LRC S LN2308ELT1G 60V N Channel Power MOSFET with Super High Density Cell Design and RoHS Compliance

Key Attributes
Model Number: S-LN2308ELT1G
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
2.6A
RDS(on):
100mΩ@10V,2A
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.5V
Reverse Transfer Capacitance (Crss@Vds):
16pF@30V
Pd - Power Dissipation:
900mW
Input Capacitance(Ciss):
312pF@30V
Gate Charge(Qg):
3.3nC@30V
Mfr. Part #:
S-LN2308ELT1G
Package:
SOT-23
Product Description

Product Overview

The LN2308ELT1G and S-LN2308ELT1G are 60V N-Channel Power MOSFETs designed for efficient power management. They feature a super high-density cell design for extremely low RDS(ON) and exceptional on-resistance and maximum DC current capability. These MOSFETs are Gate to Source ESD Protected and are compliant with RoHS requirements and Halogen Free. The S- prefix variants are AEC-Q101 qualified and PPAP capable, suitable for automotive and other applications with unique site and control change requirements. Key applications include power management in notebooks, portable equipment, battery-powered systems, load switches, and DSCs.

Product Attributes

  • Brand: Leshan Radio Company, LTD.
  • Product Type: N-Channel Power MOSFET
  • Voltage Rating: 60V
  • Compliance: RoHS, Halogen Free
  • Certifications: AEC-Q101 qualified and PPAP capable (S- prefix models)
  • Material: RoHS compliant and Halogen Free
  • Packaging: Tape & Reel

Technical Specifications

Model Description Device Marking Shipping Package Drain-Source Voltage (VDSS) Gate-to-Source Voltage (VGS) - Continuous Drain Current (ID) - Continuous (TA = 25C) Drain Current (IDM) - Pulsed (Note 1) Maximum Power Dissipation (PD) Thermal Resistance, JunctiontoAmbient (RJA) (Note 2) Thermal Resistance, JunctiontoCase (RJC) Junction and Storage Temperature (TJ, Tstg) Drain-Source Breakdown Voltage (V(BR)DSS) (VGS = 0, ID = 250A) Gate Threshold Voltage (VGS(th)) (VDS = VGS, ID = 250A) Gate Body Leakage (IGSS) (VDS =0V, VGS =20V) Zero Gate Voltage Drain Current (IDSS) (VDS =48V, VGS =0V) Static DrainSource OnState Resistance (RDS(on)) (VGS = 10 V, ID = 2 A) Static DrainSource OnState Resistance (RDS(on)) (VGS = 4.5 V, ID = 2 A) Diode Forward Voltage (VSD) (IS =0.5A, VGS =0V) Total Gate Charge (Qg) (VDS =30V, VGS =4.5V, ID =2A) Gate-Source Charge (Qgs) Gate-Drain Charge (Qgd) Input Capacitance (Ciss) (VDS =30V, VGS =0V, f=1MHz) Output Capacitance (Coss) Reverse Transfer Capacitance (Crss) Turn-On Delay Time (td(on)) (VDD =30V, RL =30,ID =1A, VGEN =10V,RG =3) Turn-On Rise Time (tr) Turn-Off Delay Time (td(off)) Turn-Off Fall Time (tf) Gate Resistance (Rg) (VDS=0V ,VGS=0V, f=1.0MHz)
LN2308ELT1G 60V N-Channel Power MOSFET E08 10000/Tape&Reel SOT23(TO-236) 60 V 20 V 2.6 A 10.4 A 0.9 W 140 /W 105 /W -55~+150 60 V 1.5 - 2.5 V 10 A 1 A 0.05 0.06 0.7 - 1.3 V 16 nC 3.6 nC 3.3 nC 312 pF 120 pF 11 pF 17.1 ns 10.2 ns 10.2 ns 17.1 ns 4.8
S-LN2308ELT1G 60V N-Channel Power MOSFET E08 3000/Tape&Reel SOT23(TO-236) 60 V 20 V 2.6 A 10.4 A 0.9 W 140 /W 105 /W -55~+150 60 V 1.5 - 2.5 V 10 A 1 A 0.05 0.06 0.7 - 1.3 V 16 nC 3.6 nC 3.3 nC 312 pF 120 pF 11 pF 17.1 ns 10.2 ns 10.2 ns 17.1 ns 4.8
Note 1: Pulse width limited by the Maximum junction temperation.
Note 2: 1-in 2oz Cu PCB board.
Note 3: Pulse test; pulse width300s, duty cycle2%.

Dimensions (SOT23-TO-236):

Symbol Dimension Unit
A 0.89 - 1.11 mm
A1 0.01 - 0.1 mm
b 0.37 - 0.5 mm
c 0.09 - 0.18 mm
D 2.80 - 3.04 mm
E 2.10 - 2.64 mm
e 1.78 - 2.04 mm
L 0.10 - 0.3 mm
L1 0.35 - 0.69 mm
0 - 10 ---

2410010201_LRC-S-LN2308ELT1G_C5383044.pdf

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