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quality Low Frequency Power Amplifier NH S8050-H NPN Transistor for Small Motor Driver Stage in SOT23 Package factory
quality Low Frequency Power Amplifier NH S8050-H NPN Transistor for Small Motor Driver Stage in SOT23 Package factory

Low Frequency Power Amplifier NH S8050-H NPN Transistor for Small Motor Driver Stage in SOT23 Package

Key Attributes
Model Number: S8050-H
Product Custom Attributes
Emitter-Base Voltage(Vebo):
5V
Current - Collector Cutoff:
100nA
Pd - Power Dissipation:
225mW
Transition Frequency(fT):
120MHz
Type:
NPN
Current - Collector(Ic):
500mA
Collector - Emitter Voltage VCEO:
40V
Mfr. Part #:
S8050-H
Package:
SOT-23
Product Description

Product Overview

The S8050-H is an NPN low frequency power amplifier from Niuhang Specification Electronic Co. Ltd. It is suitable for the driver stage of small motors and is available in a SOT-23 package. The device has a UL 94V-0 epoxy rating and can be mounted in any position.

Product Attributes

  • Brand: Niuhang
  • Origin: China (implied by company name)
  • Material: Epoxy (UL: 94V-0)
  • Certifications: UL 94V-0

Technical Specifications

SymbolCharacteristicTest ConditionMin.Typ.Max.Unit
VOLTAGE:Collector-Emitter Voltage25Volts
Collector-Base Voltage40Volts
Emitter-Base Voltage5Volts
Collector Cutoff CurrentVCB=30V,IE=00.1A
CURRENT:Collector Current0.5Ampers
Emitter Cutoff CurrentVEB=5V,IC=00.1A
DC Current GainIC=10mA,IB=1A100
Transition FrequencyVCB=10V,IE=0 ,f=1MHz40MHz
ELECTRICAL CHARACTERISTICSCollector-Emitter Breakdown VoltageIC=10mA,IB=0120V
Collector-Base Breakdown VoltageIC=100uA,IE=040V
SATURATION VOLTAGE:Collector-Emitter Saturation VoltageVCE=1V,IC=0.5A0.6V
Base-Emitter Saturation VoltageIC=0.5A,IB=100mA0.8V
THERMAL CHARACTERISTICSTypical thermal resistance556/W

Mechanical Data

SymbolParameterMin.Typ.Max.Unit
TJJunction Temperature150
TSTGStorage Temperature Range-55150
PCCollector Power Dissipation225mW

Outline Dimensions

Dim.MillimetersInches
A2.800 - 3.0400.1102 - 0.1197
B1.200 - 1.4000.0472 - 0.0551
C0.890 - 1.1100.0350 - 0.0437
D0.370 - 0.5000.0146 - 0.0197
G1.780 - 2.0400.0701 - 0.0803
H0.013 - 0.1000.0005 - 0.0039
J0.085 - 0.1770.0033 - 0.0070
K0.350 - 0.6900.0138 - 0.0272
L0.890 - 1.0200.0350 - 0.0402
S2.100 - 2.6400.0827 - 0.1039
V0.450 - 0.6000.0177 - 0.0236

Recommended Mounting Pad Dimensions

Dim.MillimetersInches
A- 0.600- 0.0236
B- 0.800- 0.0315
C- 2.020- 0.0795
D- 1.900- 0.0748

Packing Information

Package MethodReel Size (mm)Quantity (pcs/reel)Inner Box Size LWH(mm)Quantity (pcs/Inner Box)Carton Size LWH(mm)Quantity (pcs/carton)
Tape Reel 1803000340340406000364364360160000

Recommended Temperature Profile for IR Reflow

Profile featureSn-Pb eutectic AssemblyPb-free Assembly
Average ramp-up rate (Tsmax to Tp)3C/second max.3C/second max.
Preheat Temperature Min(TS min)100C150C
Temperature Max(TS max)150C200C
Time(ts min to ts max)60-120 seconds60-180 seconds
Time maintained above: Temperature (TL)183C217C
Time (tL)60-150 seconds60-150 seconds
Ramp down rate6C/second max.6C/second max.
Time 25 C to peak temperature6 minutes max.8 minutes max.
Peak Temperature(TP)240 +0/-5 C260 +0/-5 C
Time within 5C of actual peak temperature(tp)10-30 seconds20-40 seconds

Recommended Wave Soldering Condition

ProductPeak TemperatureSoldering Time
Pb-free devices260 +0/-5 C5 +1/-1 seconds

2410121747_NH-S8050-H_C7427904.pdf

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