Low Threshold Voltage Power MOSFET LBSS139LT1G with 1500V ESD Protection and AEC Q101 Qualification

Key Attributes
Model Number: LBSS139LT1G
Product Custom Attributes
Drain To Source Voltage:
50V
Current - Continuous Drain(Id):
200mA
Operating Temperature -:
-55℃~+150℃
RDS(on):
5.6Ω@2.75V,200mA
Gate Threshold Voltage (Vgs(th)):
1.5V@1.0mA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
2.9pF@25V
Number:
1 N-channel
Input Capacitance(Ciss):
22.8pF@25V
Pd - Power Dissipation:
225mW
Mfr. Part #:
LBSS139LT1G
Package:
SOT-23
Product Description

Product Overview

The LBSS139LT1G and S-LBSS139LT1G are N-Channel Power MOSFETs designed for low voltage applications. These devices feature a low threshold voltage (VGS(th): 0.5V to 1.5V) and ESD protection up to 1500V. The S-prefix variants are qualified for automotive applications requiring unique site and control change requirements, with AEC-Q101 qualification and PPAP capability. They are RoHS compliant and Halogen Free.

Product Attributes

  • Compliance: RoHS, Halogen Free
  • Automotive Qualification: AEC-Q101 qualified (S-prefix variants)
  • PPAP Capable: Yes (S-prefix variants)
  • ESD Protection: 1500V

Technical Specifications

Model Device Marking Shipping Description VDS (Vdc) ID (mAdc) IDM (mAmps) VGS(th) (V) RDS(on) (Ohms) VBRDSS (Vdc) IDSS (Adc) IGSSF (Adc) IGSSR (Adc) Ciss (pF) Coss (pF) Crss (pF) td(on) (ns) td(off) (ns) PD (mW) RJA (C/W) TJ,Tstg (C) TL (C)
LBSS139LT1G J2 3000/Tape&Reel Power MOSFET 50 200 800 0.5 to 1.5 - 50 - 5.6 -10 22.8 3.5 2.9 - - 225 556 -55 to +150 260
S-LBSS139LT1G J2 3000/Tape&Reel Power MOSFET 50 200 800 0.5 to 1.5 - 50 - 5.6 -10 22.8 3.5 2.9 - - 225 556 -55 to +150 260
LBSS139LT3G - 10000/Tape&Reel Power MOSFET 50 200 800 0.5 to 1.5 - 50 - 5.6 -10 22.8 3.5 2.9 - - 225 556 -55 to +150 260
Continuous Drain Current (ID) @ TA = 25C: 200 mAmps
Pulsed Drain Current (IDM) (tp10s): 800 mAmps
Gate-to-Source Voltage (VGS) Continuous: 20 Vdc
Total Device Dissipation (PD) @ TA = 25C: 225 mW
Derate above 25C: 1.8 mW/C
Thermal Resistance, JunctiontoAmbient (RJA) (Note 1): 556 C/W
Junction and Storage Temperature (TJ,Tstg): -55 to +150 C
Maximum Lead Temperature for Soldering Purposes, for 10 seconds (TL): 260 C
Drain-Source Breakdown Voltage (VBRDSS) (VGS = 0, ID = 250Adc): 50 Vdc
Zero Gate Voltage Drain Current (IDSS) (VGS = 0, VDS = 25 Vdc): 1 Adc
Zero Gate Voltage Drain Current (IDSS) (VGS = 0, VDS = 50 Vdc): 10 Adc
GateBody Leakage Current, Forward (IGSSF) (VGS = 20 Vdc): 10 Adc
GateBody Leakage Current, Reverse (IGSSR) (VGS = - 20 Vdc): -10 Adc
Gate Threshold Voltage (VGS(th)) (VDS = VGS, ID = 1.0mAdc): 0.5 to 1.5 Vdc
Static DrainSource OnState Resistance (RDS(on)) (VGS = 4.5 Vdc, ID = 200 mAdc): 1.2 Ohms (Typ. @ 25C)
Static DrainSource OnState Resistance (RDS(on)) (VGS = 10 Vdc, ID = 200 mAdc): 0.5 Ohms (Typ. @ 25C)
Forward Transconductance (gfs) (VDS = 25 Vdc, ID = 200 mAdc, f = 1.0 kHz): 100 mS (Typ.)
Input Capacitance (Ciss) (VDS = 25 Vdc, VGS = 0, f = 1.0 MHz): 22.8 pF (Typ.)
Output Capacitance (Coss) (VDS = 25 Vdc, VGS = 0, f = 1.0 MHz): 3.5 pF (Typ.)
Reverse Transfer Capacitance (Crss) (VDS = 25 Vdc, VGS = 0, f = 1.0 MHz): 2.9 pF (Typ.)
Turn-On Delay Time (td(on)): 19 ns (Typ.)
Turn-Off Delay Time (td(off)): 3.8 ns (Typ.)

Note 1: FR4 = 1.00.750.062 in.

Note 2: Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.


1912111437_LRC-LBSS139LT1G_C383203.pdf

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