High Speed Switching Silicon MOSFET Minos MPF40N25 with RoHS Certification and Enhanced Performance

Key Attributes
Model Number: MPF40N25
Product Custom Attributes
Drain To Source Voltage:
250V
Current - Continuous Drain(Id):
40A
Operating Temperature -:
-55℃~+150℃@(Tj)
RDS(on):
65mΩ@10V,20A
Gate Threshold Voltage (Vgs(th)):
-
Reverse Transfer Capacitance (Crss@Vds):
2.5pF@25V
Number:
1 N-channel
Input Capacitance(Ciss):
3.7nF@25V
Pd - Power Dissipation:
310W
Gate Charge(Qg):
40nC@10V
Mfr. Part #:
MPF40N25
Package:
TO-220F
Product Description

Product Overview

The MPF40N25 is a silicon N-channel Enhanced MOSFET designed using advanced MOSFET technology. This technology minimizes conduction losses, enhances switching performance, and improves avalanche energy. It is an ideal device for Switch Mode Power Supplies (SMPS), high-speed switching, and general-purpose applications.

Product Attributes

  • Brand: MNS
  • Origin: Shenzhen Minos (implied from contact information)
  • Material: Silicon
  • Certifications: RoHS product

Technical Specifications

ParameterValueUnitConditionsNotes
KEY CHARACTERISTICS
VDS250V
ID40A
RDS(ON).Typ0.065
FEATURES
Fast Switching Low Crss 100% avalanche tested Improved dv/dt capability RoHS product
APPLICATIONS
High frequency switching mode power supply
ORDERING INFORMATION
Ordering CodesPackageProduct CodePacking
TO-220FMPF40N25Tube
ABSOLUTE RATINGS
ParameterRatingUnitsTC = 25C, unless otherwise specified
VDSS250V
ID40AContinuous Drain Current
ID26AContinuous Drain Current TC = 100 C
IDM160APulsed Drain Current(Note1)
VGS30V
EAS2000mJSingle Pulse Avalanche Energy(Note2)
dv/dt5.0V/nsPeak Diode Recovery dv/dt(Note3)
PD310WPower Dissipation
Derating Factor above 25C2.78W/
TJ, Tstg55 to 150Operating Junction and Storage Temperature Range
TL300Maximum Temperature for Soldering
Thermal characteristics
SymbolParameterRATINGSUnitsTO-220F
RJCJunction-to-Case0.36/W
RJAJunction-to-Ambient62.5/W
Electrical Characteristics
SymbolParameterTest ConditionsValues (Min. Typ. Max.)Units
OFF Characteristics
VDSSDrain to Source Breakdown VoltageVGS=0V, ID=250A250 -- --V
BVDSS/ TJBvdss Temperature CoefficientID=250uA, Reference25-- 0.18 --V/
IDSSDrain to Source Leakage CurrentVDS =250V, VGS= 0V, Tj = 25-- -- 1A
IDSSDrain to Source Leakage CurrentVDS =200V, VGS= 0V, Tj= 125-- -- 10A
IGSS(F)Gate to Source Forward LeakageVGS =+30V-- -- 100nA
IGSS(R)Gate to Source Reverse LeakageVGS =-30V-- -- -100nA
ON Characteristics
RDS(ON)Drain-to-Source On- ResistanceVGS=10V, ID=20A(Note4)-- 0.065 0.08
VGS(TH)Gate Threshold VoltageVDS = VGS, ID= 250A(Note4)2.0 -- 4.0V
gfsForward TransconductanceVDS=40V, ID=20A(Note4)-- 27 --S
Dynamic Characteristics
RgGate resistancef = 1.0MHz-- 1.8 --
CissInput CapacitanceVGS = 0V VDS = 25V f = 1.0MHz-- 3700 --PF
CossOutput Capacitance-- 360 --PF
CrssReverse Transfer Capacitance-- 2.5 --PF
Switching Characteristics
td(ON)Turn-on Delay TimeID=40A VDD= 125V VGS= 10V RG =15-- 80 --ns
trRise Time-- 620 --ns
td(OFF)Turn-Off Delay Time-- 140 --ns
tfFall Time-- 183 --ns
QgTotal Gate ChargeID=40A VDD=200V VGS = 10V-- 40 --nC
QgsGate to Source Charge-- 14 --nC
QgdGate to Drain (Miller)Charge-- 11 --nC
Source-Drain Diode Characteristics
ISContinuous Source Current (Body Diode)TC=25 C-- -- 40A
ISMMaximum Pulsed Current (Body Diode)-- -- 160A
VSDDiode Forward VoltageIS=40A, VGS=0V(Note4)-- -- 1.2V
TrrReverse Recovery TimeIS=40A, Tj = 25C dIF/dt=100A/us,-- 230 --ns
QrrReverse Recovery Charge-- 2150 --nC
Notes
Note1: Pulse width limited by maximum junction temperature
Note2: L=10mH, VDs=50V, Start TJ=25
Note3: ISD =40A,di/dt 100A/us,VDDBVDS, Start TJ=25
Note4: Pulse width tp300s, 2%
TO-220F Package Dimensions
ItemsValues(mm)MINMAX
A9.6010.4
B15.416.2
B18.909.50
C4.304.90
C12.103.00
D2.403.00
E0.601.00
F0.300.60
G1.121.42
H3.403.80
I1.602.90
L12.014.0
N2.342.74
Q3.153.55

2411220027_Minos-MPF40N25_C6719391.pdf

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