Surface Mount MSKSEMI ABS10-MS Ultrafast Rectifier with Molded Plastic Body and Halogen Free Compound

Key Attributes
Model Number: ABS10-MS
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
30A
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - Forward(Vf@If):
950mV@400mA
Current - Rectified:
1A
Voltage - DC Reverse(Vr):
1kV
Mfr. Part #:
ABS10-MS
Package:
ABS
Product Description

ABS2-MS THRU ABS10-MS UltraFast Rectifier

The ABS2-MS through ABS10-MS series are surface mount ultrafast rectifiers designed for printed circuit board applications. They offer reliable, low-cost construction with a molded plastic body and glass passivated chip junction. These rectifiers are ideal for high-temperature soldering and provide high surge current capability. The series is environmentally friendly, utilizing a green compound free of halogen and Sb2O3.

Product Attributes

  • Brand: Msksemi
  • Construction: Molded plastic body
  • Chip Junction: Glass passivated
  • Compound: Green (halogen & Sb2O3 free)
  • Solderable per: MIL-STD-750, Method 2026
  • Mounting Position: Any

Technical Specifications

SymbolABS2-MSABS4-MSABS6-MSABS8-MSABS10-MSUnitsNotes
Maximum repetitive peak reverse voltage2004006008001000V
Maximum RMS voltage140280420560700V
Maximum DC blocking voltage2004006008001000V
Maximum average forward rectified current (On glass-epoxy P.C.B.)0.8A1
Maximum average forward rectified current (On aluminum substrate)1.0A2
Peak forward surge current, 8.3ms single half sine-wave30A
Maximum instantaneous forward voltage dropper leg at 0.4A0.95V
Maximum DC reverse current at rated DC blocking voltage (TA=25)5uA
Maximum DC reverse current at rated DC blocking voltage (TA=100)100uA
Typical thermal resistance (junction to lead)25/W3
Typical thermal resistance (junction to ambient)75/W3
Operating temperature range -55 to +150
Storage temperature range -55 to +150

Notes:
1. On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads
2. On aluminum substrate P.C.B. with an area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad
3. Thermal resistance from junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm) copper pads.


2312081752_MSKSEMI-ABS10-MS_C19272840.pdf

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