power dissipation and switching controllability in onsemi FGY100T120RWD for demanding industrial uses

Key Attributes
Model Number: FGY100T120RWD
Product Custom Attributes
Pd - Power Dissipation:
1.071kW
Td(off):
364ns
Td(on):
80ns
Collector-Emitter Breakdown Voltage (Vces):
1.2kV
Reverse Transfer Capacitance (Cres):
44.2pF
IGBT Type:
FS (Field Stop)
Gate-Emitter Threshold Voltage (Vge(th)@Ic):
4.9V@100mA
Gate Charge(Qg):
427nC@15V
Reverse Recovery Time(trr):
256ns
Switching Energy(Eoff):
7.05mJ
Turn-On Energy (Eon):
8.13mJ
Input Capacitance(Cies):
12.2nF
Pulsed Current- Forward(Ifm):
300A
Output Capacitance(Coes):
392pF
Mfr. Part #:
FGY100T120RWD
Package:
TO-247-3
Product Description

Product Description

Utilizing the novel field stop 7th generation IGBT technology and the Gen7 Diode in a TO247 3-lead package, the FGY100T120RWD offers optimal performance with low conduction losses and good switching controllability for high-efficiency operation in various applications. Its advantages include low conduction loss, optimized switching, high current capability, and suitability for parallel operation due to a positive temperature coefficient. It is designed for demanding applications such as motor control, UPS, data center power supplies, and high-power switching.

Product Attributes

  • Brand: onsemi
  • Certifications: RoHS Compliant
  • Package: TO247-3LD

Technical Specifications

ParameterSymbolValueUnitNotes
MAXIMUM RATINGS
Collector-to-Emitter VoltageVCES1200V
Gate-to-Emitter VoltageVGES20Transient 30 V
Collector CurrentIC100ATC = 100C
Power DissipationPD535WTC = 100C
Pulsed Collector CurrentICM300ATC = 25C, tp = 10 s
Diode Forward CurrentIF100ATC = 100C
Pulsed Diode Forward CurrentIFM300ATC = 25C, tp = 10 s
Short Circuit Withstand TimetSC5sVGE = 15 V, VCC = 600 V, TC = 150C
Operating Junction and Storage Temperature RangeTJ, TSTG-55 to 175C
Lead Temperature for Soldering PurposesTL260C
THERMAL CHARACTERISTICS
Thermal Resistance, Junction-to-Case for IGBTR JC0.14C/W
Thermal Resistance, Junction-to-Case for Diode0.23C/W
Thermal Resistance, Junction-to-AmbientR JA40C/W
ELECTRICAL CHARACTERISTICS OF THE IGBT
Collector-to-Emitter Breakdown VoltageBVCES1200VVGE = 0 V, IC = 5 mA
Collector-to-Emitter Cut-Off CurrentICES40AVGE = 0 V, VCE = VCES
Gate-to-Emitter Leakage CurrentIGES400nAVGE = 20 V, VCE = 0 V
Gate-to-Emitter Threshold VoltageVGE(TH)5.92VVGE = VCE, IC = 100 mA (Typ)
Collector-to-Emitter Saturation VoltageVCE(SAT)1.43VVGE = 15 V, IC = 100 A, TJ = 25C (Typ)
Collector-to-Emitter Saturation VoltageVCE(SAT)1.66VVGE = 15 V, IC = 100 A, TJ = 175C (Typ)
Input CapacitanceCies12200pFVCE = 30 V, VGE = 0 V, f = 1 MHz (Typ)
Output CapacitanceCoes392pF(Typ)
Reverse Transfer CapacitanceCres44.2pF(Typ)
Total Gate ChargeQg427nCVCE = 600 V, VGE = 15 V, IC = 100 A (Typ)
SWITCHING CHARACTERISTIC, INDUCTIVE LOAD (IGBT)
Turn-On Delay Timetd(on)74nsVCE = 600 V, VGE = 15 V, IC = 50 A, RG = 4.7 , TJ = 25C (Typ)
Turn-Off Delay Timetd(off)464nsVCE = 600 V, VGE = 15 V, IC = 50 A, RG = 4.7 , TJ = 25C (Typ)
Rise Timetr45nsVCE = 600 V, VGE = 15 V, IC = 50 A, RG = 4.7 , TJ = 25C (Typ)
Fall Timetf196nsVCE = 600 V, VGE = 15 V, IC = 50 A, RG = 4.7 , TJ = 25C (Typ)
Turn-On Switching LossEon3.43mJVCE = 600 V, VGE = 15 V, IC = 50 A, RG = 4.7 , TJ = 25C (Typ)
Turn-Off Switching LossEoff4.54mJVCE = 600 V, VGE = 15 V, IC = 50 A, RG = 4.7 , TJ = 25C (Typ)
Total Switching LossEts7.97mJVCE = 600 V, VGE = 15 V, IC = 50 A, RG = 4.7 , TJ = 25C (Typ)
DIODE CHARACTERISTIC
Diode Forward VoltageVF1.80VIF = 100 A, TJ = 25C (Typ)
Diode Forward VoltageVF1.90VIF = 100 A, TJ = 175C (Typ)
DIODE SWITCHING CHARACTERISTIC, INDUCTIVE LOAD
Reverse Recovery Timetrr256nsVR = 600 V, IF = 50 A, dIF/dt = 500 A/s, TJ = 25C (Typ)
Reverse Recovery ChargeQrr3140nCVR = 600 V, IF = 50 A, dIF/dt = 500 A/s, TJ = 25C (Typ)
Reverse Recovery EnergyErec1mJVR = 600 V, IF = 50 A, dIF/dt = 500 A/s, TJ = 25C (Typ)
Peak Reverse Recovery CurrentIRRM24.5AVR = 600 V, IF = 50 A, dIF/dt = 500 A/s, TJ = 25C (Typ)

2410121837_onsemi-FGY100T120RWD_C20047183.pdf

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