3A 60V Trench Schottky Rectifier Taiwan Semiconductor TSSA3U60 R3G for High Frequency Power Supplies

Key Attributes
Model Number: TSSA3U60 R3G
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
60A
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - DC Reverse (Vr) (Max):
60V
Diode Configuration:
1 Independent
Reverse Leakage Current (Ir):
500uA@60V
Voltage - Forward(Vf@If):
480mV@3A
Current - Rectified:
3A
Mfr. Part #:
TSSA3U60 R3G
Package:
SMA(DO-214AC)
Product Description

Product Overview

The TSSA3U60 is a 3A, 60V Trench Schottky Rectifier from Taiwan Semiconductor, featuring patented Trench Schottky technology for high surge current capability and ideal suitability for automated placement. It is designed for high-frequency miniature switched-mode power supplies, such as adapters and lighting applications. The device is compliant to RoHS directive 2011/65/EU, WEEE 2002/96/EC, and is halogen-free according to IEC 61249-2-21.

Product Attributes

  • Brand: Taiwan Semiconductor
  • Model: TSSA3U60
  • Technology: Trench Schottky
  • Certifications: RoHS, WEEE, IEC 61249-2-21 (Halogen-free), UL 94V-0 flammability rating
  • Package: DO-214AC (SMA)
  • Material: Molding compound, Matte tin plated leads
  • Color: Green compound (suffix "G")
  • Qualification: AEC-Q101 qualified (suffix H)

Technical Specifications

ParameterSymbolValueUnitConditions
Average Forward CurrentIF(AV)3A
Repetitive Peak Reverse VoltageVRRM60V
Surge Peak Forward CurrentIFSM60A8.3 ms single half sine-wave
Junction Temperature MaxTJ MAX150C
Forward VoltageVF0.48 / 0.54VIF = 3A, TJ = 25C
Forward VoltageVF0.41 / 0.50VIF = 3A, TJ = 125C
Reverse CurrentIR500 / 12 / 30A / mATJ = 25C / TJ = 125C
Junction CapacitanceCT450 / 610pF1 MHz, VR=4.0V
Reverse Recovery Timetrr20 / 25nsIF=0.5A, IR=1.0A, IRR=0.25A
Junction to Lead Thermal ResistanceRJL27C/WUnits mounted on recommended PCB (5mm x 5mm Cu pad test board)
Junction to Ambient Thermal ResistanceRJA70C/WUnits mounted on recommended PCB (5mm x 5mm Cu pad test board)
Junction to Case Thermal ResistanceRJC20C/WUnits mounted on recommended PCB (5mm x 5mm Cu pad test board)
Storage TemperatureTSTG-55 to +150C

2005222145_Taiwan-Semiconductor-TSSA3U60-R3G_C557551.pdf

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