S1M075120H2 Silicon Carbide MOSFET for Booster Converters Switch Mode Power Supplies and EV Chargers

Key Attributes
Model Number: S1M075120H2
Product Custom Attributes
Drain To Source Voltage:
1.2kV
Current - Continuous Drain(Id):
44A
RDS(on):
60mΩ@18V
Operating Temperature -:
-55℃~+175℃
Gate Threshold Voltage (Vgs(th)):
2.8V
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
3.8pF
Input Capacitance(Ciss):
1.037nF
Pd - Power Dissipation:
224W
Gate Charge(Qg):
40nC
Mfr. Part #:
S1M075120H2
Package:
TO-247-4L
Product Description

Product Overview

The S1M075120H2 is a 1200V Silicon Carbide (SiC) Power MOSFET from Qingchun Semiconductor (Ningbo) Co., Ltd. Designed for high-speed switching applications, it offers very low switching losses, IGBT-compatible driving voltage, and fully controllable dv/dt. This MOSFET features high blocking voltage with low on-resistance and a fast intrinsic diode with low reverse recovery. Its benefits include reduced cooling effort and requirements, efficiency improvement, increased power density, and the ability to increase system switching frequency. It is suitable for applications such as on-board chargers/PFC, EV battery chargers, booster/DC-DC converters, and switch mode power supplies.

Product Attributes

  • Brand: Qingchun Semiconductor (Ningbo) Co., Ltd.
  • Material: Silicon Carbide (SiC)
  • Channel Type: N Channel Enhancement
  • Package: TO-247-4L
  • Compliance: Halogen free, RoHS compliant

Technical Specifications

Model VDS IDS (TC = 25, Rth (j-c,max)) RDS(ON), typ (VGS = 15V, ID = 20A, TJ = 25) Tj,max Package
S1M075120H2 1200 V 44 A 75 m 175 TO247-4L

Key Performance and Ratings

Symbol Parameter Value Unit Test Conditions Note
VDS,max Drain source voltage 1200 V VGS = 0V, ID = 100A
VGS,max Gate source voltage -8 /+22 V Absolute maximum values Note1
VGSop Gate source voltage -4 /+15 V Recommended operational values
ID Continuous drain current 44 A VGS = 15V, TC = 25C Fig.19
ID Continuous drain current 31 A VGS = 15V, TC = 100C
ID(pulse) Pulsed drain current 88 A Pulse width tP limited by Tj,max Fig.22
PD Power dissipation 224 W TC= 25C, TJ = 175C Fig.20
TJ ,Tstg Operating Junction and storage temperature -55 to +175 C
TL Soldering temperature 260 C 1.6mm (0.063) from case for 10s
Rth(j-c) Thermal resistance from junction to case 0.7 C/W Fig.21
V(BR)DSS Drain-source breakdown voltage 1200 V VGS = 0V, ID = 100A
VGS(th) Gate threshold voltage 2.3 / 2.8 / 3.6 V VDS = VGS, ID = 5mA Fig.11
VGS(th) Gate threshold voltage 2.1 V VDS = VGS, ID = 5mA, TJ = 175C
IDSS Zero gate voltage drain current 1 A VDS = 1200V, VGS = 0V
IGSS Gate source leakage current 100 nA VGS = 15V, VDS = 0V
RDS(on) Current drain-source on-state resistance 75 m VGS = 15V, ID = 20A Fig.4,5,6
RDS(on) Current drain-source on-state resistance 110 m VGS = 15V, ID = 20A, TJ = 175C
Ciss Input capacitance 1037 pF VDS = 1000V, VGS = 0V TJ = 25C, VAC = 25mV f = 1MHz Fig.17,18
Coss Output capacitance 65 pF
Crss Reverse capacitance 3.8 pF
Eon Turn on switching energy 112 J VDS = 800V, VGS = -4/+15V ID = 20A, Rg = 0 L = 120uH Fig.26
Eoff Turn off switching energy 25 J
tdon Turn on delay time 8.8 ns Fig.27, 28
tr Rise time 10.5 ns
tdoff Turn off delay time 15 ns
tf Fall time 8.4 ns
VSD Diode forward voltage 3.8 V VGS = -4V, ISD = 10A Fig.8,9, 10
VSD Diode forward voltage 3.5 V VGS = -4V, ISD = 10A TJ = 175C
IS Continuous diode forward current 44 A VGS = -4V, Tc = 25C Note1
trr Reverse recovery time 39 nS VR = 800V, VGS = -4V ID = 20A di/dt = 2436A/S TJ = 150C
Qrr Reverse recovery charge 321 nC
Irrm Peak reverse recovery current 16.5 A
Qgs Gate source charge 8.9 nC VDS = 800V, VGS = -4/+15V ID = 20A Fig.12
Qgd Gate drain charge 25 nC
Qg Gate charge 40 nC

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