100V N Channel Enhancement Mode MOSFET A Power microelectronics APG110N10NF with low gate charge and RDS

Key Attributes
Model Number: APG110N10NF
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
110A
RDS(on):
9mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
20pF@50V
Number:
1 N-channel
Pd - Power Dissipation:
113.6W
Input Capacitance(Ciss):
4.4nF@50V
Gate Charge(Qg):
75nC@10V
Mfr. Part #:
APG110N10NF
Package:
DFN-8(5x6)
Product Description

Product Overview

The APG110N10NF is a 100V N-Channel Enhancement Mode MOSFET from APM Microelectronics, utilizing advanced APM-SGT technology. It offers excellent RDS(ON), low gate charge, and can operate with gate voltages as low as 4.5V. This device is well-suited for battery protection and other switching applications, including DC/DC converters and LED backlighting.

Product Attributes

  • Brand: APM Microelectronics ()
  • Technology: APM-SGT
  • Mode: N-Channel Enhancement Mode
  • Package Type: PDFN5*6-8L

Technical Specifications

Symbol Parameter Test Conditions Min. Typ. Max. Unit
General Features
VDS Drain source voltage 100 V
ID Continuous drain current, TC=25 110 A
RDS(ON) Drain-Source on-Resistance VGS=10V 4.2 6 m
RDS(ON) Drain-Source on-Resistance VGS=4.5V 6.6 9 m
Absolute Maximum Ratings
VDS Drain source voltage (TC=25unless otherwise noted) 100 V
VGS Gate source voltage 20 V
ID Continuous drain current, TC=25 110 A
IDM Pulsed drain current, TC=25 380 A
PD Power dissipation, TC=25 113.6 W
EAS Single pulsed avalanche energy 205 mJ
TstgTj Operation and storage temperature -55 150
RJC Thermal resistance, junction-case 1.1 C/W
RJA Thermal resistance, junction-ambient 58 C/W
Electrical Characteristics
VDSS Drain-Source Breakdown Voltage VGS = 0V, ID = 250A 100 - - V
lGSS Gate-body Leakage current VDS = 0V, VGS = 20V - - 100 nA
IDSS Zero Gate Voltage Drain Current TJ=25C VDS =100V, VGS = 0V - - 1 A
IDSS Zero Gate Voltage Drain Current TJ=100C - - 100 A
VGS(th) Gate-Threshold Voltage VDS = VGS, ID = 250A 1.2 1.8 2.5 V
RDS(on) Drain-Source on-Resistance VGS = 10V, ID = 20A - 4.2 6 m
RDS(on) Drain-Source on-Resistance VGS = 4.5V, ID = 15A - 6.6 9 m
Ciss Input Capacitance VDS = 50V, VGS =0V, f =1MHz - 4400 - pF
Coss Output Capacitance - 645 - pF
Crss Reverse Transfer Capacitance - 20 - pF
Rg Gate Resistance VGS = 0V, VDS = 0V, f =1MHz - 1.7 -
Qg Total Gate Charge VGS = 10V, VDS = 50V, ID=20A - 75 - nC
Qgs Gate-Source Charge - 17 - nC
Qgd Gate-Drain Charge - 13 - nC
td(on) Turn-on Delay Time VGS =10V, VDS =50V, RG = 3, ID= 20A - 15.4 - ns
tr Rise Time - 13 - ns
td(off) Turn-off Delay Time - 34 - ns
tf Fall Time - 6.2 - ns
VSD Diode Forward Voltage IF = 20A, VGS = 0V - - 1.2 V
IS Continuous Source Current VG=VD=0V , Force Current - - 95 A
trr Body Diode Reverse Recovery Time IF = 20A, dI/dt=100A/s - - 55 ns
Qrr Body Diode Reverse Recovery Charge - - 101 nC
Package Mechanical Data
Symbol Description Min. Max. Min. Max. Unit
A 1.03 1.17 0.0406 0.0461 mm / Inch
b 0.34 0.48 0.0134 0.0189 mm / Inch
c 0.824 0.0970 0.0324 0.082 mm / Inch
D 4.80 5.40 0.1890 0.2126 mm / Inch
D1 4.11 4.31 0.1618 0.1697 mm / Inch
D2 4.80 5.00 0.1890 0.1969 mm / Inch
E 5.95 6.15 0.2343 0.2421 mm / Inch
E1 5.65 5.85 0.2224 0.2303 mm / Inch
E2 1.60 / 0.0630 / mm / Inch
e BSC 1.27 0.05 BSC
L 0.05 0.25 0.0020 0.0098 mm / Inch
L1 0.38 0.50 0.0150 0.0197 mm / Inch
L2 0.38 0.50 0.0150 0.0197 mm / Inch
H 3.30 3.50 0.1299 0.1378 mm / Inch
I / 0.18 / 0.0070 mm / Inch

Product Identification & Ordering

Product ID Pack Marking Qty(PCS)
APG110N10NF APG110N10NF XXX YYYY 5000

2410121532_A-Power-microelectronics-APG110N10NF_C3011382.pdf

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