Low Gate Charge 100V N Channel MOSFET SP010N07AGTD for Power Switching and High Current Applications

Key Attributes
Model Number: SP010N07AGTD
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
90A
RDS(on):
6.4mΩ@10V;8.4mΩ@4.5V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
1.7V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
12pF
Number:
1 N-channel
Output Capacitance(Coss):
388pF
Input Capacitance(Ciss):
1.942nF
Pd - Power Dissipation:
130W
Gate Charge(Qg):
67nC@10V
Mfr. Part #:
SP010N07AGTD
Package:
TO-263-3L
Product Description

Product Overview

The SP010N07AGTD is a 100V N-Channel Power MOSFET from Siliup Semiconductor Technology Co. Ltd. This device features fast switching, low gate charge, and low RDS(on) thanks to its advanced split gate trench technology. It is designed for power switching applications, battery management, and uninterruptible power supplies. The MOSFET has undergone 100% single pulse avalanche energy testing.

Product Attributes

  • Brand: Siliup Semiconductor Technology Co. Ltd.
  • Product Code: SP010N07AG
  • Package: TO-263
  • Technology: Advanced Split Gate Trench Technology

Technical Specifications

Parameter Symbol Test Condition Min Typ Max Unit
Product Summary
Breakdown Voltage (Drain-Source) V(BR)DSS 100 V
On-Resistance (Typical) RDS(on)TYP @10V 6.4 m
On-Resistance (Typical) RDS(on)TYP @4.5V 8.4 m
Continuous Drain Current ID 90 A
Absolute Maximum Ratings
Drain-Source Voltage VDS (Ta=25unless otherwise noted) 100 V
Gate-Source Voltage VGS (Ta=25unless otherwise noted) 20 V
Continuous Drain Current (Tc=25) ID 90 A
Continuous Drain Current (Tc=100) ID 60 A
Pulsed Drain Current IDM 360 A
Single Pulse Avalanche Energy EAS 1 306 mJ
Power Dissipation (Tc=25) PD 130 W
Thermal Resistance Junction-to-Case RJC 0.96 /W
Storage Temperature Range TSTG -55 150
Operating Junction Temperature Range TJ -55 150
Electrical Characteristics
Drain-Source Breakdown Voltage BVDSS ID = 250A, VGS = 0V 100 - - V
Drain Cut-Off Current IDSS VDS = 80V, VGS = 0V - - 1 uA
Gate Leakage Current IGSS VGS = 20V, VDS = 0V - - 100 nA
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250A 1.0 1.7 2.5 V
Drain-Source ON Resistance RDS(ON) VGS = 10V, ID = 30A - 6.4 8 m
Drain-Source ON Resistance RDS(ON) VGS = 4.5V, ID = 25A - 8.4 11.5 m
Input Capacitance Ciss VDS =50V, VGS = 0V, f = 1.0MHz - 1942 - pF
Output Capacitance Coss VDS =50V, VGS = 0V, f = 1.0MHz - 388 - pF
Reverse Transfer Capacitance Crss VDS =50V, VGS = 0V, f = 1.0MHz - 12 - pF
Total Gate Charge Qg VDS=50V , VGS=10V , ID=50A - 67 - nC
Gate-Source Charge Qgs VDS=50V , VGS=10V , ID=50A - 12 - nC
Gate-Drain Charge Qgd VDS=50V , VGS=10V , ID=50A - 21 - nC
Turn-On Delay Time td(on) VGS = 10V, VDS =50V, ID=50A RG = 4.7 - 12 - nS
Rise Time tr VGS = 10V, VDS =50V, ID=50A RG = 4.7 - 11 - nS
Turn-Off Delay Time td(off) VGS = 10V, VDS =50V, ID=50A RG = 4.7 - 42 - nS
Fall Time tf VGS = 10V, VDS =50V, ID=50A RG = 4.7 - 6 - nS
Source-Drain Diode Forward Voltage VSD VGS=0V , IS=1A , TJ=25 - - 1.2 V
Maximum Body-Diode Continuous Current IS - - 90 A
Reverse Recovery Time Trr IS=20A, di/dt=100A/us, TJ=25 - 59 - nS
Reverse Recovery Charge Qrr IS=20A, di/dt=100A/us, TJ=25 - 88 - nC

Package Information (TO-263)

Symbol Dimensions In Millimeters Dimensions In Inches
Min. Max. Min. Max.
A 4.470 4.670 0.176 0.184
A1 0.000 0.150 0.000 0.006
B 1.120 1.420 0.044 0.056
b 0.710 0.910 0.028 0.036
b1 1.170 1.370 0.046 0.054
c 0.310 0.530 0.012 0.021
c1 1.170 1.370 0.046 0.054
D 10.010 10.310 0.394 0.406
E 8.500 8.900 0.335 0.350
e 2.540 TYP. 0.100 TYP.
e1 4.980 5.180 0.196 0.204
L 14.940 15.500 0.588 0.610
L1 4.950 5.450 0.195 0.215
L2 2.340 2.740 0.092 0.108
L3 1.300 1.700 0.051 0.067
0 8 0 8
V 5.600 REF. 0.220 REF.

Note: 1. The EAS test condition is VDD=50V,VGS=10V,L=0.5mH,RG=25

Marking: 010N07AG : Product code, ** : Week code

Order Information: Device: SP010N07AGTD, Package: TO-263, Unit/Tape: 800


2504101957_Siliup-SP010N07AGTD_C22466793.pdf

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