High Voltage SIDAC Switch Littelfuse K1050G with Glass Passivated Junctions and Voltage Triggering Features
Product Description
The SIDAC is a silicon bilateral voltage triggered switch designed for high-voltage applications. It activates when the applied voltage exceeds its breakover voltage, transitioning through a negative resistance region to a low on-state voltage. Conduction is maintained until the current drops below the device's minimum holding current. Featuring glass-passivated junctions, these SIDACs offer ruggedness and reliability for demanding environments. They are suitable for AC circuits and provide triggering voltages ranging from 79V to 330V.
Product Attributes
- Brand: Teccor
- Origin: Littelfuse, Inc.
- Certifications: RoHS Compliant
- Material: Glass-passivated junctions
Technical Specifications
| Symbol | Parameters | Test Conditions | Min | Max | Unit | Kxxxzy Models |
|---|---|---|---|---|---|---|
| VBO | Breakover/Trigger Voltage | 79 | 330 | V | K0900y, K1050y, K1100y, K1200y, K1300y, K1400y, K1500y, K1800y, K200zy, K220zy, K240zy, K250zy, K300zy | |
| VDRM | Repetitive Peak Off-state Voltage | 70 | 200 | V | K0900y, K1050y, K1100y, K1200y, K1300y, K1400y, K1500y, K1800y, K200zy, K220zy, K240zy, K250zy, K300zy | |
| IT(RMS) | On-state RMS Current | 50/60Hz, TJ < 125C | 1 | A | All | |
| IDRM | Repetitive Peak Off-state Current | V = VDRM, 50/60Hz Sine Wave | 5 | µA | All | |
| VTM | Peak On-state Voltage | IT = 1A | 1.5 | 3.0 | V | Kxxx0y, Kxxx2y |
| IH | Dynamic Holding Current | RL = 100Ω, 50/60Hz Sine Wave | 150 | mA | All | |
| RS | Switching Resistance | (VBO – VS) / (IS – IBO), 50/60Hz Sine Wave | 100 | Ω | All | |
| IBO | Breakover Current | 50/60Hz Sine Wave | 10 | µA | All | |
| ITRM | Peak Repetitive Pulse Current | tp = 10µs, 60Hz | 80 | A | All | |
| ITSM | Peak Non-repetitive Surge Current | Single Cycle 60Hz | 20 | A | All | |
| di/dt | Critical Rate of Rise of On-state Current | 150 | A/µs | All | ||
| dv/dt | Critical Rate of Rise of Off-state Voltage | 1500 | V/µs | All | ||
| TS | Storage Temperature Range | -40 | 150 | °C | All | |
| TJ | Junction Temperature Range | -40 | 125 | °C | All | |
| RθJL | Thermal Resistance, Junction to Lead | DO-15 | 18 | °C/W | All | |
| RθJL | Thermal Resistance, Junction to Lead | DO-214 (1) | 30 | °C/W | All | |
| RθJC | Thermal Resistance, Junction to Case | TO-92 | 35 | °C/W | All | |
| RθJA | Thermal Resistance, Junction to Ambient | DO-15 | 75 | °C/W | All | |
| RθJA | Thermal Resistance, Junction to Ambient | TO-92 | 95 | °C/W | All |
Note: xxx = voltage, z = circuit function, y = package. (1) Mounted on 1 cm² copper foil surface; two-ounce copper foil.
Applications
Suitable for high voltage power supplies, natural gas igniters, high-pressure Sodium lamps, and Xenon flash ignition.
Design Considerations
Careful selection of the correct device for the application’s operating parameters and environment will go a long way toward extending the operating life of the Thyristor. Overheating and surge currents are the main killers of SIDACs. Correct mounting, soldering, and forming of the leads also help protect against component damage.
Soldering Parameters
Reflow Condition Pb – Free assembly
- Pre Heat - Temperature Min (Ts(min)): 150°C
- Pre Heat - Temperature Max (Ts(max)): 200°C
- Pre Heat - Time (min to max) (ts): 60 – 180 secs
- Average ramp up rate (Liquidus Temp) (TL) to peak: 5°C/second max
- TS(max) to TL - Ramp-up Rate: 5°C/second max
- Reflow - Temperature (TL) (Liquidus): 217°C
- Reflow - Temperature (tL): 60 – 150 seconds
- Peak Temperature (TP): 260+0/-5 °C
- Time within 5°C of actual peak Temperature (tp): 20 – 40 seconds
- Ramp-down Rate: 5°C/second max
- Time 25°C to peak Temperature (TP): 8 minutes Max.
- Do not exceed 280°C
Reliability/Environmental Tests
| Test | Specifications and Conditions |
|---|---|
| High Temperature Voltage Blocking | MIL-STD-750: Method 1040, Condition A, Rated VDRM (VAC-peak), 125°C, 1008 hours |
| Temperature Cycling | MIL-STD-750: Method 1051, -40°C to 150°C, 15-minute dwell, 100 cycles |
| Biased Temperature & Humidity | EIA/JEDEC: JESD22-A101, 80% min VBO (VDC), 85°C, 85%RH, 1008 hours |
| High Temp Storage | MIL-STD-750: Method 1031, 150°C, 1008 hours |
| Low-Temp Storage | -40°C, 1008 hours |
| Thermal Shock | MIL-STD-750: Method 1056, 0°C to 100°C, 5-minute dwell, 10-second transfer, 10 cycles |
| Autoclave (Pressure Cooker Test) | EIA/JEDEC: JESD22-A102, 121°C, 100%RH, 2atm, 168 hours |
| Resistance to Solder Heat | MIL-STD-750: Method 2031, 260°C, 10 seconds |
| Solderability | ANSI/J-STD-002: Category 3 |
| Lead Bend | MIL-STD-750: Method 2036, Condition E |
| Terminal Finish | 100% Matte Tin Plated / Pb-free Solder Dipped |
| Body Material | UL recognized epoxy meeting flammability classification 94V-0 |
| Lead Material | Copper Alloy |
Dimensions — DO-214
| Dimension | Inches | Millimeters |
|---|---|---|
| A | 0.130 - 0.156 | 3.30 - 3.95 |
| B | 0.201 - 0.220 | 5.10 - 5.60 |
| C | 0.077 - 0.087 | 1.95 - 2.20 |
| D | 0.159 - 0.181 | 4.05 - 4.60 |
| E | 0.030 - 0.063 | 0.75 - 1.60 |
| F | 0.075 - 0.096 | 1.90 - 2.45 |
| G | 0.002 - 0.008 | 0.05 - 0.20 |
| H | 0.077 - 0.104 | 1.95 - 2.65 |
| K | 0.006 - 0.016 | 0.15 - 0.41 |
Case Temperature Measurement Point: 0.079 (2.0)
Soldering Pad Outline
| Dimension | Inches | Millimeters |
|---|---|---|
| ØB | 0.028 - 0.034 | 0.711 - 0.864 |
| ØD | 0.120 - 0.140 | 3.04 |
Note: Measurements for ØD are approximate based on the provided diagram.
2410122014_Littelfuse-K1050G_C17675154.pdf
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