Power MOSFET ASA60R090EFDA designed for application servers and solar inverter power supply circuits

Key Attributes
Model Number: ASA60R090EFDA
Product Custom Attributes
Drain To Source Voltage:
650V
Current - Continuous Drain(Id):
47A
Operating Temperature -:
-55℃~+150℃
RDS(on):
90mΩ@10V,20A
Gate Threshold Voltage (Vgs(th)):
5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
10.7pF
Number:
1 N-channel
Output Capacitance(Coss):
298.1pF
Input Capacitance(Ciss):
3.291nF
Pd - Power Dissipation:
191W
Gate Charge(Qg):
65.32nC@10V
Mfr. Part #:
ASA60R090EFDA
Package:
TO-220F
Product Description

Product Overview

The ASA60R090EFDA and ASW60R090EFDA are N-Channel Silicon MOSFETs designed for soft switching applications. They are ideal for use as Boost PFC switches and in Half bridge, Asymmetric half bridge, Series resonance half bridge, and Full bridge topologies, including phase-shift-bridge (ZVS) and LLC configurations. These MOSFETs are well-suited for power supplies in Application Servers, Telecom, EV Charging, and Solar Inverters, offering low drain-source on-resistance (RDS(ON) = 0.080 typ.) and easy gate control with enhancement mode operation (Vth = 3 to 5V).

Product Attributes

  • Brand: Not specified
  • Origin: Not specified
  • Material: Silicon N-Channel MOS
  • Color: Not specified
  • Certifications: Not specified

Technical Specifications

Model Package Marking
ASA60R090EFDA TO220F ASA60R090EFDA
ASW60R090EFDA TO247-3L ASW60R090EFDA
Parameter Symbol Value Unit Note / Test Condition
Drain-source breakdown voltage V(BR)DSS 605 V VGS=0V, ID=250uA
Gate threshold voltage V(GS)th 3 - 5 V VDS=VGS, ID=250uA
Zero gate voltage drain current IDSS - 5 uA VDS=600V, VGS=0V, Tj=25C
Gate-source leakage current IGSS - 100 nA VGS=30V, VDS=0V
Drain-source on-state resistance RDS(on) 0.080 - 0.090 VGS=10V, ID=20A, Tj=25C
Gate resistance (Intrinsic) RG - 0.9 - f=1MHz, open drain
Continuous drain current ID - 47 A TC=25C, Limited by Tj,max. Maximum Duty Cycle D = 0.50
Pulsed drain current ID,pulse - 141 A TC=25C, Pulse width tp limited by Tj,max
Avalanche energy, single pulse EAS - 885 mJ Tc=25, VDD=50V, L=10mH, RG=25
MOSFET dv/dt ruggedness dv/dt - 59 V/ns VDS=0...400V
Gate source voltage (static) VGS -20 - 20 V static
Gate source voltage (dynamic) VGS -30 - 30 V AC (f>1 Hz)
Power dissipation Ptot - 191 W TC=25C
Storage temperature Tstg -55 - 150 C
Operating junction temperature Tj -55 - 150 C
Soldering Temperature TL 260 C Distance of 1.6mm from case for 10s
Reverse diode dv/dt dv/dt - 50 V/ns VDS=0...400V, ISD<=48A, Tj=25C
Diode forward voltage VSD - 0.66 V VGS=0V, IF=1A, Tj=25C
Reverse recovery time trr - 147.8 ns Vr=400v,IF=9.6A,di/dt=100A/us
Reverse recovery charge Qrr - 0.96 uC Vr=400v,IF=9.6A,di/dt=100A/us
Peak reverse recovery current Irrm - 12.27 A Vr=400v,IF=9.6A,di/dt=100A/us
Input capacitance Ciss - 3291 pF VGS=0V, VDS=50V, f=10kHz
Output capacitance Coss - 298.1 pF VGS=0V, VDS=50V, f=10kHz
Reverse transfer capacitance Crss - 10.7 pF VGS=0V, VDS=50V, f=10kHz
Turn-on delay time td(on) - 12.1 ns VDD=400V,VGS=13V,ID=25.8A RG=1.7
Rise time tr - 4.4 ns VDD=400V,VGS=13V,ID=25.8A RG=1.7
Turn-off delay time td(off) - 39.1 ns VDD=400V,VGS=13V,ID=25.8A RG=1.7
Fall time tf - 4.3 ns VDD=400V,VGS=13V,ID=25.8A RG=1.7
Gate to source charge Qgs - 18.16 nC VDD=400V, ID=25.8A, VGS=0 to 10V
Gate to drain charge Qgd - 22.93 nC VDD=400V, ID=25.8A, VGS=0 to 10V
Gate charge total Qg - 65.32 nC VDD=400V, ID=25.8A, VGS=0 to 10V
Gate plateau voltage Vplateau - 5.98 V VDD=400V, ID=25.8A, VGS=0 to 10V
Thermal resistance, junction - case (TO220F) RthJC - 3.65 C/W
Thermal resistance, junction - ambient (TO220F) RthJA - 80 C/W device on PCB, minimal footprint
Thermal resistance, junction - case (TO247) RthJC - 0.65 C/W
Thermal resistance, junction - ambient (TO247) RthJA - 62 C/W device on PCB, minimal footprint

2411220408_ANHI-ASA60R090EFDA_C18722996.pdf

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