Silicon N Channel Enhanced MOSFET Minos MP3205 for synchronous rectification inverter systems and switching

Key Attributes
Model Number: MP3205
Product Custom Attributes
Drain To Source Voltage:
55V
Current - Continuous Drain(Id):
110A
RDS(on):
9mΩ@10V
Operating Temperature -:
-55℃~+175℃
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
211pF@25V
Number:
1 N-channel
Input Capacitance(Ciss):
3.247nF@25V
Pd - Power Dissipation:
210W
Gate Charge(Qg):
146nC
Mfr. Part #:
MP3205
Package:
TO-220
Product Description

Product Description

The MP3205 is a silicon N-Channel Enhanced MOSFET designed using advanced MOSFET technology. This technology reduces conduction loss, improves switching performance, and enhances avalanche energy. It is suitable for synchronous rectification, inverter systems, high-speed switching, and general-purpose applications.

Product Attributes

  • Brand: MNS-KX (www.mns-kx.com)
  • Certifications: RoHS product

Technical Specifications

ParameterRatingUnitsConditionsMin.Typ.Max.
ABSOLUTE RATINGS
Drain-to-Source Voltage (VDSS)55V
Continuous Drain Current (ID)110ATC = 25C
Continuous Drain Current (ID)80ATC = 100C
Pulsed Drain Current (IDM)440A(Note1)
Gate-to-Source Voltage (VGS)±20V
Single Pulse Avalanche Energy (EAS)1500mJ(Note2)
Avalanche Current (IAR)25A
Repetitive Avalanche Current (EAR)20mJ
Peak Diode Recovery dv/dt5.0V/ns(Note3)
Power Dissipation (PD)210WTO-220
Derating Factor above 25C1.25W/
Operating Junction and Storage Temperature Range (TJ, Tstg)-55 to 175
Maximum Temperature for Soldering (TL)300
Thermal Characteristics
Junction-to-Case Thermal Resistance (RθJC)0.75/W(No FullPAK)
Junction-to-Ambient Thermal Resistance (RθJA)62.5/WTO-220
OFF Characteristics
Drain to Source Breakdown Voltage (BVDSS)55VVGS=0V, ID=250µA
Bvdss Temperature Coefficient (ΔBVDSS/ΔTJ)0.055V/ID=250uA, Reference25
Drain to Source Leakage Current (IDSS)1µAVDS=55V, VGS= 0V, Tj = 251
Drain to Source Leakage Current (IDSS)10µAVDS=44V, VGS= 0V, Tj = 12510
Gate to Source Forward Leakage (IGSS(F))100nAVGS =+20V100
Gate to Source Reverse Leakage (IGSS(R))100nAVGS =-20V100
ON Characteristics
Drain-to-Source On-Resistance (RDS(ON))9VGS=10V, ID=40A7.29
Gate Threshold Voltage (VGS(TH))4VVDS = VGS, ID = 250µA24
Forward Transconductance (gfs)65SVDS=20V, ID =40A(Note4)65
Dynamic Characteristics
Gate resistance (Rg)1.7Ωf = 1.0MHz1.7
Input Capacitance (Ciss)3247pFVGS = 0V, VDS = 25V, f = 1.0MHz3247
Output Capacitance (Coss)781pF781
Reverse Transfer Capacitance (Crss)211pF211
Source-Drain Diode Characteristics
Continuous Source Current (Body Diode) (IS)110ATC=25 °C110
Maximum Pulsed Current (Body Diode) (ISM)440A440
Diode Forward Voltage (VSD)1.3VIS=62A, VGS=0V0.91.3
Switching Characteristics
Turn-on Delay Time (td(ON))14nsID =62A, VDD =28V, VGS = 10V, RG =4.5Ω14
Rise Time (tr)101ns101
Turn-Off Delay Time (td(OFF))50ns50
Fall Time (tf)65ns65
Total Gate Charge (Qg)146nCID =62A, VDD =44V, VGS = 10V146
Gate to Source Charge (Qgs)10nC10
Gate to Drain (Miller)Charge (Qgd)17.5nC17.5
Reverse Recovery Time (trr)69nsIS=62A, Tj = 25°C, dIF/dt=100A/us, VGS=0V69
Reverse Recovery Charge (Qrr)143nC143

2410122024_Minos-MP3205_C2980269.pdf

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