Power MOSFET ASA60R090EFDA designed for application servers and solar inverter power supply circuits
Product Overview
The ASA60R090EFDA and ASW60R090EFDA are N-Channel Silicon MOSFETs designed for soft switching applications. They are ideal for use as Boost PFC switches and in Half bridge, Asymmetric half bridge, Series resonance half bridge, and Full bridge topologies, including phase-shift-bridge (ZVS) and LLC configurations. These MOSFETs are well-suited for power supplies in Application Servers, Telecom, EV Charging, and Solar Inverters, offering low drain-source on-resistance (RDS(ON) = 0.080 typ.) and easy gate control with enhancement mode operation (Vth = 3 to 5V).
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Silicon N-Channel MOS
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Model | Package | Marking |
|---|---|---|
| ASA60R090EFDA | TO220F | ASA60R090EFDA |
| ASW60R090EFDA | TO247-3L | ASW60R090EFDA |
| Parameter | Symbol | Value | Unit | Note / Test Condition |
|---|---|---|---|---|
| Drain-source breakdown voltage | V(BR)DSS | 605 | V | VGS=0V, ID=250uA |
| Gate threshold voltage | V(GS)th | 3 - 5 | V | VDS=VGS, ID=250uA |
| Zero gate voltage drain current | IDSS | - 5 | uA | VDS=600V, VGS=0V, Tj=25C |
| Gate-source leakage current | IGSS | - 100 | nA | VGS=30V, VDS=0V |
| Drain-source on-state resistance | RDS(on) | 0.080 - 0.090 | VGS=10V, ID=20A, Tj=25C | |
| Gate resistance (Intrinsic) | RG | - 0.9 - | f=1MHz, open drain | |
| Continuous drain current | ID | - 47 | A | TC=25C, Limited by Tj,max. Maximum Duty Cycle D = 0.50 |
| Pulsed drain current | ID,pulse | - 141 | A | TC=25C, Pulse width tp limited by Tj,max |
| Avalanche energy, single pulse | EAS | - 885 | mJ | Tc=25, VDD=50V, L=10mH, RG=25 |
| MOSFET dv/dt ruggedness | dv/dt | - 59 | V/ns | VDS=0...400V |
| Gate source voltage (static) | VGS | -20 - 20 | V | static |
| Gate source voltage (dynamic) | VGS | -30 - 30 | V | AC (f>1 Hz) |
| Power dissipation | Ptot | - 191 | W | TC=25C |
| Storage temperature | Tstg | -55 - 150 | C | |
| Operating junction temperature | Tj | -55 - 150 | C | |
| Soldering Temperature | TL | 260 | C | Distance of 1.6mm from case for 10s |
| Reverse diode dv/dt | dv/dt | - 50 | V/ns | VDS=0...400V, ISD<=48A, Tj=25C |
| Diode forward voltage | VSD | - 0.66 | V | VGS=0V, IF=1A, Tj=25C |
| Reverse recovery time | trr | - 147.8 | ns | Vr=400v,IF=9.6A,di/dt=100A/us |
| Reverse recovery charge | Qrr | - 0.96 | uC | Vr=400v,IF=9.6A,di/dt=100A/us |
| Peak reverse recovery current | Irrm | - 12.27 | A | Vr=400v,IF=9.6A,di/dt=100A/us |
| Input capacitance | Ciss | - 3291 | pF | VGS=0V, VDS=50V, f=10kHz |
| Output capacitance | Coss | - 298.1 | pF | VGS=0V, VDS=50V, f=10kHz |
| Reverse transfer capacitance | Crss | - 10.7 | pF | VGS=0V, VDS=50V, f=10kHz |
| Turn-on delay time | td(on) | - 12.1 | ns | VDD=400V,VGS=13V,ID=25.8A RG=1.7 |
| Rise time | tr | - 4.4 | ns | VDD=400V,VGS=13V,ID=25.8A RG=1.7 |
| Turn-off delay time | td(off) | - 39.1 | ns | VDD=400V,VGS=13V,ID=25.8A RG=1.7 |
| Fall time | tf | - 4.3 | ns | VDD=400V,VGS=13V,ID=25.8A RG=1.7 |
| Gate to source charge | Qgs | - 18.16 | nC | VDD=400V, ID=25.8A, VGS=0 to 10V |
| Gate to drain charge | Qgd | - 22.93 | nC | VDD=400V, ID=25.8A, VGS=0 to 10V |
| Gate charge total | Qg | - 65.32 | nC | VDD=400V, ID=25.8A, VGS=0 to 10V |
| Gate plateau voltage | Vplateau | - 5.98 | V | VDD=400V, ID=25.8A, VGS=0 to 10V |
| Thermal resistance, junction - case (TO220F) | RthJC | - 3.65 | C/W | |
| Thermal resistance, junction - ambient (TO220F) | RthJA | - 80 | C/W | device on PCB, minimal footprint |
| Thermal resistance, junction - case (TO247) | RthJC | - 0.65 | C/W | |
| Thermal resistance, junction - ambient (TO247) | RthJA | - 62 | C/W | device on PCB, minimal footprint |
2411220408_ANHI-ASA60R090EFDA_C18722996.pdf
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