an excellent package for heat dissipation, and special process technology for high ESD capability.

Product Attributes

  • Brand: JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD
  • Model: CJFB30H20
  • Package: DFNWB5x6-8L-E
  • Material: Plastic-Encapsulate
  • Origin: China (implied by manufacturer name)

Technical Specifications

ParameterSymbolTest ConditionMinTypMaxUnit
Maximum Ratings
Drain-Source VoltageVDS30V
Gate-Source VoltageVGS±20V
Continuous Drain CurrentIDTa=2520A
Pulsed Drain CurrentIDM100A
Single Pulsed Avalanche EnergyEAS(1)70mJ
Power DissipationPDTa=251.5W
Thermal Resistance from Junction to AmbientRJA(2)83.3/W
Junction TemperatureTJ150
Storage Temperature RangeTstg-55~+150
Lead Temperature for Soldering PurposesTL(1/8 from case for 10s)260
Off Characteristics
Drain-source breakdown voltageV(BR)DSSVGS = 0V, ID =250A30V
Zero gate voltage drain currentIDSSVDS =30V, VGS =0V1µA
Gate-body leakage currentIGSSVDS =0V, VGS =±20V±100nA
On Characteristics (note1)
Gate-threshold voltageVGS(th)VDS =VGS, ID =250A1.01.73.0V
Static drain-source on-sate resistanceRDS(on)VGS =10V, ID =10A8.512
Static drain-source on-sate resistanceRDS(on)VGS =4.5V, ID =10A1218
Forward transconductancegFSVDS =5V, ID =20A15S
Dynamic Characteristics (note 2)
Input capacitanceCissVDS =15V,VGS =0V, f =1MHz823pF
Output capacitanceCoss138
Reverse transfer capacitanceCrss100
Switching Characteristics (note 2)
Total gate chargeQgVDS=15V, VGS=10V, ID=9A13nC
Gate-source chargeQgs3
Gate-drain chargeQg4.5
Turn-on delay timetd(on)VDS=15V,VGS=10V, RL=1.8Ω,RGEN=3Ω10ns
Turn-on rise timetr8
Turn-off delay timetd(off)30
Turn-off fall timetf5
Drain-Source Diode Characteristics
Drain-source diode forward voltageVSDVGS =0V, IS=10A1.2V
Continuous drain-source diode forward currentIS20A
Pulsed drain-source diode forward currentISM100A
Reverse Recovery TimetrrTJ = 25°C, IF = 10A di/dt = 100A/μs(Note1)2235ns
Reverse Recovery ChargeQrrTJ = 25°C, IF = 10A di/dt = 100A/μs(Note1)1220nC

2411121115_JSCJ-CJFB30H20_C504192.pdf

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